Call for Papers - エレクトロニクス実装学会
Call for Papers 2018 International Conference on Electronics Packaging and IMAPS All Asia Conference Major Topics Advanced Packaging 2.5D/3D, Advanced CSP and POP, Advanced Flip-Chip, Automotive,
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A 36 W Wireless Power Transfer System with 82% …
www.jiep.or.jp32 Transactions of The Japan Institute of Electronics Packaging Vol. 6, No. 1, 2013 1. Introduction Recently, interest in wireless power transfer (WPT)
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Inhibiting Cracking of Interfacial Cu6Sn5 by Ni …
www.jiep.or.jp46 Transactions of The Japan Institute of Electronics Packaging Vol. 2, No. 1, 2009 Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn- …
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