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Automotive 1.0A Variable Output LDO Regulator - …

Datasheet Automotive Variable Output LDO Regulator BDxxIC0 MEFJ-M. General Description BDxxIC0 MEFJ-M is a LDO Regulator with Output current The Output accuracy is 1% of Output voltage. With external resistance, it is available to set the Output voltage at random (from to ).It has package type: HTSOP-J8. Over current protection (for protecting the IC destruction by Output short circuit), circuit current ON/OFF switch (for setting the circuit 0 A at shutdown mode), and thermal shutdown circuit (for protecting IC from heat destruction by over load condition). are all built in. It is usable for ceramic capacitor and enables to improve smaller set and long-life. Features Package (Typ.) (Typ.) (Max.). High accuracy reference voltage circuit HTSOP-J8 x x Built-in Over Current protection circuit (OCP).

Product structure:Silicon monolithic integrated circuit This product is not designed protection against radioactive rays. 1/21 TSZ02201-0R6R0AN00300-1-2

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Transcription of Automotive 1.0A Variable Output LDO Regulator - …

1 Datasheet Automotive Variable Output LDO Regulator BDxxIC0 MEFJ-M. General Description BDxxIC0 MEFJ-M is a LDO Regulator with Output current The Output accuracy is 1% of Output voltage. With external resistance, it is available to set the Output voltage at random (from to ).It has package type: HTSOP-J8. Over current protection (for protecting the IC destruction by Output short circuit), circuit current ON/OFF switch (for setting the circuit 0 A at shutdown mode), and thermal shutdown circuit (for protecting IC from heat destruction by over load condition). are all built in. It is usable for ceramic capacitor and enables to improve smaller set and long-life. Features Package (Typ.) (Typ.) (Max.). High accuracy reference voltage circuit HTSOP-J8 x x Built-in Over Current protection circuit (OCP).

2 Built-in Thermal Shut Down circuit (TSD). With shut down switch AEC-Q100 Qualified Key Specifications Input power supply voltage range: to Output voltage range( Variable type): to Output voltage(Fixed type): Output current: (Max.). Shutdown current: 0 A(Typ.). Operating temperature range: -40 to +105 . HTSOP-J8. Typical Application Circuit VCC VO VCC VO. CIN R1 COUT CIN COUT. VO_S. EN FB EN. R2. GND FIN GND FIN. CIN,COUT : Ceramic Capacitor CIN,COUT : Ceramic Capacitor Product structure Silicon monolithic integrated circuit This product is not designed protection against radioactive rays. 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0R6R0AN00300-1-2. 1/21. TSZ22111 14 001 BDxxIC0 MEFJ-M Datasheet Ordering Information B D x x I C 0 M E F J - M E 2.

3 Part Output Voltage Output Automotive Package Packaging and forming specification Number voltage resistance current M :M series 00: Variable I:7V C0 EFJ:HTSOP-J8 E2:Emboss tape reel 10 12 15 18 25 30 33 50 60 70 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0R6R0AN00300-1-2. 2/21. TSZ22111 15 001 BDxxIC0 MEFJ-M Datasheet Block Diagram BD00IC0 MEFJ-M. GND (VO+ ) to VCC. 3 8. Ceramic F. OCP Capacitor SOFT. START. to Vo 1. Ceramic R1. Capacitor F. 2. EN FB R2. 5 TSD. Block Diagram BDxxIC0 MEFJ-M (Fixed type). VCC. 8. Ceramic F. OCP Capacitor SOFT. START. VO. EN. 1. 5 TSD Ceramic F. Capacitor GND 2. 3 VO_S. FIN. Block Diagram (Fixed type). Pin Configuration TOP VIEW. VO VCC. FB/Vo_s GND EN. Pin Description Pin No. Pin name Pin Function 1 VO Output pin 2 FB/Vo_s Feedback pin 3 GND GND pin 4 Non Connection (Used to connect GND or OPEN state.)

4 5 EN Enable pin 6 Non Connection (Used to connect GND or OPEN state.). 7 Non Connection (Used to connect GND or OPEN state.). 8 VCC Input pin Reverse FIN Substrate(Connect to GND). 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0R6R0AN00300-1-2. 3/21. TSZ22111 15 001 BDxxIC0 MEFJ-M Datasheet Absolute Maximum Ratings (Ta=25 ). Parameter Symbol Limits Unit Power supply voltage VCC *1 V. EN voltage VEN V. Power dissipation HTSOP-J8 Pd*2 2110 *2 mW. Operating Temperature Range Topr -40 to +105 . Storage Temperature Range Tstg -55 to +150 . Junction Temperature Tjmax +150 . *1 Not to exceed Pd *2 Reduced by for each increase in Ta of 1 over 25 . (when mounted on a board 70mm 70mm glass-epoxy board, two layer). Recommended Operating Ratings (Ta=25 ).

5 Parameter Symbol Min. Max. Unit Input power supply voltage VCC V. EN voltage VEN V. Output voltage setting range VO V. Output current IO A. Electrical Characteristics (Unless otherwise noted, EN=3V, Vcc= , R1=16k , R2= ). Parameter Symbol Temp Min. Typ. Max. Unit Conditions Circuit current at shutdown 25 - 0 5. ISD A EN=0V, OFF mode mode -40~105 - - 5. 25 - 250 500. Bias current ICC A. -40~105 - - 700. 25 - 25 50. Line regulation mV VCC =( Vo+ ) -40~105 - - 50. 25 - 25 75. Load regulation Reg IO mV IO=0 -40~105 - - 75. 25 - Minimum dropout Voltage VCO V VCC= , IO= -40~105 - - Output reference voltage 25 VFB V IO=0mA. ( Variable type) -40~105 - 25 Vo Vo Vo Output voltage(Fixed type) VO V IO=0mA. -40~105 Vo Vo Vo 25 0 - EN Low voltage VEN(Low) V. -40~105 0 - 25 - EN High voltage VEN(High) V.

6 -40~105 - 25 1 3 9. EN Bias current IEN A. -40~105 - - 9. 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0R6R0AN00300-1-2. 4/21. TSZ22111 15 001 BDxxIC0 MEFJ-M Datasheet Typical Performance Curves (Unless otherwise noted, EN=3V, VCC= , R1=16k , R2= ). Vo Vo 200mV/div 200mV/div Io Io 10usec/div 10usec/div Transient Response Transient Response (0 ) ( 0A). Co=1 F,Ta=-40 Co=1 F,Ta=25 . Vo Vo 200mV/div 200mV/div Io Io 10usec/div 2msec/div Transient Response Transient Response (0 ) ( 0A). Co=1 F,Ta=105 Co=1 F,Ta=-40 . 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0R6R0AN00300-1-2. 5/21. TSZ22111 15 001 BDxxIC0 MEFJ-M Datasheet Vo Vo 200mV/div 200mV/div Io Io 2msec/div 2msec/div Transient Response Transient Response ( 0A) ( 0A). Co=1 F,Ta=25 Co=1 F,Ta=105.

7 VEN VEN. 2V/div 2V/div Vcc Vcc 2V/div 2V/div Vo Vo 2V/div 2V/div 1msec/div 1msec/div Input sequence 1 Input sequence 1. Co=1 F,Ta=-40 Co=1 F,Ta=25 . 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0R6R0AN00300-1-2. 6/21. TSZ22111 15 001 BDxxIC0 MEFJ-M Datasheet VEN VEN. 2V/div 2V/div Vcc Vcc 2V/div 2V/div Vo Vo 2V/div 2V/div 1msec/div 20msec/div Input sequence 1 OFF sequence 1. Co=1 F,Ta=105 Co=1 F,Ta=-40 . VEN VEN. 2V/div 2V/div Vcc Vcc 2V/div 2V/div Vo Vo 2V/div 2V/div 20msec/div 20msec/div OFF sequence 1 OFF sequence 1. Co=1 F,Ta=25 Co=1 F,Ta=105 . 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0R6R0AN00300-1-2. 7/21. TSZ22111 15 001 BDxxIC0 MEFJ-M Datasheet VEN VEN. 2V/div 2V/div Vcc Vcc 2V/div 2V/div Vo Vo 2V/div 2V/div 1msec/div 1msec/div Input sequence 2 Input sequence 2.

8 Co=1 F,Ta=-40 Co=1 F,Ta=25 . VEN VEN. 2V/div 2V/div Vcc Vcc 2V/div 2V/div Vo Vo 2V/div 2V/div 1msec/div 20msec/div Input sequence 2 OFF sequence 2. Co=1 F,Ta=105 Co=1 F,Ta=-40 . 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0R6R0AN00300-1-2. 8/21. TSZ22111 15 001 BDxxIC0 MEFJ-M Datasheet VEN VEN. 2V/div 2V/div Vcc Vcc 2V/div 2V/div Vo Vo 2V/div 2V/div 20msec/div 20msec/div OFF sequence 2 OFF sequence 2. Co=1 F,Ta=25 Co=1 F,Ta=105 . ICC [ A]. VO [V]. Ta[ ] Ta[ ]. Ta-VO (IO=0mA) Ta-ICC. 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0R6R0AN00300-1-2. 9/21. TSZ22111 15 001 BDxxIC0 MEFJ-M Datasheet ISD [ A]. Ta [ ] IEN [ A] Ta [ ]. Ta-ISD (VEN=0V) Ta-IEN. VO [V]. ISD [ A]. IO [A]. VCC [V]. IO-VO. Vcc-IsD. (Ven=0V). 2012 ROHM Co., Ltd. All rights reserved.

9 TSZ02201-0R6R0AN00300-1-2. 10/21. TSZ22111 15 001 BDxxIC0 MEFJ-M Datasheet VO [V]. VO [V]. VCC [V]. Ta [ ]. Vcc-Vo O=0mA). TSD (IO(I=0mA). TSD. (Io=0mA). Vdrop [V]. VOVo[V]. [V]. IO [A] Ta [ ]. IO-VO Minimum dropout Voltage1. VCC= IO= . 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0R6R0AN00300-1-2. 11/21. TSZ22111 15 001 BDxxIC0 MEFJ-M Datasheet IO [A] ICC [ A]. IO [A]. Operation Safety area IO-ICC. Vdrop [V]. PSRR [dB]. IO [A]. Minimum dropout Voltage 2. PSRR (IO=0mA). VCC= , Ta=25 . 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0R6R0AN00300-1-2. 12/21. TSZ22111 15 001 BDxxIC0 MEFJ-M Datasheet Vdrop [V]. IO [A] Vdrop [V] IO [A]. Minimum dropout Voltage 2 Minimum dropout Voltage 2. VCC= , Ta=25 VCC=4V, Ta=25 . Vdrop [V]. IO [A]. Minimum dropout Voltage 5.

10 VCC= Ta=25 . 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0R6R0AN00300-1-2. 13/21. TSZ22111 15 001 BDxxIC0 MEFJ-M Datasheet Power Dissipation HTSOP-J8. Measure condition: mounted on a ROHM board, and IC. Substrate size: 70mm 70mm Power Dissipation :Pd [W]. (Substrate with thermal via). Solder the substrate and package reverse exposure heat radiation part IC only j-a= /W. 1-layer copper foil are :0mm 0mm . j-a= /W. 2-layer copper foil are :15mm 15mm . j-a= /W. 2-layer copper foil are :70mm 70mm . j-a= /W. 4-layer copper foil are :70mm 70mm . 0 j-a= /W. 0 25 50 75 100 125 150. Ambient :Ta Temperature [ ] :Ta [ ]. Thermal design should allow operation within the following conditions. Note that the temperatures listed are the allowed temperature limits, and thermal design should allow sufficient margin from the limits.


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