Lead-Free Solder Bumping Process for High Temperature ...
stencil printing of lead-free solder pastes have been established. Introduction Driven by the need to achieve increased speed and ... Fig. 4: Lead-free Reflow Profile Results Once the solder bumping process (stencil design, solder paste selection, printing, reflow and flux cleaning) was optimized, the achieved solder bump quality (see figure 5 ...
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
Related search queries
Free, Reflow, Lead, Solder, AN233 Solder Reflow Recommendation, Free solder, BEST PRACTICES REFLOW PROFILING FOR LEAD, INVESTIGATION AND DEVELOPMENT OF TIN, Lead Free Solder Reflow, Soldering, Lead free solder, LEAD-FREE HAND SOLDERING: NEW TECHNOLOGIES FOR, Optimizing Reflow Profiling in Lead, Lead-Free Selective Soldering: The Wave, Lead-free Soldering Materials and Processes