Semiconductor Packing Material Electrostatic …

1 Application ReportSZZA047 - July 20041 Semiconductor Packing MaterialElectrostatic discharge (ESD) ProtectionAlbert Escusa and Lance WrightStandard Linear and LogicABSTRACTF orty-eight-pin TSSOP components that were packaged using Texas Instruments (TI)standard Packing methodology were subjected to electrical discharges between and 20kV, as generated by an IEC ESD simulator to determine the level of ESD protection providedby the Packing materials. The testing included trays, tape and reel, and units were subjected to the same discharge , without the protection of the packingmaterial. Test results showed that the Packing materials used by TI provide protection up to20 kV, and that a level of ESD protection is required.

2 The die in the components had a ChargeDevice Model (CDM) rating of kV, and all units experiencing a discharge greater than 500V sustained sufficient electrical overstress to fail electrical testing when outside of the .. 2 Packing Methods3 .. Tube Packing Method3 .. Tray Packing Method3 .. Tape-and-Reel Packing Method4 .. 3 Test Equipment and Materials4 .. Instruments4 .. Materials4 .. 4 Test Procedure5 .. 3M SED Procedure for Trays/Tape and Reel/Tubes5 .. IEC ESD Simulator Procedure for Trays/Tape and Reel/Tubes6 .. 5 Results6 .. Tray-Stack Test Results6 .. Event-Detector Test Results6 .. Tray Packing Results on Live TSSOP Devices Using IED Gun8.

3 Tape-and-Reel Test Results9 .. Event-Detector Test Results9 .. Tape-and-Reel Packing Results on Live TSSOP Devices Using IEC Gun10 .. Tube Test Results11 .. Tube Event-Detector Test Results11 .. Tube Packing Results on Live TSSOP Devices Using IEC Gun12 .. Results of Unpackaged Live TSSOP Devices Using IEC Gun14 .. Trademarks are the property of their respective Packing Material Electrostatic discharge (ESD) Protection6 Conclusion15.. 7 Acknowledgments15.. List of Locations in Tray Stack6 .. Stack8.. Stack in Box8 .. Locations in Reel (Used 3)9 .. Reel10 .. Box10 .. Locations in Magazine Bundle11 .. of Tubes13 .. Box13 .. 10. Carbon-Lined Bag13.

4 11. Test Socket for Live Die Testing14 .. List of Materials4 .. Feedback for Black PPE-Tray Packing Configurations7 .. Feedback for Blue Dipped-Tray Packing Configurations7 .. testing on Live TSSOP Devices for Black PPE-Tray Packing Configurations8 .. testing on Live TSSOP Devices for Blue Dipped-Tray Packing Configurations8 .. Feedback for Black Static-Dissipative-Reel Packing Configurations9 .. Feedback for Blue Dipped-Reel Packing Configurations10 .. testing on Live TSSOP Devices for Black Reel Packing Configurations10 .. testing on Live TSSOP Devices for Blue Dipped-Reel Packing Configurations10 .. 10. Event-Detector Feedback for Clear Antistatic Tube Packing Configurations11.

5 11. Event-Detector Feedback for Black Tube Packing Configurations12 .. 12. ESD testing on Live TSSOP Devices for Clear Antistatic Tube Packing Configurations12 .. 13. ESD testing on Live TSSOP Devices for Black Tube Packing Configurations12 .. 14. ESD Ground-Pin Test Results14 .. SZZA0473 Semiconductor Packing Material Electrostatic discharge (ESD) Protection1 IntroductionTexas Instruments (TI) ships over 5-billion Semiconductor devices on an annual basis. To ensurethat these devices reach the customer in good condition, they must be packaged appropriatelyto withstand the potential damage of shipping. Semiconductor Packing materials must protectthe units from physical damage, vibration shock, and Electrostatic discharge (ESD).

6 Static electricity is a natural phenomenon. Delicate electronic components are easily damagedby ESD, and subsequent faults in assembled finished products can be costly. Packing media isused to protect against ESD, as ICs are delivered to the customer and include items such astrays, tape and reel, tubes or magazines, boxes, and bags. These items must have a surfaceresistance in the static dissipate range of greater than 1x104 /sq, but less than 1x1011 /sq perANSI/EOS/ESD , in order to control a discharge . If the surface resistance is toosmall, a charge can dissipate too quickly and electrically overstress the ICs within the purpose of this application report is to demonstrate that TI Packing methods providesufficient ESD protection when used in accordance with EIA-541 and EIA-625 Material -handlingguidelines.

7 Packing methods in use today by TI are tape and reel, tray, and tubes. A typical logicdevice has minimum ESD criteria, unless approved by a waiver from the Quality department:[Human-Body Model (HBM), 2000 V] [Charge-Device Model (CDM), 500 V]. The testingperformed in this study was done using a die meeting these minimum requirements, and thetesting performed simulated the CDM. For more information on HBM and CDM, please see theTI application report, Electrostatic discharge (ESD), literature number SSYA010, located Packing MethodWhen a customer receives devices packed in tubes, they receive a carbon-lined cardboard boxfor surface-mount components. The surface-mount technology (SMT) components are wrappedin bubble wrap that has an antistatic coating if the moisture sensitivity rating is level 1 (MSL 1).

8 Ifnot, the tubes are put in a moisture-barrier bag (MBB) and placed in a cardboard box. Forthrough-hole components, the tubes are shipped inside a carbon-lined bag. Through-holecomponents are not moisture sensitive and do not require drypack in an Packing MethodTrays are sent to the customer in a stacked arrangement. There is 4+1, 5+1, or 10+1 traystacking, which means that 4, 5, or 10 trays have units with a top tray that is empty. The top trayacts as a cover. A single carbon-lined cardboard sheet is put on the top and bottom of the traystack and bound together with a conductive plastic strap. If the devices are moisture sensitive,the bundle is drypacked in an MBB and placed in a box with a carbon-lined insert/sleeve.

9 Thetop and bottom cardboard sheets and insert provide the Faraday cage (ESD shielding). If theunits are not moisture sensitive, the bundle is wrapped in antistatic bubble wrap and placed in anon-carbon-lined Packing Material Electrostatic discharge (ESD) Packing MethodDevices in static-dissipative carrier tape are wound onto an intrinsically static-dissipative reel, if moisture sensitive, is placed in an MBB and placed in a non-carbon-lined cardboardbox. If the devices are not moisture sensitive, the reel is placed in the non-carbon-lined box,without bubble wrap or MBB. The reel has an extra layer of winding at the inner and outer hub toprovide the Faraday cage. The customer receives one reel per Equipment and MaterialsThe instruments and materials listed in section were used to conduct the ESD tests .

10 Thepacking materials listed were qualified in accordance with TI internal qualification NoiseKen, ESS-2000 IEC ESD Simulator. This instrument, shown in the background ofFigure 2, is used to generate ESD on the Packing 3M Event Detector, 37 V. The device is one cubic inch and has a window that turns redwhen exposed to 37 V, or higher. The window remains black when exposed to <37 the Packing materials listed in Table 1 are TI production materials that are qualified inaccordance with Quality Standard 1. Test MaterialsTI PART NUMBERRATED SURFACE RESISTIVITYMATERIAL DESCRIPTION4200101-00011x10e7 /sqTray, black, PPERH Murphy1x10e5 /sqTray, blue, antistatic, dipped, ABS4204205-00031x10e9 /sq13-in black intrinsically static dissipative reel4200038-00031x10e10 /sq13-in blue antistatic dipped reel4041338-00011x10e9 Tube, clear antistatic, PVC-034 (Burr Brown)1x10e3 Tube, black, conductive4200734-00041x10e8 /sqMBB for tube4200734-00031x10e10 /sqMBB for tray, aluminum4200734-00011x10e10 /sqMBB for tape and reel, aluminum4045704-0025 Interior/exterior: 1x10e10 /sq, Metal: 100 ESD shielding bag for tape and reel4045704-0026 Interior/exterior: 1x10e10 /sq, Metal.