Transcription of Power SiC 2020: Materials, Devices
1 From Technologies to MarketsPower SiC 2020: Materials, Devices and ApplicationsMarket and Technology Report 2020 Sample 20202 TABLE OF CONTENTS Glossary2 Tableofcontents3 Reportmethodology4 Companiescitedinthisreport5 Abouttheauthors6 Whatwegotright,whatwegotwrong7 What snew11 Executivesummary15 Context52 Marketforecasts59 Markettrends84oElectricandhybridelectric vehicleapplicationsoCharginginfrastructu reapplicationsoPhotovoltaicinverterappli cationsoPowersupplyapplicationsoRailtrac tionapplicationsoUninterruptiblepowersup plyapplicationsoMotordriveapplicationsoW indapplicationsoOtherapplications Marketsharesandsupplychain170oPowerSiCin dustrysupplychain2020oKeyplayersandpower electronicslandscapeoRevenueestimationso fpowerSiCdevicemanufacturersoTesla sSiCsupplychainoTowardverticalintegratio noCompanyprofile:Cree/WolfspeedoCompanyp rofile:ROHMoCompanyprofile:II-VIoStrateg iesofleadingSiCdeviceplayersoPowermodule marketreshapingoSecuringthewafersupplyoS iCepiwafermanufacturingoSiCwafer/boulepr oducerstatusoSiCN-Typewafer/Boulecapacit yestimation&forecast FocusonChineseSiCindustry201 PowerSiCmanufacturingecosystem209 Technologytrends214oPowerSiCdevicetechno logyoPackagingoReliabilityoPowerSiCdevic es-CommercialstatusoSiCwaferandepiwafer Outlookandconclusions268 Power SiC.
2 Materials, Devices and Applications 2020 | Sample | | 20203 GLOSSARYAMBA ctive Metal BrazedA,AmpAmpereASPA verage Selling PriceBEVB attery Electric Vehicle BJTB ipolar Junction TransistorBOMBill Of MaterialsBPDB asal Plane DislocationBTSBase Transceiver Station CAGRC ompound AnnualGrowth RateCCMC ontinuous Conduction ModeCTEC oefficient of Thermal ExpansionCVDC hemical Vapor DepositionDCDirect CurrentDCBD irect Copper-BondedDDDislocation DensityDFIGD ouble-Fed Induction GeneratorDMOSD iffused Metal Oxide SemiconductorEREVE xtended Range ElectricVehicleEMCE lectroMagneticCompatibilityEMIE lectroMagneticInterferencexEVElectric Vehicle/Hybrid Electric VehicleFCVFuel Cell VehicleFETF ield Effect TransistorGaNGalliumNitrideGIT GateInjection TransistorGTOGate Turn-OffHEMTHigh Electron Mobility TransistorHEVH ybrid Electric VehicleHVACH eating, Ventilation and Air ConditioningHVDCHigh-VoltageDirect CurrentJBSJ unction Barrier SchottkyJFETJ unction Field Effect TransistorIEGTI njection-Enhanced Gate TransistorICIntegrated CircuitIGBTI solated Gate Bipolar TransistorIGCTI ntegrated Gate-Commutated ThyristorIPMI ntelligent Power ModuleIHInduction HeatingLLCA Power converter that is a variant of a series resonant converter, using two inductors (Lmagnetizing and Lresonant) and a capacitor (C).
3 LV-HVLow voltage to high voltage MESFETM etal-Semiconductor FETMISFETM etal-InsulatorFETMOSFETM etal-Oxide-SemiconductorFETMOCVDM etal-OrganicChemicalVaporDepositionNEVN eighborhood ElectricVehicleOBCOn-BoardChargerOEMO riginal Equipment ManufacturerPEPDCP rimary Electrical Power Distribution CenterPCBP rinted CircuitBoardPCSP ower Conversion SystemPCUP ower ControlUnitPFCP ower Factor CorrectionPHEVPlug-in Hybrid Electric VehiclePOLP oint-Of-LoadPSUP ower Supply UnitPVPhotoVoltaicPWMP ulse Width ModulationRon/RdsonOn-state ResistanceRFRadio FrequencySBDS chottky Barrier CarbideSJMOSFETS uperJunction MOSFETSMDS urface Mount DeviceSMPSS witchingMode Power SupplySSVS tart-Stop VehicleT TemperatureTAMT otalAvailable MarketT&DElectricity Transport and DistributionUPSU ninterruptible Power SupplyVSCV oltage Source ConverterWBGWide Band GapPower SiC: Materials, Devices and Applications 2020 | Sample | | 20204 REPORT METHODOLOGYM arketVolume (in Munits)ASP (in $)Revenue (in $M)Yole s market forecast model is based on the matching of several sources:Information AggregationPreexistinginformationPower SiC.
4 Materials, Devices and Applications 2020 | Sample | | 20205 ABB, Alstom, Ascatron, Aymont, Bombardier, Basic Semiconductor, Br ckwellTechnology, CalyTechnology, Clas-SiC wafer fab, Cree/Wolfspeed, CRRC, Danfoss, Delphi, DENSO, Dow Corning, Epiworld, Episil, Fraunhofer IISB, Fuji Electric, GE, GeneSiC, Global Power Device, Global Power Technology, GTAT, Hestia Power , Hitachi, IBS, II-VI, Infineon, MicroSemi, Mitsubishi Electric, Norstel, Northrop Grumman, NXP, ON Semiconductor, Panasonic, Philips, Powerex, Raytheon, RENESAS, ROHM, SananIC, Sanrex, Schneider Electric, Semikron, SemiQ, Shindengen, SiCrystal, SICC, Siemens, SMA, STMicroelectronics, Tankeblue, Toshiba, Toyota, United Silicon Carbide, WeEn, X-Fab, Yaskawa, and CITED IN THIS REPORTP ower SiC: Materials, Devices and Applications 2020 | Sample | | 20206 ABOUT THE AUTHORSA hmedBenSlimane, ,specializedinCompoundSemiconductors&Eme rgingSubstratesatYoleD BEN-SLIMANEB iographies & ContactsEzgiDogmus, DOGMUSP oshunCHIUP oshunChiuisaTechnology&MarketAnalystspec ializinginCompoundSemiconductor&Emerging SubstratesatYoleD veloppement(Yole).
5 AsamemberofthePowerElectronics&Wirelessd ivisionatYole,Poshunfocusesonpower,RF, ,Poshunhad9years SiC: Materials, Devices and Applications 2020 | Sample | | 202072019-2025 Power SIC MARKETFORECASTSPLIT BY APPLICATION$225 MxEV(main inverter+OBC+DC/DC converter)Photovolatics+ energystoragesystemsxEVcharginginfrastru cturePFC/ Power supplyRailMotordriveUPSO thers(wind, defense, R&D etc.)$1553 MCAGR:+38%$314 MCAGR:+17%$225 MCAGR:+90%$154 MCAGR:+6%2019$541M2025$2562 MCAGR2019-2025:+30%$5M$125M$107M$9M$118 MCAGR:55%$14M$38 MCAGR18%$25M$89 MCAGR24%$32M$69 MCAGR13% Power SiC: Materials, Devices and Applications 2020 | Sample | | 20208 YOLE S ANALYSIS OF COVID-19 IMPACT ON SiCADOPTION IN EV/HEV IN 2020 Power SiC: Materials, Devices and Applications 2020 | Sample | | 20209 STRATEGIES OF LEADING SiCDEVICE PLAYERS IN YOLE'S UNDERSTANDINGP ower SiC: Materials, Devices and Applications 2020 | Sample | | 202010 REVENUE ESTIMATIONS OF N-TYPE SiCSUBSTRATE SUPPLIERS2018 2019 and eH1-2020 N-type only, Semi-Insulating SiCwafer not included.
6 Cree-Wolfspeed: includes external Power device sales and internal SiC: Materials, Devices and Applications 2020 | Sample | | 202011 SiCN-TYPE WAFER/BOULE CAPACITY ESTIMATION & EXPECTATIONP ower SiC: Materials, Devices and Applications 2020 | Sample | | 202012 ROADMAP FOR Power SiCDEVICESSiC device* revenuePower supplyHigh Power applicationsFirst devicePVEV/HEV2030201020202000$1B$2B> $3 BCharging infrastructure*SiC device includes discrete diodes, transistors and is next ?SiC in EV/HEV main inverter targetPower SiC: Materials, Devices and Applications 2020 | Sample | | 202013 Power SIC BUSINESS: FROM SUBSTRATE TO MODULE Power SiC: Materials, Devices and Applications 2020 | Sample | | 202014 Contact ourSales Team for more informationYOLE GROUP OF COMPANIES RELATED REPORTSYole D veloppementPower SiC: Materials, Devices and Applications 2020 | Sample | | 2020 Status of the Power Electronics Industry 2020 Power Electronics for Electric & Hybrid Electric Vehicles 2020 Discrete Power Device Packaging: Materials Market and Technology Trends 2019 Status of the Power Module Packaging Industry 201915 Contact ourSales Team for more informationYOLEGROUP OF COMPANIES RELATED MONITORYoleD veloppement Compound Semiconductor Monitor ServiceYoleDevelopment tracks the GaN, SiC, GaAs, InPsemiconductors on a quarterly basis through The Compound Semiconductor Monitor Service launched in Q4-2019.
7 Our service includes:What is the difference between Power SiCReport and the Compound Semiconductor (CS) Monitor ?While our Power SiC2020 includes an annual update on the Power SiCdevice, epiwaferand wafer marketsas well as the ecosystem and technology aspects, the CS Monitor Service includes: 8 SiCCOMPANIES to start with:Module 1: Power SiCand GaN, available since Q4-2019 Module II: RF GaAs and GaN, available since Q3-2020 Module III: GaAs and InPOptoelectronics, available in update of market data in terms of volume (Munits), ASP ($), Value ($) in following slide deck with graphs and comments/analysis covering expected database with all historical and forecast of: s players manufacturing and technology in the supply access to the analystsduring the subscription period providing an opportunity for on-demand Q&A and discussions regarding trends, analyses, forecasts, and breaking newsPower SiC: Materials, Devices and Applications 2020 | Sample | | 202016 Contact ourSales Team for more informationYOLEGROUP OF COMPANIES RELATED REPORTSS ystem Plus ConsultingSiC Diode Comparison 2020 Wolfspeed All-SiC Module CAB450M12XM3 SiC MOSFET Comparison 2019 Power SiC: Materials, Devices and Applications 2020 | Sample | | 202017 About Yole D veloppement | | 2020 CONTACTSFINANCIAL SERVICES Jean-Christophe Eloy 4 72 83 01 80 Ivan Donaldson 208 850 3914 CUSTOM PROJECT SERVICES J romeAz mar, YoleD 6 27 68 69 33 Julie Coulon, System Plus Consulting 2 72 17 89 85 GENERAL Camille Veyrier, Marketing & 472 83 01 01 Sandrine Leroy, Public 4 72 83 01 89 General inquiries.
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