Device Marking Conventions (Rev. C)

1 ApplicationReportSNOA039C May2004 dependentonthesizeofthedevicepackageandt heareaavailableformarking, (WaferLot) May2004 RevisedJuly2005 DeviceMarkingConventionsSubmitDocumentat ionFeedbackCopyright 2004 2005, dependentonthesizeofthedevicepackageandt heareaavailableformarking, givendeviceis givenin usuallycontainedin :Manufacturinginformation Companylogo Waferand/orassemblyplantcodes(optional)( seeTable1 andTable2) Datecode(seeTable4, Table5, andTable6) Dierun(waferlot)codeSecondLine:Devicepar tnumber Devicefamily(seeTable7) Devicetype Options Packagecode(seeTable8)Thirdorfourthline: Optional,dependingondevice,packagesize,a ndcustomer Continuationofdeviceidentification(iftoo longforthesecondline) Stampoff numberasrequiredbyspecificcustomerreques tandspecification Notice(s)relatedtocopyrightortrademarksV erysmallpackages,suchasSOT-23,SOT-223,SC 70,andSC90, assigneddifferently,consistingofa four-charactercode.

2 Devicetype(seeTable10) Deviceidentificationcode GradeThesesmallpackagesalsohavea a one-characteralphacodethatrepresentsa particular6-weekperiodduringa givendevicecanbefoundin ,whichwouldbetypicallyfoundin the firstline Marking ,is , Figure2, andFigure3 showthetypicalarrangementofmarkingonlarg e,medium, thedevicemarkingarelistedin , May2004 RevisedJuly2005 SubmitDocumentationFeedbackCopyright 2004 2005, listssingle-lettercodesforNationalSemico nductor' thislistindicatewaferfabricationatoneofN ationalSemiconductor' ,TXJG reenock,UKRS antaClara,CAVS outhPortland,MEXA rlington,TX0 MultipleFabOrigin1 USA(Sub-con)2 Taiwan(Sub-con)3 USA(Sub-con)8 Singapore(Sub-con)MUSA(Sub-con)NIsrael(S ub-con)PChina(Sub-con)WJapan(Sub-con)ZUS A(Sub-con)Table2 listssingle-lettercodesforNationalSemico nductor' thislistindicatedeviceassemblyatanothero fNationalSemiconductor' May2004 RevisedJuly2005 DeviceMarkingConventionsSubmitDocumentat ionFeedbackCopyright 2004 2005, ,CACC hinaMMalacca, four,three,two, six-weekperiodin analphacodefortheverysmallpackages,sucha sSOT,SC70,andSC90,andrangesfromA toZ plusthecharacter@,representinga 6-weekperiodduringa ,three,andtwodigitcodes,theallocationofd igitsbetweenyearandweekinformationin eachschemeis summarizedin Table4 (YYWW)22 Three-digit(YWW)12 Two-digit(YW)11 Year:Theyearcodeis ,adevicemanufacturedin 1999wouldhavea one-digitcodeof 9 ora two-digitcodeof 99.

3 Week:Theweekcodeis May2004 RevisedJuly2005 SubmitDocumentationFeedbackCopyright 2004 2005, (WaferLot) (continued)Six-WeekPeriodTwo-DigitCodeOn e-DigitCodeFromWeekToWeek242924430353053 64136642474274851488 Someexampledatecodesareshownin Table6 ,1999994894898 Calendarweek6,2000000600601 Calendarweek14,2000001201202 Calendarweek32,20010130130153 DieRun(WaferLot)CodesThedieruncodeis a twoletteralphacode,rangingfromABthroughZ Zforeachdevice, combinedwiththedieruncode,a uniqueidentifieris Device , ,in turn,minimize,andeventuallyeliminate, ,ADCVDataConversionCLCC omlinearProductsCOPC ontrolOrientedProcessorDACDataConversion DS,DSVI nterfaceProductsFPDFlatPanelDevicesLFLin ear(Bi-FET )LMLinear(Monolithic)LMCL inearCMOSLMDL inearDMOSLMF,MFLinearMonolithicFilterLMH L inearMonolithicHighSpeedLMSL inearSecondSourceLMVL inearLowVoltageLMXW irelessLPLinearLowPowerLPCL inearCMOS(LowPower)LPVL inearLowPower,LowVoltageSCDigitalCordles sTelephonySCANJTAGP roducts5 SNOA039C May2004 RevisedJuly2005 DeviceMarkingConventionsSubmitDocumentat ionFeedbackCopyright 2004 2005, (continued) (MicroSMD)D,DA,DHCeramicSidebrazedDual-I n-LinePackageDT,TDMoldedD-Pak(TO-252)EA, ECeramicLeadedChipCarrier(LCC)ELCeramicQ uadFlatpack(CQFP,CQJB)H,HA3-LeadMetalCan (TO-46,TO-39)J, JACeramicDual-In-LinePackage(CerDIP)K,KA ,KC,KSTO-3 MetalCan(Steel)LD,LQ,LQAL eadlessLeadframePackage(LLP)M,MAMoldedSm allOutlinePackage(SO,SOT)M3,M5,M6,MFMold edSmallOutlinePackage(SOT-23)M7,MGSC70MB ,MBH,MBS,MDA,MDBThinSmallOutlinePackage( TSOP)MCCeramicSmallOutlinePackage(CSOP)

4 MEA,MEB,MEC,MED,MQ,MQA,MoldedShrinkSmall OutlinePackage(SSOP)MS,MSA,MSCMH,MXPTSSO P withexposedpadMJMoldedsurfacemountwithJ- bend(SOJ)MMMiniatureMoldedSmallOutlinePa ckage(MSOP,MiniSO)MPMoldedSmallOutlinePa ckage(SOT-223)MTB,MTC,MTD,MTEM oldedThinShrinkSmallOutlinePackage(TSSOP )MW,WMWideBodyMoldedSmallOutlinePackage( SO,SOT)MWAP owerSmallOutlinePackage(PSOP)N,NAMoldedD ual-In-LinePackage(DIP)P,PA,TBMoldedTO-2 02 PowerPackageS,TSMoldedPowerSurfaceMountP ackage(TO-263)SL,SLBChipScalePackaging(C SP)LaminateSM,SLCBallGridArray(BGA)T,TAM oldedTO-220 PowerPackageTFMoldedTO-220 PowerPackageWithIsolatedTabU,UA,UCBallGr idArray(BGA)U,UECeramicPinGridArray(CPGA )UPPlasticPinGridArray(PPGA)V,VA28& 44-LeadMoldedPlasticLeadedChipCarrier(PL CC)V,VV,VW,VYLeadedQuadFlatPack(LQFP)VC, VD,VE,VF,VH,VI,VJ,VK,VM,MoldedPlasticQua dFlatPackage(PQFP)VN,VO,VPVS,VT,VUMolded PlasticThinQuadFlatPackage(TQFP)W,WACera micFlatpackW,WQCeramicQuadFlatpakWGCeram icSmallOutlinePackageandQuadFlatpakwithG ullwingLeadFormYATQFP withexposedpadZ,ZA,RMolded3-LeadTransist orPackage(TO-92)6 DeviceMarkingConventionsSNOA039C May2004 RevisedJuly2005 SubmitDocumentationFeedbackCopyright 2004 2005, CLCP roductsEMoldedSmallOutlinePackage(SO,SOT )QMoldedPlasticLeadedChipCarrier(PLCC)5 SmallSurface-MountPackageMarkingForpacka gessuchasSOT23(3-,5-,and6-lead),SOT223,a ndMSOP,thereis insufficientspacetomarktheentirepartnumb er,soa four-charactercodeis (seeTable10).

5 Thesecondtwocharactersarea topmark isusuallyfullyspecifiedin thedevicedatasheet, May2004 RevisedJuly2005 DeviceMarkingConventionsSubmitDocumentat ionFeedbackCopyright 2004 2005,TexasInstrumentsIncorporatedIMPORTA NTNOTICET exasInstrumentsIncorporatedanditssubsidi aries(TI)reservetherighttomakecorrection s,enhancements,improvementsandotherchang estoitssemiconductorproductsandservicesp erJESD46,latestissue,andtodiscontinueany productorserviceperJESD48, (alsoreferredtohereinas components ) aresoldsubjecttoTI s ,in accordancewiththewarrantyin TI s ,testingofallparametersofeachcomponentis productsandapplications, ,eitherexpressorimplied,is grantedunderanypatentright,copyright,mas kworkright,orotherintellectualpropertyri ghtrelatingtoanycombination,machine,orpr ocessin licensetousesuchproductsorservicesora licensefroma thirdpartyunderthepatentsorotherintellec tualpropertyofthethirdparty,ora TIdatabooksordatasheetsis permissibleonlyif reproductionis withoutalterationandis accompaniedbyallassociatedwarranties,con ditions,limitations, is solelyresponsibleforcompliancewithallleg al,regulatoryandsafety-relatedrequiremen tsconcerningitsproducts,andanyuseofTIcom ponentsin itsapplications, hasallthenecessaryexpertisetocreateandim plementsafeguardswhichanticipatedangerou sconsequencesoffailures,monitorfailuresa ndtheirconsequences.

6 TI s goalis , FDAC lassIII(orsimilarlife-criticalmedicalequ ipment)unlessauthorizedofficersofthepart ieshaveexecuteda enhancedplastic solelyattheBuyer's risk,andthatBuyeris solelyresponsibleforcompliancewithallleg alandregulatoryrequirementsin , , , :TexasInstruments,PostOfficeBox655303,Da llas,Texas75265 Copyright 2012,TexasInstrumentsIncorporat