A SUPPLY CURRENT, LOW-DROPOUT LINEAR …

1 Actual Size(2,15 mm x 2,3 mm)1 FEATURESAPPLICATIONSDESCRIPTION3245 DCK PACKAGE(TOP VIEW) SEPTEMBER200850-mA,24-V, ASUPPLYCURRENT,LOW-DROPOUTLINEARREGULATO R Minimum/MaximumSpecifiedCurrentLimit2 ControlledBaseline 5-PinSC70/SOT-323(DCK)Package OneAssemblySite For80-mARatedCurrentandHigherPowerPackag e,SeeTPS715 Axx OneTestSite OneFabricationSite ExtendedTemperaturePerformanceof Ultra-LowPowerMicrocontrollers 55 Cto125 C Cellular/CordlessHandsets EnhancedDiminishingManufacturingSources Portable/Battery-PoweredEquipment(DMS)Su pport EnhancedProduct-ChangeNotification QualificationPedigree(1)TheTPS71501low-d ropout(LDO)voltageregulators 24-VMaximumInputVoltageofferthebenefitso fhighinputvoltage,lowdropout AQuiescentCurrentat50mAvoltage,low-power operation, ,whichoperatesoveraninput StableWithAnyCapacitor( F) ,isstablewithanycapacitor 50-mALow-DropoutRegulator( F).

2 Thelowdropoutvoltageandlow AdjustableOutputVoltage( ) ,thedevicesareidealfor DesignedtoSupportMSP430 , , ,thelow WideVarietyofFixedOutputVoltagedropoutvo ltage,typically415mVat50mAofloadOptionst oMatchVINtotheMinimumcurrent, ( Atypically)isstable(1)Componentqualifica tioninaccordancewithJEDEC andovertheentirerangeofoutputloadcurrent (0mAtoindustrystandardstoensurereliableo perationoveran50mA). ,butisnotlimitedto,HighlyAcceleratedStre ssTest(HAST)orbiased85/85,temperaturecyc le,autoclaveorunbiasedHAST,electromigrat ion,bondintermetalliclife, ,standardwarranty, 2008,TexasInstrumentsIncorporatedProduct sconformtospecificationsperthetermsofthe TexasOnproductscomplianttoMIL-PRF-38535, , (1)TJPACKAGE(2)ORDERABLEPARTNUMBERTOP-SI DEMARKING 55 Cto125 CSC70 DCKR eelof3000 TPS71501 MDCKREPCVP(1)Forthemostcurrentpackageand orderinginformation,seethePackageOptionA ddendumattheendofthisdocument, (2)Packagedrawings,thermaldata, (1)(2)VINI nputvoltagerangeIN 55 Cto150 CTstgStoragetemperaturerange 65 Cto150 CHuman-BodyModel(HBM)2000 VESDE lectrostaticdischargeratingCharged-Devic eModel(CDM)500V(1) , (2) 25 CTA=70 CTA=85 CBOARDPACKAGER JC C/WR JA C/WABOVETA=+25 CPOWERRATINGPOWERRATINGPOWERRATINGLow-K( 1) C250mW140mW100mWHigh-K(2) C320mW175mW130mW(1)

3 TheJEDECLow-K(1s)boarddesignusedtoderive thisdatawasa3-in 3-in,two-layerboardwith2-ozcoppertraceso ntopoftheboard.(2)TheJEDECHigh-K(2s2p)bo arddesignusedtoderivethisdatawasa3-in 3-in, 2008,TexasInstrumentsIncorporatedProduct FolderLink(s) SEPTEMBER2008 Overoperatingjunctiontemperaturerange(TJ = 55 Cto125 C),VIN=VOUT(NOM)+1V,IOUT=1mA,andCOUT=1 F(unlessotherwisenoted).Typicalvaluesare atTJ=25 (1)VINVIO= + VIN 24 VOverVIN,IOUT,andVOUT accuracy(1) + A IOUT 50mA0 IOUT 50mA,TJ= 40 Cto+85 (2)IGND0mA IOUT A0mA IOUT 50mA,VIN= VOUT/ IOUTIOUT=100 Ato50mA22mVOutputvoltage VOUT/ VINVOUT+1V<VIN 24V2075mVlineregulation(1)BW=200 Hzto100kHz,COUT=10 F,OutputnoisevoltageVn575 VrmsIOUT=50mAVOUT=0V,VIN ,VIN< ,COUT=10 F60dBDropoutvoltageVDOIOUT=50mA415750mVV IN=VOUT(NOM) 1V(1)MinimumVIN=VOUT+VDOorthevalueshownf orInputvoltageinthistable,whicheverisgre ater.(2) A,VINisgreaterthan18V,anddietemperaturei sgreaterthan100 2008,TexasInstrumentsIncorporatedSubmitD ocumentationFeedback3 ProductFolderLink(s).

4 TPS71501-EP_+CurrentSenseLeakage NullControl CircuitR1R2V(IN)GNDV(OUT)ILIMB andgapReferenceV= VrefFBTPS71501-EPSGLS396 ,anyoutputcapacitor 2008,TexasInstrumentsIncorporatedProduct FolderLink(s) Output Current mAVIN = VCOUT = 1 FTJ = 25 CVOUT Output Voltage V 40 25 10 520 35 50 65 80 95 110 125TJ Junction Temperature = VCOUT = 1 FIOUT = 50 mAIOUT = 1 mAVOUT Output Voltage 40 25 10 5 20 35 50 65 80 95 110 125TJ Junction Temperature CVIN = VVOUT = VIOUT = 1 FIGND Ground Current A1001 k10 k100 kf Frequency HzIOUT = 1 mAIOUT = 50 mA HzOutput Spectral Noise Density 012345678 VIN = VVOUT = VCOUT = 1 FV/f Frequency Hz Output Impedance Zo 1480122410 VIN = VVOUT = VCOUT = 1 FTJ = 25 CIOUT = 1 mA1001 M101k10k100k10 MIOUT = 50 mA61618010020030040050060001020304050TJ = 125 CTJ = 25 CTJ = 40 CVIN = VCOUT = 1 FIOUT Output Current mA Dropout Voltage Input Voltage V Dropout Voltage VVDOIOUT = 50 mATJ = 25 CTJ = 40 CTJ = 125 Junction

5 Temperature C Dropout Voltage mVVDO 405 2520 3565110 12550 108095 VIN = VIOUT = 50 mAIOUT = 10 mA0100200300400500600f Frequency Hz080501070203060 VIN = VVOUT = VCOUT = 10 FTJ = 25 CIOUT = 1 mA1001 M101k10k100k10 MIOUT = 50 mA4090100 PSRR Power SUPPLY Ripple Rejection 2008,TexasInstrumentsIncorporatedSubmitD ocumentationFeedback5 ProductFolderLink(s):TPS71501-EP18161412 VINVOUTVOUT = VRL = 66 COUT = 10 F876543210t Time ms206410820 VOUT Output Voltage VVIN Input Voltage Vt Time s015010050200 250350300400 450 = VIOUT = 50 mACOUT = 10 50 DVOUT Change inOutput Voltage mVVIN Input Voltage Vt Time ms0300200100400 500700600800 900 10006040200V = VV= VC= 10 FINOUTOUTmD--VChange inOutput Voltage mVOUTIO utput Current mA--OUT0400-200200 TPS71501-EPSGLS396 (continued) 2008,TexasInstrumentsIncorporatedProduct FolderLink(s).

6 TPS71501-EPAPPLICATIONINFORMATIONE xternalCapacitorRequirementsPowerDissipa tionandJunctionTemperaturePD(max)+TJmax* TARqJA(1)PD+ VIN*VOUT IOUT(2) , , Forlargerinputbypasscapacitor,connectedb etweenINandGNDandlocatedclosetothedevice , , (includingceramicandtantalum) ,worst-casejunctiontemperatureshouldnote xceed+125 ,calculatethemaximumallowabledissipation ,PD(max),andtheactualdissipation,PD,whic hmustbelessthanorequaltoPD(max).Themaxim um-power-dissipationlimitisdeterminedusi ngthefollowingequation:where: TJmaxisthemaximumallowablejunctiontemper ature. R JAisthethermalresistancejunction-to-ambi entforthepackage(seetheDissipationRating stable). :ForahigherpowerpackageversionoftheTPS71 5xx, ( ,duringpower-down). , , , 2008,TexasInstrumentsIncorporatedSubmitD ocumentationFeedback7 ProductFolderLink(s):TPS71501-EPProgramm ingtheTPS71501 AdjustableLDOR egulatorVOUT+VREF 1)R1R2 (3)R1+ VOUTVREF*1 R2(4)OUTPUT VOLTAGEPROGRAMMING M M M 1 M 1 M 1 M GNDFBINOUTVINVOUTR1 CFBR2 TPS71501 VOUT+VREF 1)R1R2 FPowertheMSP430 MicrocontrollerTPS71501-EPSGLS396 ,andiscalculatedusing:where: VREF= (theinternalreferencevoltage) , A,andthencalculateR1usingEquation4 (TYP) ,MIN> ,MIN> ,MIN> ,MIN< 2008,TexasInstrumentsIncorporatedProduct FolderLink(s).

7 TPS71501-EPPACKAGE OPTION 1 PACKAGING INFORMATIONO rderable DeviceStatus(1)Package TypePackageDrawingPinsPackageQtyEco Plan(2)Lead finish/Ball material(6)MSL Peak Temp(3)Op Temp ( C)Device Marking(4/5)SamplesTPS71501 MDCKREPACTIVESC70 DCK53000 RoHS & GreenNIPDAUAGL evel-1-260C-UNLIM-55 to 125 CVPV62/08619-01 XEACTIVESC70 DCK53000 RoHS & GreenNIPDAUAGL evel-1-260C-UNLIM-55 to 125 CVP (1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new : TI has announced that the device will be discontinued, and a lifetime-buy period is in : Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new : Device has been announced but is not in production. Samples may or may not be : TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substancedo not exceed by weight in homogeneous materials.

8 Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI mayreference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS : TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide basedflame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses.

9 Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to twolines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.

10 TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual OPTION 2 TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackageTypePackageDrawingPi nsSPQReelDiameter(mm)ReelWidthW1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm) MATERIALS Materials-Page 1*All dimensions are nominalDevicePackage TypePackage DrawingPinsSPQL ength (mm)Width (mm)Height (mm) MATERIALS Materials-Page TYP5X TYP80 ( )( )( )SOT - max heightDCK0005 ASMALL OUTLINE TRANSISTOR4214834/C 03/2023 NOTES: 1.