Transcription of 3D SiP(System-in-Package) 기술 동향 - :: DBguide.net
1 1367 2008. 10. 8. 14 3D SiP( system -in-Package) * ** ** ** SiP( system -in-Package) , . SiP , . SiP MCP(Multichip Package), BoB(Board-on-Board), SiP MCP, BoB SiP.
2 I. (Ubiquitous Sensor Network: USN) , , , . MCM (MultiChip Module) , KGD(Known Good Die) . , MCM SiP ( system -in-Package) 2 3 . MCM SiP * ETRI / ** ETRI / I.
3 II. SiP III. IV. 15 burn-in KGD , bare die , , , (time-to-market) SiP . , SiP , , MP3 USN , , , [1],[2]. SiP SiP . Tummala SiP IC SoP ( system -on-Package) RF, , IC [2].
4 ITRS(International Technology Roadmap for Semiconductors) (SiP : , [3]). SiP 3D SiP interconnection , (delay), , , . SoC( system -on-Chip) SiP , SiP (CAD) , , [4].
5 3D SiP MCP, BoB, SiP SiP . II. SiP 1. MCP MCP ISM(Internal Stack Module) 1367 2008. 10. 8. 16 PoP(Package-on-Package) [5]. MCP . ( 1 (a)) ISM [1]. ISM SDRAM flash, DSP+SRAM+Flash, ASIC+ , + [1]. 2006 8Gb 16 16 Gbyte 64 FBGA(Fine-Pitch Ball Grid Array) ISM.
6 KGD burn-in PoP . PoP bare die , SRAM+Flash, DDR DRAM . ( 1) (b), (c), (d) PoP . (b) [1], (c) [6], (d) PoP [7]. PoP , , I/O PoP [8]. MCP.
7 JEDEC JC- 63 ISM PoP . MCP {Flash, PSRAM, SRAM LPDRAM(SDR/DDR)}, {Flash, SRAM, LPDRAM(SDR/DDR)}, {x16 NOR/ NAND Flash, PSRAM, SRAM} [9]. , (c) folded package[6] (d) uni-stack package[7] ( 1) MCP (a) ISM[1] (b) PoP[1] 17 MCP [10]. ( 2 (a)) x16/x32 LPDRAM(SDR/DDR) x8 eMMC Flash LFBGA(Low-profile Fine-pitch ball grid array) MCP ball map.
8 Ball map SSN(Simultaneous Switching Noise), SI(Signal Integrity), crosstalk MCP MCP . ( 2 (b)) . interposer . ( 2 (b)) . SiP.
9 , MCP , , . (a) x16/x32 LPDRAM (SDR/DDR) x8 eMMC Flash ball map (b) x16 NAND ( 2) JEDEC 153-Ball LFBGA-Active MatrixTop view, Ball Side Down141312111098765432114131211109876543 21 ABCDEFGHJKLMNPABCDEFGHJKLMNPX16/X32 DRAM ONLYX32 DRAM ONLYeMMC ONLYNO CONNECTDO NOT NCNCNCNCNCD-VDDQD-VDDQD-VDDQD-VDDQD-VDDQ D-VDDQD-VDDQD-VDDQD-VSSQD-VSSQD-VSSQD-VS SQD-VSSQD-VSSQD-VSSQD-VSSQD-DQ16D-DQ21D- DQ20D-DQ17D-DQ23D-DQ22D-DQ19D-DQ16D-DM2D -VDDD-VDDD-VDDD-VDDD-VSSD-VSSD-VSSD-VSSM -VSSD-DQ15D-DQ14D-DQ13D-DQ12D-DQ11D-DQ10 D-DQ9D-DQ8D-DQ7D-DQ6D-DQ5D-DQ4D-DQ3D-DQ2 D-DQ1D-DM1D-VDDQD-DQS2D-CLKD-CLK#D-DQS1D -DQS3D-DM3D-DMQD-DQS0D-VDDD-DQ24D-DQ25D- DQ26D-DQ27D-DQ28D-DQ29D-DQ30D-DQ31M-VDDM -VSSM-VDDVSSVSSM-VDDM-VDDD-DQ10M-CLKM-VS SQM-VCSQM-VCDQM-VCDQM-VSSQM-VSSQM-CMDM-V DDQM-VDDQM-VDDQM-VDDQM-VSSQM-VSSIDAT7 DAT2 DAT6 DAT1 DAT5
10 DAT0 DAT4 DAT3D-A4D-TQD-A7 D-A8 D-A9D-A6 D-A11 D-A13D-WE#D-A10D-A1 D-A2 D-A3D-CEO#D-RAS#D-A7 D-A8 D-A9D-CAS#D-CE1#D-VSSD-A0D-A5D-A12D-CKE0 1367 2008. 10. 8. 18 2. BoB USN BoB(Board-on-Board) . , RF, , , , IC . , . < 1> IZM Fraunhofer eGrain , [11],[12].
