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Product Specification PE4245 - psemi.com

Product Specification PE4245 - psemi.com

www.psemi.com

Page 1 of 8 Document No. 70-0104-07 │www.psemi.com ©2003-2009 Peregrine Semiconductor Corp. All rights reserved. The PE4245 RF Switch is designed to cover a broad ...

  Psemi

PE42553 - psemi.com

PE42553 - psemi.com

www.psemi.com

PE42553 SPDT RF Switch Page 6 of 20 DOC-76991-2 – (11/2018) www.psemi.com Switching Frequency The PE42553 has a maximum 25 kHz switching rate in normal mode (pin 13 tied to ground).

  Psemi

Failure Modes in Wire bonded and Flip Chip Packages

Failure Modes in Wire bonded and Flip Chip Packages

www.circuitinsight.com

Failure Modes in Wire bonded and Flip Chip Packages Mumtaz Y. Bora . Peregrine Semiconductor . San Diego, Ca. 92121 . mbora@psemi.com . Abstract . The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many

  Dome, Wire, Failure, Packages, Bonded, Flip, Chip, Failure modes in wire bonded and flip chip packages, Psemi

Flip Chip Package Qualification of RF-IC Packages

Flip Chip Package Qualification of RF-IC Packages

www.circuitinsight.com

Flip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora . Peregrine Semiconductor . San Diego, Ca. 92121 . mbora@psemi.com . Abstract. Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframe with wire

  Qualification, Packages, Flip, Chip, Psemi, Flip chip package qualification of rf

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