Pcb Footprint
Found 8 free book(s)
7 Series FPGAs Data Sheet: Overview (DS180) - Xilinx
www.xilinx.compackaging for smallest PCB footprint. † Artix®-7 Family: Optimized for low power applications requiring serial transceivers and high DSP and logic throughput. Provides the lowest total bill of materials cost for high-throughput, cost-sensitive applications. † Kintex®-7 Family: Optimized for best price-performance with a 2X
3-Axis Digital Compass IC HMC5883L - Adafruit Industries
cdn-shop.adafruit.comPCB Pad Definition and Traces The HMC5883L is a fine pitch LCC package. Refer to previous figure for recommended PCB footprint for proper package centering. Size the traces between the HMC5883L and the external capacitors (C1 and C2) to handle the 1 ampere peak current pulses with low voltage drop on the traces. Stencil Design and Solder Paste
© Copyright 2013 2016 Xilinx
www.xilinx.comThese packages are footprint compatible with the corresponding 47.5mm body size packages. See UG583, UltraScale Architecture PCB Design User Guide for important migration details. UltraScale and UltraScale+ families provide footprint compatibility to enable users to migrate designs from one device or family to another.
The Chip Scale Package (CSP) - Intel
www.intel.comincrease the number of interconnects while saving PCB routing space. Other manufacturing ... Another advantage of the Easy BGA package is its constant package size/footprint in respect to memory density upgrades and die shrinks. A key element of embedded applications is the need for long product life cycles (5-7 years) that require the same ...
G6K(U)-2F(P)-RF(-S, -T) - Omron
omronfs.omron.comP: PCB terminals 4. Special Function RF: High-frequency compatible 5. Terminal Shape None: Standard S: Small footprint T: Compatible with 3 GHz Relay Function Enclosure rating Contact form Model Rated coil voltage Minimum packing unit Single-side stable Fully sealed DPDT (2c) G6K-2F-RF 3, 4.5, 5, 12, 24 VDC 300 pcs/tray
BCP56; BCX56; BC56PA - Nexperia
assets.nexperia.com[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm 2 . In accordance with the Absolute Maximum Rating System (IEC 60134).
BAS16 series High-speed switching diodes - Nexperia
assets.nexperia.com[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB with 60 m copper strip line. [3] Single diode loaded. [4] Soldering point of cathode tab. [5] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
LT8645S/LT8646S (Rev. B) - Analog Devices
www.analog.comwith QFN Footprint) 3 –40°C to 125°C LT8645SIV#WPBF LT8646SEV#WPBF 8646SV LT8646SIV#WPBF • Contact the factory for parts specified with wider operating temperature ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures • LGA and BGA Package and Tray Drawings