Transcription of Section 1: Solder Reflow Basics - tch.es
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Section 1: Solder Reflow Basics - tch.es
Page 1 Research InternationalSolder Reflow Technology HandbookSection 1: Solder Reflow BasicsIntroductionElectronics assembly is the general term forjoining electrical components to printedcircuit boards (PCB). Surface mounttechnology (SMT) is the electronicsassembly process where electricalcomponent leads are joined to the PCB viaindividual pad connections located on theboard basic SMT process consists of thefollowing steps:1. Solder paste is applied to the PCB usinga screen printer. Stencils designed withholes over individual pads control thesolder application to the Electronic components are positioned onthe PCB using placement equipment(pick-and-place machines, chip shooters,etc.). Component leads are placed indirect contact with the The Solder paste is heated until liquidus(reflowed) then cooled until the solderhardens and creates permanentinterconnection between the componentleads and the PCB.
Section 1: Solder Reflow Basics Introduction Electronics assembly is the general term for joining electrical components to printed circuit boards (PCB). Surface mount ... Solder Reflow Technology Handbook Lead Free Solder Among the most discussed topics in the late-1990s is the effort to remove lead from electronic products. Concerns about ground
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