Search results with tag "Psemi"
PE42553 - psemi.com
www.psemi.comPE42553 SPDT RF Switch Page 6 of 20 DOC-76991-2 – (11/2018) www.psemi.com Switching Frequency The PE42553 has a maximum 25 kHz switching rate in normal mode (pin 13 tied to ground).
Product Specification PE4245 - psemi.com
www.psemi.comPage 1 of 8 Document No. 70-0104-07 │www.psemi.com ©2003-2009 Peregrine Semiconductor Corp. All rights reserved. The PE4245 RF Switch is designed to cover a broad ...
PE29102 - psemi.com
www.psemi.comDOC-81227-4 – (10/2017) Page 5 www.psemi.com PE29102 High-speed FET Driver Typical Performance Data Figure 2 through Figure 4 show the typical performance data @ +25 °C, V DD = 5V, load = 2.2 Ω resistor in series
Product Specification PE4283 - psemi.com
www.psemi.comProduct Specification PE4283 Page 3 of 11 Document No. 70-0177-05 │www.psemi.com ©2005-2008 Peregrine Semiconductor Corp. All rights reserved. Control Voltages ...
Product Specification PE4259 - psemi.com
www.psemi.comProduct Specification PE4259 Page 3 of 10 Document No. DOC-03694-3 │www.psemi.com ©2005-2016 Peregrine Semiconductor Corp. All rights reserved. Table 2. Pin Descriptions
Flip Chip Package Qualification of RF-IC Packages
www.circuitinsight.comFlip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora . Peregrine Semiconductor . San Diego, Ca. 92121 . mbora@psemi.com . Abstract. Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframe with wire
Product Specification - psemi.com
www.psemi.comRFX–RFC +18 dBm input power, 17–204 MHz –92 . dBc +32 dBm output power, 850 / 900 MHz –99 . dBc +32 dBm output power, 1800 / 1900 MHz –101
Product Specification PE64904 - psemi.com
www.psemi.comElectrostatic Discharge (ESD) Precautions . When handling this UltraCMOS® device, observe the same precautions that you would use with other ESD-sensitive devices.
Failure Modes in Wire bonded and Flip Chip Packages
www.circuitinsight.comFailure Modes in Wire bonded and Flip Chip Packages Mumtaz Y. Bora . Peregrine Semiconductor . San Diego, Ca. 92121 . mbora@psemi.com . Abstract . The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many