Reflow Sensitive
Found 9 free book(s)Handling, Packing, Shipping and Use of Moisture, Reflow ...
www.ipc.orgfor moisture/reflow sensitive SMDs along with the handling, packing and shipping requirements necessary to avoid moisture/ reflow related failures. Companion documents J-STD-020, J-STD-075 and JEP113 define the classification procedure and the labeling requirements, respectively.
Handling, Packing, Shipping and Use of Moisture/Reflow ...
www.ipc.orgReflow and/or Process Sensitive Components 1 FOREWORD The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage from the solder reflow process, such as cracks and delamination. This document describes the standardized levels of floor-
MAY 1999 JOINT INDUSTRY STANDARD - Naval Sea Systems …
www.navsea.navy.milreflow process, for a moisture sensitive device to be exposed to a factory ambient not exceeding 30 °C and 60% RH. Humidity Indicator Card (HIC): A card on which a moisture sensitive chemical is printed such that it will change color from blue to pink when the indicated relative humidity is exceeded. This is packed
Moisture Sensitivity Level 3 (MSL 3) Handling Guidelines
www.sparkfun.comSMT modules using SkyTraq’s devices listed in section 1 are moisture sensitive and should be handled within proper MSL 3 guidelines to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. A) Handling SMT Modules with MSL 3 Devices During Main Board Assembly 1.
IPC/JEDEC J-STD-020D - ElecFans
file.elecfans.comThe following photographs have been taken after the moisture soak and 3x reflow processes and are representative of the capacitors subjected to the moisture/ reflow sensitivity classification tests. 0603 C0G J Termination Ref 1. Final External Visual Ref 2. Final Internal Visual (100x mag) 0603 X7R J Termination Ref 3. Final External Visual Ref 4.
AN10778 PCB layout guidelines for NXP MCUs in BGA …
www.nxp.comalso of primary concern. For cost sensitive applications, minimizing the number of PCB layers required to route the BGA is a consideration. The BGA land pattern footprint plays a key role in solder joint reliability, and the number of PCB layers required to …
ESD9X3.3ST5G - ESD Protection Diode - ON Semiconductor
www.onsemi.comFor sensitive circuit elements it is important to limit the voltage that an IC will be exposed to during an ESD event to as low a voltage as possible. The ESD clamping voltage is the voltage drop across the ESD protection diode during an ESD event per the IEC61000−4−2 waveform. Since the IEC61000−4−2 was written as a pass/fail spec for ...
32.768kHz SMD LOW PROFILE CRYSTAL - Abracon
abracon.comABS07 32.768kHz SMD LOW PROFILE CRYSTAL ABRACON IS CERTIFIED ISO9001:2008 TIFIED 3.2 x 1.5 x 0.9 mm Dimensions: mm TAPE & REEL ATTENTION: A b r ac o nCp ti’ s du eO T S– m l- f hpr ; ci ,I w g Autom ot iv eA pl ca ns. b r’ du sp f yg fo M, L - nd ap ati requiring high reliability w h erc o mp n tf ailu d s/y.F ica q gb x
LTM8063 (Rev. C) - Analog Devices
www.analog.comLTM8063 1 Re Document Feedback For more information www.analog.com TYPICAL APPLICATION FEATURES APPLICATIONS DESCRIPTION 40VIN, 2A Silent Switcher µModule Regulator The LTM®8063 is a 40V IN, 2A continuous, 2.5A peak, step- down µModule® (power module) regulator. Included in the package are the switching controller, power switches,