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SOD523 - NXP

SOD523plastic surface-mounted package; 2 leads8 February 2016 Package information1. Package summaryTerminal position codeD (double)Package type descriptive codeSOD523 Package type industry codeSOD523 Package style descriptive codeSOD (small outline diode)Package style suffix codeNA (not applicable)Package body material typeP (plastic)JEITA package outline codeSC-79 Mounting method typeS (surface mount)Issue date16-3-2006 Table 1. Package summarySymbolParameterMinTypNomMaxUnitDp ackage quantity of termination--2- NXP SemiconductorsSOD523plastic surface-mounted package; 2 leadsSOD523 All information provided in this document is subject to legal disclaimers. NXP Semiconductors 2016. All rights reservedPackage information8 February 20162 / 42.

IEC JEDEC JEITA SOD523 SC-79 02-12-13 06-03-16 Plasticsurface-mountedpackage;2leads SOD523 0 0.5 1 mm scale D 1 2 HE E bp A c v M A A UNIT bp c D E v mm A HE DIMENSIONS(mmaretheoriginaldimensions) Note 1. The marking bar indicates the cathode. ... to the publication hereof. NXP Semiconductors SOD523 plastic surface-mounted package; 2 leads

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Transcription of SOD523 - NXP

1 SOD523plastic surface-mounted package; 2 leads8 February 2016 Package information1. Package summaryTerminal position codeD (double)Package type descriptive codeSOD523 Package type industry codeSOD523 Package style descriptive codeSOD (small outline diode)Package style suffix codeNA (not applicable)Package body material typeP (plastic)JEITA package outline codeSC-79 Mounting method typeS (surface mount)Issue date16-3-2006 Table 1. Package summarySymbolParameterMinTypNomMaxUnitDp ackage quantity of termination--2- NXP SemiconductorsSOD523plastic surface-mounted package; 2 leadsSOD523 All information provided in this document is subject to legal disclaimers. NXP Semiconductors 2016. All rights reservedPackage information8 February 20162 / 42.

2 Package outlineREFERENCESOUTLINEVERSIONEUROPEANP ROJECTIONISSUEDATEIECJEDECJEITASOD523SC- 7902-12-1306-03-16 Plasticsurface-mountedpackage; (mmaretheoriginaldimensions) (1) 1. Package outline SOD5233. (2 ) (2 ) (2 ) (2 ) landssolder resistoccupied areasolder pastesod523_frDimensions in mmFig. 2. Reflow soldering footprint for SOD523 NXP SemiconductorsSOD523plastic surface-mounted package; 2 leadsSOD523 All information provided in this document is subject to legal disclaimers. NXP Semiconductors 2016. All rights reservedPackage information8 February 20163 / 44. Legal informationDisclaimersLimited warranty and liability Information in this document is believedto be accurate and reliable.

3 However, NXP Semiconductors does not giveany representations or warranties, expressed or implied, as to the accuracyor completeness of such information and shall have no liability for theconsequences of use of such information. NXP Semiconductors takes noresponsibility for the content in this document if provided by an informationsource outside of NXP no event shall NXP Semiconductors be liable for any indirect, incidental,punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence)

4 , warranty, breach ofcontract or any other legal any damages that customer might incur for any reasonwhatsoever, NXP Semiconductors aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of NXP to make changes NXP Semiconductors reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication SemiconductorsSOD523plastic surface-mounted package; 2 leadsSOD523 All information provided in this document is subject to legal disclaimers.

5 NXP Semiconductors 2016. All rights reservedPackage information8 February 20164 / 45. Contents1. Package Package Legal 3 NXP Semiconductors 2016. All rights reservedFor more information, please visit: sales office addresses, please send an email to: of release: 8 February 2016


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