SOT23 - NXP

1 SOT23plastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm body9 January 2017 Package information1. Package summaryDimensions (mm) x x 1 Terminal position codeD (double)Package type descriptive codeTO-236 ABPackage outline version codeSOT23 Manufacturer package codeSOT23 Package type industry codeTO-236 ABPackage outline version descriptionplastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm bodyPackage style descriptive codeSOT (small outline transistor)Package body material typePJEDEC package outline codeTO-236 ABHandling precautionsIC26_CHAPTER_3_2000 Thermal design considerationsSC18_1999_CHAPTER_5_2 Mounting method typeS (surface mount)

2 Generic mounting and soldering informationAN10365_3 Reflow soldering footprintSOT023_frWave soldering footprintSOT023_fwPackage life cycle statusRELM ajor version date18-9-2008 Minor version date6-7-2012 Security statusCOMPANY PUBLICM odified date28-11-2012 Issue date16-3-2006 Web publication date28-11-2012 Initial web publication date11-3-2011 Customer specific indicatorNMaturityProductPackage authorNair DeepaPackage approverNair DeepaTable 1. Package summarySymbolParameterMinTypNomMaxUnitAs eated SemiconductorsSOT23plastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm bodySOT23 All information provided in this document is subject to legal disclaimers.

3 NXP Semiconductors 2017. All rights reservedPackage information9 January 20172 / 6 SymbolParameterMinTypNomMaxUnitEpackage quantity of termination--3- NXP SemiconductorsSOT23plastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm bodySOT23 All information provided in this document is subject to legal disclaimers. NXP Semiconductors 2017. All rights reservedPackage information9 January 20173 / 62. Package outlineReferencesOutlineversionEuropeanp rojectionIssue dateIECJEDECJEITASOT23TO-236 ABsot023_po14-06-1914-09-22 Plastic surface-mounted package; 3 leadsSOT23bpDAA1 LpQHEE012 (mm are the original dimensions) XFig.

4 Outline TO-236AB ( SOT23 )NXP SemiconductorsSOT23plastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm bodySOT23 All information provided in this document is subject to legal disclaimers. NXP Semiconductors 2017. All rights reservedPackage information9 January 20174 / 63. (3 ) (3 ) (3 ) (3 ) soldering footprint for TO-236AB ( SOT23 ) (2 ) (2 ) soldering footprint for TO-236AB ( SOT23 )NXP SemiconductorsSOT23plastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm bodySOT23 All information provided in this document is subject to legal disclaimers.

5 NXP Semiconductors 2017. All rights reservedPackage information9 January 20175 / 64. Legal informationDisclaimersLimited warranty and liability Information in this document is believedto be accurate and reliable. However, NXP Semiconductors does not giveany representations or warranties, expressed or implied, as to the accuracyor completeness of such information and shall have no liability for theconsequences of use of such information. NXP Semiconductors takes noresponsibility for the content in this document if provided by an informationsource outside of NXP no event shall NXP Semiconductors be liable for any indirect, incidental,punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence)

6 , warranty, breach ofcontract or any other legal any damages that customer might incur for any reasonwhatsoever, NXP Semiconductors aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of NXP to make changes NXP Semiconductors reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions , at any time and withoutnotice.

7 This document supersedes and replaces all information supplied priorto the publication SemiconductorsSOT23plastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm bodySOT23 All information provided in this document is subject to legal disclaimers. NXP Semiconductors 2017. All rights reservedPackage information9 January 20176 / 65. Contents1. Package Package Legal 5 NXP Semiconductors 2017. All rights reservedFor more information, please visit: sales office addresses, please send an email to: of release: 9 January 2017