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DEMO ONLY Version - IPC
PhotosChip ComponentsJ-Lead ComponentsGull Wing ComponentsClass 3 Class 2 Class 1 IPC 2010 3000 Lakeside Drive, Suite 309-S Bannockburn, IL 60015-1219 +1 (tel.) +1 (fax) email: rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduc-tions of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United Rev. E 3m Rev. D 4m Rev. D 5m Rev. C 3m Rev. B 3m Rev. A 5m 1st printing 5m Association Connecting Electronics IndustriesDEMO only VersionThis is a promotional sample of the IPC Training and Reference Guide do not use this SAMPLE for training or reference is a not-for-profit association for the electronics industry.
Class 1 Class 2 Class 3 2 3 Classification Surface mount solder joint requirements are divided into three classes depending on the ultimate use, life …
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Solder paste, Guide to Solder Paste Assessment, Photos DEMO ONLY Version, Solder, Requirements, L ead-Free Soldering Products, Universal Footprint for SO8FL Package, Table, Soldering Recommendations for Chip Level, Soldering Recommendations for Chip Level Package, SMT Process Guideline and Checklist, MicroStar BGA Packaging Reference Guide