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Handling, Packing, Shipping and Use of Moisture/Reflow ...
Reflow and/or Process Sensitive Components 1 FOREWORD The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage from the solder reflow process, such as cracks and delamination. This document describes the standardized levels of floor-
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www.ipc.org1 Scope Moisture absorption can cause delamination or other damage in printed boards subjected to soldering heat. This test is a process control tool to determine both the bulk
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www.ipc.orgfor moisture/reflow sensitive SMDs along with the handling, packing and shipping requirements necessary to avoid moisture/ reflow related failures. Companion documents J-STD-020, J-STD-075 and JEP113 define the classification procedure and the labeling requirements, respectively.
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www.sparkfun.comSMT modules using SkyTraq’s devices listed in section 1 are moisture sensitive and should be handled within proper MSL 3 guidelines to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. A) Handling SMT Modules with MSL 3 Devices During Main Board Assembly 1.
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