Example: marketing

Schematic and Connection Diagrams - …

TL/H/5560LH0002 BufferFebruary 1995LH0002 BufferGeneral DescriptionThe LH0002 is a general purpose buffer. Its features make itideal to integrate with operational amplifiers inside a closedloop configuration to increase current output. The symmetri-cal output portion of the circuit also provides a low outputimpedance for both the positive and negative slopes of out-put LH0002 is available in an 8-lead TO-99 can. TheLH0002C is available in an 8-lead TO-99, and a 10-pinmolded dual-in-line LH0002 is specified for operation over theb55 Ctoa125 C military temperature range. The LH0002C is speci-fied for operation over the 0 Ctoa85 C temperature input impedance400 kXYLow output impedance6 XYHigh power efficiencyYLow harmonic distortionYDC to 30 MHz bandwidthYOutput voltage swing that approaches supply voltageY400 mA pulsed output currentYSlew rate is typically 200 V/msYOperation fromg5V tog20 VApplicationsYLine driverY30 MHz bufferYHigh speed D/A conversionSchematic and Connection DiagramsTL/H/5560 1 Pin numbers i

TL/H/5560 LH0002 Buffer February 1995 LH0002 Buffer General Description The LH0002 is a general purpose buffer. Its features make it ideal to integrate with operational amplifiers inside a closed

Tags:

  Connection, Diagrams, Schematics, Schematic and connection diagrams

Information

Domain:

Source:

Link to this page:

Please notify us if you found a problem with this document:

Other abuse

Transcription of Schematic and Connection Diagrams - …

1 TL/H/5560LH0002 BufferFebruary 1995LH0002 BufferGeneral DescriptionThe LH0002 is a general purpose buffer. Its features make itideal to integrate with operational amplifiers inside a closedloop configuration to increase current output. The symmetri-cal output portion of the circuit also provides a low outputimpedance for both the positive and negative slopes of out-put LH0002 is available in an 8-lead TO-99 can. TheLH0002C is available in an 8-lead TO-99, and a 10-pinmolded dual-in-line LH0002 is specified for operation over theb55 Ctoa125 C military temperature range. The LH0002C is speci-fied for operation over the 0 Ctoa85 C temperature input impedance400 kXYLow output impedance6 XYHigh power efficiencyYLow harmonic distortionYDC to 30 MHz bandwidthYOutput voltage swing that approaches supply voltageY400 mA pulsed output currentYSlew rate is typically 200 V/msYOperation fromg5V tog20 VApplicationsYLine driverY30 MHz bufferYHigh speed D/A conversionSchematic and Connection DiagramsTL/H/5560 1 Pin numbers in parentheses denote pinconnections for dual-in-line PackageTL/H/5560 2 Order Number LH0002 CNSee NS Package Number N10 AMetal Can PackageTL/H/5560 3 Order Number LH0002H.

2 LH0002H-MIL or LH0002 CHLH0002H/883*See NS Package Number H08D*Available per SMD 7801301C1995 National Semiconductor CorporationRRD-B30M115/Printed in U. S. Maximum Ratings(Note 3)If Military/Aerospace specified devices are required,please contact the National Semiconductor SalesOffice/Distributors for availability and specifications.(Note 2)Supply Voltageg22 VPower Dissipation (Note 4)600 mWInput Voltage(Equal to Power Supply Voltage)Storage Temperature Rangeb65 Ctoa150 CJunction TemperatureN Packagea150 CH Packagea175 CSteady State Output Currentg100 mAPulsed Output Current (50 ms On/1 sec. Off)g400 mALead Temperature Soldering (10 seconds)Metal Can300 CPlastic260 CESD Rating (Note 6)2 kVOperating Ratings(Note 3)Temperature RangeLH0002b55 Ctoa125 CLH0002C0 Ctoa85 CThermal Resistance (Note 5)iJA, H Packagea125 C/WiJC, H Packagea75 C/WiJA, N Packagea120 C/WElectrical Characteristics(Note 1)

3 ParameterConditionsMinTyp Max UnitsVoltage GainRSe10 kX, kX, ImpedanceRSe200 kX, , kX180400kXOutput , RLe50X,RSe10 Voltage kX,VINeg12Vg10g11 VOutput Voltage SwingVSeg15V, VINeg12V, RSe50X,RLe100X,TAe25 Cg10 VDC Output Offset Voltage RSe300X, kXg10g30mVDC Input Bias CurrentRSe10 kX, Vrms, TimeRLe50X,DVINe100 Supply CurrentRSe10 kX, Supply CurrentRSe10 kX, 1:Specification applies for TAe25 C witha12V on Pins 1 and 2;b12V on Pins 6 and 7 for the metal can package anda12V on Pins 1 and 2;b12V onPins 4 and 5 for the dual-in-line package, unless otherwise specified. The parameter guarantees for LH0002C apply over the temperature range of 0 Ctoa85 C,while parameters for the LH0002 are guaranteed over the temperature rangeb55 Ctoa125 C unless otherwise 2:Refer to RETS0002X for LH0002 military 3:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.

4 Operating Ratings indicate conditions for which the device isintended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical guaranteed specifications apply only for the test conditions 4:The maximum power dissipation is a function of maximum junction temperature (TJMax), total thermal resistance (iJA), and ambient temperature (TA). Themaximum allowable power dissipation at any ambient is PDe(TJMaxbTA) 5:For operating at elevated temperatures, the device must be derated based on the thermal resistanceiJAand TJMax. 6:Human body model, kXin series with 100 ApplicationsHigh Current Operational AmplifierTL/H/5560 4 Line Driver*Previously called NH0002/NH0002 CTL/H/5560 5 Typical Performance CharacteristicsFrequency Response(Magnitude & Phase)Input ImpedanceSupply CurrentPositive PulseNegative PulseInput Bias CurrentTL/H/5560 734 Physical Dimensionsinches (millimeters)Metal Can Package (H)Order Number LH0002H, LH0002H-MIL, LH0002H/883 or LH0002 CHNS Package Number H08D5LH0002 BufferPhysical Dimensionsinches (millimeters) (Continued)Molded Dual-In-Line Package (N)

5 Order Number LH0002 CNNS Package Number N10 ALIFE SUPPORT POLICYNATIONAL S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONALSEMICONDUCTOR CORPORATION. As used herein:1. Life support devices or systems are devices or 2. A critical component is any component of a lifesystems which, (a) are intended for surgical implantsupport device or system whose failure to perform caninto the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the lifefailure to perform, when properly used in accordancesupport device or system, or to affect its safety orwith instructions for use provided in the labeling, reasonably expected to result in a significant injuryto the SemiconductorNational SemiconductorNational SemiconductorNational SemiconductorCorporationEuropeHong Kong West Bardin RoadFax: (a49) 0-180-530 85 8613th Floor, Straight Block,Tel.

6 81-043-299-2309 Arlington, TX 76017 Email: Centre, 5 Canton : 81-043-299-2408 Tel: 1(800) 272-9959 Deutsch Tel: (a49) 0-180-530 85 85 Tsimshatsui, KowloonFax: 1(800) 737-7018 English Tel: (a49) 0-180-532 78 32 Hong KongFran3ais Tel: (a49) 0-180-532 93 58 Tel: (852) 2737-1600 Italiano Tel: (a49) 0-180-534 16 80 Fax: (852) 2736-9960 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.


Related search queries