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Chip Ferrite Bead BLM31 Murata Standard Reference ...

Please consult us in advance for applying other mounting method such as conductive adhesive. 9-1. Land pattern designing • Standard land dimensions (Flow and Reflow soldering) < For BLM31AJ type > Reflow 2.0 4.3 1.8 (in mm) < For BLM31PG/BLM31SN type > Type Rated Current (A) Land pad thickness and dimension d 18µm 35µm 70µm BLM31PG

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  Adhesive, Conductive, Conductive adhesives

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