16-Kbit serial I²C bus EEPROM - st.com

1 This is information on a product in full production. October 2017 DocID023494 Rev 91/42M24C16-W M24C16-R M24C16-F16-Kbit serial I C bus EEPROM Datasheet - production data PDIP8 (BN)TSSOP8 (DW)169 mil widthUFDFPN8 (MC)DFN8 - 2x3 mmSO8 (MN)150 mil widthUFDFPN5 (MH)Unsawn waferDFN5 - mmFeatures Compatible with all I2C bus modes: 400 kHz 100 kHz Memory array: 16 Kbit (2 Kbyte) of EEPROM Page size: 16 byte Single supply voltage: M24C16-W: V to V M24C16-R: V to V M24C16-F: V to V (full temperature range) and V to V (limited temperature range) Write.

2 Byte Write within 5 ms Page Write within 5 ms Operating temperature range: from -40 C up to +85 C Random and sequential Read modes Write protect of the whole memory array Enhanced ESD/Latch-Up protection More than 4 million Write cycles More than 200-years data retentionPackages PDIP8 ECOPACK2 SO8 ECOPACK2 TSSOP8 ECOPACK2 UFDFPN8 ECOPACK2 UFDFPN5 ECOPACK2 Unsawn wafer (each die is tested) M24C16-R M24C16-F2/42 DocID023494 Rev 9 Contents1 Description .. 62 Signal description .. Clock (SCL) .. Data (SDA) .. Control (WC).

3 (ground) .. voltage (VCC) .. supply voltage (VCC) .. conditions .. reset .. conditions .. 93 Memory organization .. 104 Device operation .. condition .. condition .. input .. bit (ACK) .. addressing .. 135 Instructions .. operations .. Write .. Write .. Write delays by polling on ACK .. operations .. Address Read .. Address Read .. Read .. 196 Initial delivery state .. 20 DocID023494 Rev 93/42M24C16-W M24C16-R M24C16-FContents37 Maximum rating .. 218DC and AC parameters.

4 229 Package information .. (DFN5) package information .. (DFN8) package information .. package information .. package information .. package information .. 3610 Ordering information .. 3711 Revision history .. 40 List of tablesM24C16-W M24C16-R M24C16-F4/42 DocID023494 Rev 9 List of tablesTable names .. 6 Table select code .. 13 Table byte .. 14 Table maximum ratings .. 21 Table conditions (voltage range W) .. 22 Table conditions (voltage range R) .. 22 Table conditions (voltage range F, for devices identified by process letter T).

5 22 Table conditions (voltage range F, for all other devices) .. 22 Table measurement conditions.. 22 Table parameters.. 23 Table performance .. 23 Table cell data retention .. 23 Table characteristics (M24C16-W, device grade 6) .. 24 Table characteristics (M24C16-R device grade 6) .. 25 Table characteristics (M24C16-F device grade 6) .. 26 Table kHz AC characteristics.. 27 Table kHz AC characteristics (I2C Standard mode).. 28 Table - mm, mm thickness, ultra thin fine pitch dual flat package, no lead - package mechanical data.

6 30 Table 2x3 mm, thickness, ultra thin fine pitch dual flat package, no lead - package mechanical data .. 32 Table 3 x mm, mm pitch, 8-lead thin shrink small outline, package mechanical data .. 33 Table mm, 8-lead plastic small outline, 150 mils body width, package mechanical data .. 34 Table 8-pin plastic DIP, mm lead frame, package mechanical data.. 36 Table information scheme .. 37 Table information scheme (unsawn wafer) .. 38 Table revision history .. 40 DocID023494 Rev 95/42M24C16-W M24C16-R M24C16-FList of figures5 List of figuresFigure 1.

7 Logic diagram .. 6 Figure package connections, top view .. 6 Figure (DFN5) package connections .. 7 Figure diagram .. 10 Figure bus protocol .. 11 Figure mode sequences with WC = 0 (data write enabled) .. 15 Figure mode sequences with WC = 1 (data write inhibited) .. 16 Figure cycle polling flowchart using ACK .. 17 Figure mode sequences .. 18 Figure measurement I/O waveform .. 23 Figure Rbus value versus bus parasitic capacitance (Cbus) for an I2C bus at maximum frequency fC = 400 kHz.. 29 Figure waveforms .. 29 Figure mm, mm thickness, ultra thin fine pitch dual flat package, no lead - package outline.

8 30 Figure - 5-lead, mm, mm thickness, ultra thin fine pitch dual flat package, no lead recommended footprint .. 31 Figure 2x3 mm, thickness, ultra thin fine pitch dual flat package, no leadpackage outline .. 32 Figure mm, mm pitch, 8-lead thin shrink small outline, package outline.. 33 Figure mm, 8-lead plastic small outline, 150 mils body width, package outline . 34 Figure mm, 8-lead plastic small outline, 150 mils body width, package recommended footprint .. 35 Figure 8-pin plastic DIP, mm lead frame, package outline.

9 36 DescriptionM24C16-W M24C16-R M24C16-F6/42 DocID023494 Rev 91 DescriptionThe M24C16 is a 16-Kbit I2C-compatible EEPROM (Electrically Erasable PROgrammable Memory) organized as 2 K 8 M24C16-W can be accessed (Read and Write) with a supply voltage from V to V, the M24C16-R can be accessed (Read and Write) with a supply voltage from V to V, and the M24C16-F can be accessed either with a supply voltage from V to V (over the full temperature range) or with an extended supply voltage from V to V. All these devices operate with a clock frequency of 400 1.

10 Logic diagram Figure 2. 8-pin package connections, top view1. NC: Not ConnectedTable 1. Signal namesSignal nameFunctionDirectionSDAS erial DataI/OSCLS erial ClockInputWCWrite ControlInputVCCS upply voltage-VSSG round--3 6 3$!6##- XXX7#3#,633-3 6 3$!6333#,7#.#.#6##.# DocID023494 Rev 97/42M24C16-W M24C16-R M24C16-FDescription41 Figure 3. UFDFPN5 (DFN5) package connections1. See Section 9: Package information for package dimensions, and how to identify pin 1-3 6 3$!3#,7# 6##633633 4OP VIEW MARKING SIDE "OTTOM VIEW PADS SIDE !"#$89:7 Signal descriptionM24C16-W M24C16-R M24C16-F8/42 DocID023494 Rev 92 Signal serial Clock (SCL)The signal applied on the SCL input is used to strobe the data available on SDA(in) and to output the data on SDA(out).