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QFN Layout Guidelines - Texas Instruments
www .ti.com 2.1.2 Thermal Vias Thermal Via Web or Spoke Via NOT Recommended Solid Via Recommended Exposed Copper! 0,05 mm Around Via Board Layout Inner or bottom layer copper planes also can be connected to thermal pad using vias and should be made
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LM136-2.5,LM236-2.5,LM336-2 - TI.com
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