Etch rates for micromachining processing-part II ...
Digital Object Identifier 10.1109/JMEMS.2003.820936 b eus d inf trefa r cation o micr ol ecm ha lsyst ms (MEMS) and in tegra d crcuits (ICs) (approxima ly 50 h rates measured in the earlier paper have been included in this one). These data allow the selection of new combinations of structural material, underlying material, and etchant for micro-
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