High-End Performance Packaging: 3D/2.5D Integration 2020
o Cloud computing and networking 103 o High-Performance Computing (HPC) 111 o Artificial intelligence for autonomous vehicles 119 o Chapter conclusion 125 Commercialized products and its supply chain 127 o Product launches 130 o 3D stacked memories o (x)PU o GPU for HPC o Supply chain for high-end performance packaging 156
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