MPXV7002, Integrated silicon pressure sensor, on-chip ...

1 MPXV7002 Integrated silicon pressure sensor , on-chip signalconditioned, temperature compensated and calibratedRev. 5 5 May 2021 Product data sheet1 General descriptionThe MPXV7002 series piezoresistive transducers are monolithic silicon pressuresensors. The MPXV7002 is designed for a wide range of applications, particularlyapplications employing a microcontroller, or microprocessor with analog-to-digital transducer combines advanced micromachining techniques, thin-film metallization,and bipolar processing to provide an accurate, high-level analog output signal that isproportional to the applied Features and benefits Ideally suited for microprocessor or microcontroller-based systems Thermoplastic (PPS) surface mount package Temperature compensated over +10 C to +60 C Patented silicon shear stress strain gauge Available in differential and gauge configurations3 Applications Hospital beds HVAC Respiratory systems Process control4 Ordering informationPackageType numberNameDescriptionVersionMPXV7002 DPSO8 Plastic, small outline package, 8 terminals, mm pitch, mm x mm mm bodySOT1693-1 MPXV7002 GCSO8 Plastic, small outline package, 8 terminals, mm pitch, mm x mm mm bodySOT1854-1 MPXV7002 GPSO8 Plastic, small outline package, 8 terminals, mm pitch, mm x mm mm bodySOT1693-3 Table 1.

2 Ordering informationNXP SemiconductorsMPXV7002 Integrated silicon pressure sensor , on-chip signal conditioned, temperature compensated options# of PortsPressure typeDevice Outline Package (MPXV7002 Series)MPXV7002 DPTraysSOT1693-1 MPXV7002 DPMPXV7002 DPT1 Tape & ReelSOT1693-1 MPXV7002 DPMPXV7002GC6 URailsSOT1854-1 MPXV7002 GMPXV7002 GPTraysSOT1693-3 MPXV7002 GTable 2. Ordering optionsMPXV7002DP/DPT1 CASE 1351-01 SOT1693-1 MPXV7002GC6U/C6T1 CASE 482A-01 SOT1854-1 MPXV7002 GPCASE 1369-01 SOT1693-3 Small outline packages5 Block diagramaaa-040606 THIN FILMTEMPERATURECOMPENSATIONANDGAIN STAGE #1234 SensingelementPins 1, 5, 6, 7 and 8 are NO CONNECTSfor small outline package deviceVSVoutGNDGAIN STAGE #2 ANDGROUNDREFERENCESHIFT CIRCUITRYF igure 1. Integrated pressure sensor schematicMPXV7002 All information provided in this document is subject to legal disclaimers. NXP 2021. All rights data sheetRev. 5 5 May 20212 / 18 NXP SemiconductorsMPXV7002 Integrated silicon pressure sensor , on-chip signal conditioned, temperature compensated andcalibrated6 Pinning 2.

3 MPXV7002DP/DPT1 pindiagramFigure 3. MPXV7002GC6U/C6T1 pindiagramFigure 4. MPXV7002GP pin descriptionThis device family uses the style 2 pin configuration documented in Table 3 and shown inFigure [1] [2]Vs2 Supply voltageGND3 GroundVout4 Voltage [2] [2] [2] [2]Table 3. Pin description[1]The notch in the lead indicates pin 1.[2]Internal device connection. Do not connect to external circuitry or ground7 Maximum RatingsRatingSymbolValueUnitMaximum pressure (P1 > P2)Pmax75kPaStorage temperatureTstg 30 to +100 COperating temperatureTA10 to 60 CTable 4. Maximum Ratings[1][1]Exposure beyond the specified limits may cause permanent damage or degradation to the 1 shows a block diagram of the internal circuitry Integrated on a pressure information provided in this document is subject to legal disclaimers. NXP 2021. All rights data sheetRev. 5 5 May 20213 / 18 NXP SemiconductorsMPXV7002 Integrated silicon pressure sensor , on-chip signal conditioned, temperature compensated andcalibrated8 Operating Characteristics(VS = Vdc, TA = 25 C unless otherwise noted.)

4 Decoupling circuit shown in Figure 6 required to meet specification.)CharacteristicSymbolMinTy pMaxUnitPressure rRange[1]POP voltage[2] currentIo 10mAdcPressure offset[3] (10 C to 60 C) @ VS = scale output[4] (10 C to 60 C) @ VS = Scale Span[5] (10 C to 60 C) @ VS = VVdcAccuracy[6] (10 C to 60 C) [7] -V/kPaResponse time[8]tR -msOutput source current at full scale outputIO+ -mAdcWarm-up time[9] 20 -msTable 5. Operating Characteristics [1] kPa (kiloPascal) equals psi.[2]Device is ratiometric within this specified excitation range.[3]Offset (Voff) is defined as the output voltage at the minimum rated pressure .[4]Full scale output (VFSO) is defined as the output voltage at the maximum or full rated pressure .[5]Full scale span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum ratedpressure.[6]Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight-line relationship with pressure over the specified pressure range.

5 Temperature hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from theminimum or maximum operating temperature points, with zero differential pressure applied. pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximumrated pressure , at 25 C. TcSpan: Output deviation over the temperature range of 10 to 60 C, relative to 25 C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60 C, relative to 25 C. Variation from Nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25 C.[7]Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can affect the zeropressure output reading. Auto zero is defined as storing the zero pressure output reading and subtracting this from the device's output during normaloperations.

6 Reference AN1636[1] for specific information. The specified accuracy assumes a maximum temperature change of 5 C between auto zeroand measurement.[8]Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified stepchange in pressure .[9]Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been information provided in this document is subject to legal disclaimers. NXP 2021. All rights data sheetRev. 5 5 May 20214 / 18 NXP SemiconductorsMPXV7002 Integrated silicon pressure sensor , on-chip signal conditioned, temperature compensated andcalibrated9 temperature compensation, calibration, and signalconditioningThe performance over temperature is achieved by integrating the shear-stress straingauge, temperature compensation, calibration, and signal conditioning circuitry onto asingle monolithic 5 illustrates the differential or gauge configuration in the basic chip carrier (Case482).

7 A fluorosilicone gel isolates the die surface and wire bonds from the environment,while allowing the pressure signal to be transmitted to the sensor MPXV7002 series pressure sensor operating characteristics, and internal reliabilityand qualification tests are based on use of dry air as the pressure media. Media, otherthan dry air, may have adverse effects on sensor performance and long-term the factory for information regarding media compatibility in your 6 shows the recommended decoupling circuit for interfacing the Integrated sensorto the analog-to-digital input of a microprocessor or microcontroller. Proper decoupling ofthe power supply is 7 shows the sensor output signal relative to pressure input. Typical, minimum,and maximum output curves are shown for operation over a temperature range of 10 to60 C using the decoupling circuit shown in Figure 6. The output saturates outside thespecified pressure siliconegel die coatStainlesssteel capDieP1P2 Wire bondLeadframeDifferential sensingelementDie bondThermoplasticcaseFigure 5.

8 Cross-Sectional Diagram SOP (not to scale) F470 pFGNDOUTPUT+5 VVoutVSFigure 6. Recommended Power Supply Decoupling and Output FilteringMPXV7002 All information provided in this document is subject to legal disclaimers. NXP 2021. All rights data sheetRev. 5 5 May 20215 / 18 NXP SemiconductorsMPXV7002 Integrated silicon pressure sensor , on-chip signal conditioned, temperature compensated andcalibratedFor additional output filtering, refer to Application Note AN1646[1].Differential pressure (kPa)-2201-1aaa-04182223145 Output(V) function:Vout = VS x ( x P(kPa)+ ) VFSSVS = VdcTA = 10 C to 60 CFigure 7. Output versus pressure (P1)/Vacuum (P2) Side Identification TableNXP designates the two sides of the pressure sensor as the pressure (P1) side and theVacuum (P2) side. The pressure (P1) side is the side containing a gel die coat whichprotects the die from harsh pressure (P1) side may be identified by using Table NumberCase TypePressure (P1)Side IdentifierMPXV7002GC6U/GC6T1482A-01 Side with Port AttachedMPXV7002GP1369-01 Side with Port AttachedMPXV7002DP1351-01 Side with Part MarkingTable 6.

9 pressure side Recommended Footprint for Surface Mounted ApplicationsSurface mount board layout is a critical portion of the total design. The footprint for thesurface mount packages must be the correct size to ensure proper solder connectioninterface between the board and the package. With the correct footprint, the packagesself-align when subjected to a solder reflow process. NXP recommends designing boardswith a solder mask layer to avoid bridging and shorting between solder information provided in this document is subject to legal disclaimers. NXP 2021. All rights data sheetRev. 5 5 May 20216 / 18 NXP SemiconductorsMPXV7002 Integrated silicon pressure sensor , on-chip signal conditioned, temperature compensated TYP TYP TYP 8 XmmSCALE 2:1inchFigure 8. Small outline package footprintMPXV7002 All information provided in this document is subject to legal disclaimers. NXP 2021. All rights data sheetRev. 5 5 May 20217 / 18 NXP SemiconductorsMPXV7002 Integrated silicon pressure sensor , on-chip signal conditioned, temperature compensated andcalibrated10 Package outlineFigure 9.

10 SOT1693-1, 8 Lead sensor , dual port package outline, 98 ASA99255D, Rev. BMPXV7002 All information provided in this document is subject to legal disclaimers. NXP 2021. All rights data sheetRev. 5 5 May 20218 / 18 NXP SemiconductorsMPXV7002 Integrated silicon pressure sensor , on-chip signal conditioned, temperature compensated andcalibratedFigure 10. SOT1693-1, 8 Lead sensor , dual port package outline notes, 98 ASA99255D, Rev. BMPXV7002 All information provided in this document is subject to legal disclaimers. NXP 2021. All rights data sheetRev. 5 5 May 20219 / 18 NXP SemiconductorsMPXV7002 Integrated silicon pressure sensor , on-chip signal conditioned, temperature compensated andcalibratedFigure 11. SOT1854-1, Unibody sensor package outline, 98 ASB17757C, Rev. CMPXV7002 All information provided in this document is subject to legal disclaimers. NXP 2021. All rights data sheetRev. 5 5 May 202110 / 18 NXP SemiconductorsMPXV7002 Integrated silicon pressure sensor , on-chip signal conditioned, temperature compensated andcalibratedFigure 12.