Transcription of Classification of Non-IC Electronic Components for ...
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ECA/IPC/JEDEC J-STD-075 Classification of Non-ICElectronic Componentsfor assembly ProcessesA joint standard developed by the Electronic Components AssociationS-1 Passive component Committees Steering Group, IPC Plastic ChipCarrier Cracking Task Group (B-10a) and the JEDEC Committeeon Reliability Test Methods for Packaged DevicesUsers of this standard are encouraged to participate in thedevelopment of future :ECAE lectronic ComponentsAssociation2500 Wilson BoulevardArlington, VA 22201-3834 Phone: (703) 907-8022 Fax: (703) 875-8908 IPCA ssociation ConnectingElectronics Industries 3000 Lakeside Drive, Suite 309 SBannockburn, IL 60015-1249 Phone: (847) 615-7100 Fax: (847) 615-7105 JEDECS olid State Technology Association3103 North 10th Street, Suite 240-SArlington, VA 22201 Phone: (703) 907-7534 Fax: (703) 907-7583 Table of Contents1.
Classification of Non-IC Electronic Components for Assembly Processes 1 GENERAL 1.1 Scope This standard outlines worst case industry solder (SnPb and Pb-free) assembly process limits for non-
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Through Hole Solder Joint Evaluation, Solder, Through Hole, Through Hole Solder Joint, 600WOG/150WSP Full Port Two-piece, Solder joint, Hole, Through, Soldering Process Guideline for, Soldering Process Guideline for Electronic Components, Alternatives To HASL: Users Guide For Surface, Alternatives To HASL: Users Guide For Surface Finishes