Fan-Out WLP and PLP Technologies 2021

1 2021 From Technologies to MarketsFan-Out WLP and PLP Technologies2021 SampleMarket and Technology Report 20212 Tableofcontents2 Scopeofthereport4 Reportmethodology&definitions5 Abouttheauthors6 YoleGroupofcompaniesrelatedreports7 Glossary8 Companiescitedinthisreport9 Whatwegotright,whatwegotwrong10 Three-pagesummary11 Executivesummary15 Context56oScopeofFan-OutPackaging57oFan- OutPackagingdefinition60oFan-Out Packaging introduction63oFan-Out Packaging segmentation67 Marketforecasts76oFan-OutPackagingrevenu eforecasts77oTotaloverviewoEnd-marketoPo stCOVID-19impactoCoreFOvsHDFOvsUHDFOoFOW LPvsFOPLPoBreakdownbycarriertype&markets egmentoApplicationoFan-OutPackagingunitf orecasts88oTotaloverviewoEnd-marketoProd uctionvolume.

2 300mmwaferequivalentoCoreFOvsHDFOvsUHDFO Fan-Out WLP and PLP Technologies 2021 | Sample | | 2021 TABLE OF CONTENTSPart 1/2 Marketshares94oWhat snew?95oMarketsharesofmanufacturers97oMa rketsharesofICsubstratevsFan-Outtechnolo gies107oMarketsharesofSiinterposervsUHDF an-Outtechnologies111oMarketsharesofICsu bstratevsFan-Outtechnologies114oMarketsh aresofBusinessModels117oReasonbehindTSMC dominanceoChapterconclusion127 Supplychain130oWhat snew?131oSupplychainoverview133oGlobalma pping137oFan-Outkeysuppliersactivitysumm ary140oFan-Outplayers:positioning146oOve rviewofplayerspositioningoDeca sbusinessmodeltransitionoNepes Fan-Outpackagingcompanyspin-off:NepesLaw ehoAnalysisofthelatestdevelopmentsinsupp lychain156oAnalysisofkeyplayerswithinres pectivebusinessmodelsoNewsupplychaintren ds.

3 MoreUHDFO playersoMainplayersofFOPLPvsFOWLPoChapte rconclusion1743 Fan-Out WLP and PLP Technologies 2021 | Sample | | 2021 TABLE OF CONTENTSPart 2/2 Markettrends176oMarketdrivers177oBigdiep ackagingistrendinginHPCs180oWhyisFan-Out PackagingbeingadoptedforHPC?oAPEinmobile devices191oWhyisFan-OutPackagingadoptedi nmobileAPE?oRadaristrendinginautomotive1 97oWhyisFan-OutPackagingbeingadoptedinau tomotiveradar?oMobileAiPistrendingwith5G 208oWhyisFan-OutPackagingpossiblyadopted forAiP?oFan-OutPackagingdrivers218oChapt erconclusion230 Commercializationstatus233oWhat snew?

4 234oOverview237oCommercializationWindow: segmentedbyI/OCount&packagesize241oPMIC2 50oAudiocodec252oAutomotiveradar254oSmar tphonesAPE259oSmartphoneAiP265oSmartwatc hes268oHPC272oChapterconclusion285 Technologytrends287oWhat snew?288oFan-OutPackagingtechnologyroadm aps290oFan-OutPackagingtechnologybymanuf acturers297oPerspectiveontechnology350oC hapterconclusion354 Fan-OutPanelLevelPackaging357oPanel-tren dsandmotivations358oFOPLP supplychain366oGlobalmapofFOPLP manufacturersoFOPLP manufacturersstatusoNewdevelopmentsforFO PLP377oRealityofpanelpenetration381oChap terconclusion386 Reportconclusion389 Appendix392oBackgroundofFan-Outplayers/t echnologies393oFan-OutPackagingprocessfl ow412oFan-Outdrivers:whereisthethreshold ?

5 420oFan-OutPackagingtechnologybymanufact urers424oFan-OutPackagingtechnicalchalle nges444 YoleCorporatepresentation4474 Themainobjectivesofthisreportare: Toidentifyanddescribewhichtechnologiesca nbeclassifiedas Fan-OutPackaging Todefineclearlythedifferentmarketclasses ofFan-OutPackaging Toanalyzekeymarketdrivers,benefitsandcha llengesofFan-Outpackagesbyapplication Todescribethedifferentexistingtechnologi es,theirtrendsandroadmaps ToanalyzethesupplychainandFan-Outlandsca pe ToupdatethebusinessstatusofFan-Outtechno logymarkets Toprovideamarketforecastforthecomingyear s,andestimatefuturetrendsFan-OutPackagin gmarketsarestudiedfromthefollowingangles .

6 Top-downbasedonend-systemsdemand Marketvaluationsbasedontop-downandbottom -upmodels Marketsharesbasedonproductionprojections Supplyvaluechainanalysis State-of-the-arttechnologiesandtrends End-userapplicationadoptionsFan-Out WLP and PLP Technologies 2021 | Sample | | 2021 SCOPE OF THE REPORTY ours needs are out of scope of this report?Contact us for a custom study:5 Fan-Out WLP and PLP Technologies 2021 | Sample | | 2021 REPORT METHODOLOGY & DEFINITIONSM arketVolume (in Munits)ASP (in $)Revenue (in $M)Yole s market forecast model is based on the matching of several sources:Information AggregationPreexistinginformation6 Stefan ChitoragaStefan Chitoragais a Technology and Market Analyst specializing in Packaging and Assembly at YoleD veloppement(Yole).

7 As part of the Semiconductor, Memory & Computing division at Yole, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is involved daily in the production of technology & market reports and custom consulting projects. Stefan holds a Bachelor s in Electronics and Computer Science for Industry Applications from the Polytech Grenoble ShooFavier Shoo is a Team Lead Analyst in the Packaging team within Semiconductor, Memory and Computing Division at YoleD veloppement(Yole), part of YoleGroup of Companies. Based in Singapore, Favier manages an international team and develops the technical expertise and market know-how within the team.

8 Favier also focuses on the production of technology & market reports, conducts strategic consulting and custom studies. Favier holds a Bachelor s in Materials Engineering (Hons) and a Minor in Entrepreneurship from Nanyang Technological University (NTU) (Singapore). Favier was also the co-founder of a startup company where he formulated business goals, revenue models and marketing WLP and PLP Technologies 2021 | Sample | | 2021 ABOUT THE AUTHORSB iographies & contacts7 Fan-Out WLP and PLP Technologies 2021 | Sample | | 2021 GLOSSARYA bbreviationMeaningAbbreviationMeaningAbb reviationMeaningADASA dvanced Driver-Assistance SystemsHD FOHigh Density Fan-OutPMICP ower Management Integrated CircuitAiPAntenna in PackageHDIHigh Density InterconnectPMUP ower Management UnitAPEA pplication Processor EngineHPCHigh Performance ComputingPoPPackage-on-PackageAPUA pplication Processor UnitHVMHigh-Volume

9 ManufacturingPTORP roduction Tool of RecordASICA pplication-Specific Integrated CircuitI/OInputs/OutputsPVDP hysical Vapor DepositionBEOLBack-end Of LineICIntegrated CircuitsPWBP rinted Wiring BoardBGABall Grid ArrayIDMI ntegrated Device ManufacturersQFNQuad-Flat No-Lead PackageBOMBill Of MaterialsinFOintegrated Fan-OutRadarRAdio Detection And RangingCAGRC ompound Annual Growth Rate IPIntellectual PropertyRCCR esin Coated CopperCSPChip Scale PackageIPDI ntegrated Passive DevicesRCPR edistributed Chip PackageDSPD igital Signal ProcessorL/SLine/SpaceRDLR edistribution LayerDTORD evelopment Tool of RecordLiDARL ight Detection and RangingRFRadio FrequencyECDE lectro-Chemical DepositionLTELong-Term EvolutionSiPSystem-in-PackageEMCE poxy Mold CompoundLVMLow Volume ManufacturingSoCSystem-on-ChipePLPembedd ed Package-Level-PackagingMCMM ulti-Chip ModuleSoWSystem-on-WaferePoPembedded Package-on-PackageMCPM ulti-Chip PackageTMVT hrough-Mold-ViaeWLBembedded Wafer-Level BGAMEMSM icro-Electro-Mechanical SystemTPVT hrough-Package-ViaF2 FFace-to-FacemmWaveMillimeter waveTSVT hrough-Silicon-ViaFCFlip-ChipNRNew

10 RadioTTVT otal Thickness VariationFOFan-OutOEMO riginal Equipment ManufacturerUBMU nder Bump MetallizationFOPLPFan-Out Panel-Level PackagingOSATO utsource Semiconductor Assembly and TestUHD FOUltra-High-Density Fan-OutFOWLPFan-Out Wafer-level PackagingPAPower AmplifierWLCSPW afer-Level Chip-Scale PackageFPGAF ield-Programmable Gate ArrayPCBP rinted Circuit BoardWLFOW afer-Level Fan-OutHBMHigh Bandwidth MemoryPDN Power Distribution Network83D-Plus, 3M, AGC, Amkor, Ajinomoto, AKG, Analog Devices, Apple, ASE, A*Star (IME), AT&S, Atotech, Aurora semiconductors, BASF, BK Ultrasound, Blackberry, Boschmann, Brewer Science, Broadcom, Bosch, Cerebras, China Mobile, Cirrus Logic, Cypress, Deca Technologies , Denso, Dialog Semiconductor, Dow Dupont, Evatec, Fitbit, Freescale (NXP), Fujifilm, Global Foundry, Global UnichipCorp.