Automotive Recommended Product Selector Guide

1 Automotive Recommended Product Selector GuideMicrocontrollers Digital Signal Controllers Analog Memory Recommended Product Selector GuideTable of Contents8-bit PIC Microcontrollers ..516-bit PIC Microcontrollers ..12 PIC24F ..12 PIC24H/E ..14dsPIC DSCs .. 16dsPIC30F DSC Families ..16dsPIC33 DSC General Purpose Family ..16dsPIC33 DSC Motor Control and Power Conversion Family ..17dsPIC33 DSC SMPS and Digital Power Conversion Family ..19 Power Management .. 20 Hybrid PWM Controllers ..20 Linear Regulators.

2 21 Charge Pump DC-to-DC Converters ..21 CPU/System Supervisors ..21 Switching Regulators/PWM Controllers ..22 Power MOSFET Drivers ..22 Linear .. 23Op Amps ..23 Comparators ..23 Thermal Management .. 24 Temperature Sensors ..24 Mixed Signal .. 24 Successive Approximation Register (SAR) Analog-to-Digital Converters ..24 Digital-to-Analog Converters ..24 Energy Measurement ICs ..24 Digital Potentiometers ..25 Delta-Sigma Analog-to-Digital Converters ..25 Interface .. 26 CAN, Infrared, LIN Transceivers, Ethernet, Serial Peripherals, USB.

3 26mTouch AR1000 Resistive Touch Screen Controllers ..26 Motor Drivers ..26 Real-Time Clock/Calendars .. 26 Serial Memory Products .. 27 Serial SRAM ..27 Serial EEPROM ..27 MOST Devices ..28 Ethernet Devices ..28Hi-Speed USB 2 .0 ..28 Wireless Audio ..28 Capacitive Touch Sensors ..28 Automotive Grade Support ..29 Part Number Examples ..29 Terms and Definitions .. 29 Product Packages ..303 Automotive Recommended Product Selector GuideCommitment to the Relentless Quest for PerfectionMicrochip Technology has been an ISO/TS-16949-certified supplier since 2003.

4 Quality Comes First is at the top of our list of Guiding Values, which provide the core principles that define our culture and the way we do business . Our unique Aggregate System supports our commitment to exceptional quality, demonstrating an enterprise-wide dedication to continuous improvement and fostering an environment where every employee is responsible for quality .Microchip supports various Automotive quality initiatives: Zero defect initiatives Advanced Product /Process Quality Planning (APQP) AEC-Q100 Stress testing Production Part Approval Process (PPAP) 8D Reporting Product change notifi cation ISO/TS16949 Quality management ISO-26262 Functional safetyAUTOMOTIVE PRODUCTS GROUP 8-D REPORTDATE: August 28, 2007 SUBJECT.

5 Defect VIA REVISION: A FA #: C070816 MICROCHIP P/N: 24LC16B Trace Code: 06443WV MASK NO.: C5AR3 CUSTOMER: TRW Customer Part #: 59141550 Customer Tracking Number: 2041151.

6 USE TEAM APPROACH: Andy Birrell - Yield Enhancement Engineering Manager Roger Melcher - Wafer Manufacturing Engineer Anupam Menghal - APG Quality Engineer Craig Comeaux - Failure Analysis Engineer Steve Vernier - APG Product Engineer 2. DESCRIBE PROBLEM:One 24LC16B device was returned when the customer reported that device is failed in end user applications. The device failure has been confirmed during bench testing as well as ATE testing. All the pins appeared normal during initial curve tracing. Bench testing revealed that the device was drawing abnormally high current.

7 It is also confirmed that the multiple addresses in array are flipping with each read. The ATE testing also revealed that the returned unit may have failed the parametric or functional tests. Automotive PRODUCTS GROUP 8-D REPORTA ugust 28, 2007 SUBJECT: defect VIAFA #: C070816 MICROCHIP P/N: 24LC16B Trace Code: 06443WV Customer Part #: 59141550 Andy Birrell - Yield Enhancement Engineering Manager Roger Melcher - Wafer Manufacturing Engineer Anupam Menghal - APG Quality Engineer Craig Comeaux - Failure Analysis Engineer Steve Vernier - APG Product Engineer One 24LC16B device was returned when the failed in end user applications.

8 The device failure has been confirmed during All the pins appeared normal during initial that the device was drawing abnormally he multiple addresses in array are flipping vealed that the returned unit may have Automotive PRODUCTS GROUP 8-D REPORTA ugust 28, 2007 SUBJECT: defect VIAAndy Birrell - Yield Enhancement Engineering Manager Roger Melcher - Wafer Manufacturing Engineer Anupam Menghal - APG Quality Engineer Craig Comeaux - Failure Analysis Engineer Steve Vernier - APG Product Engineer One 24LC16B device was returned when the failed in end user applications.

9 The device failure has been confirmed during All the pins appeared normal during initial that the device was drawing abnormally he multiple addresses in array are flipping vealed that the returned unit may have Part Submission WarrantPart NameCust. Part NumberShown on Drawing NumberOrig. Part NumberEngineering Change LevelDatedAdditional Engineering ChangesN/ADatedSafety and/or Government RegulationPurchase Order Aid NumberChecking Aid Eng. Change LevelDatedORGANIZATION MANUFACTURING INFORMATIONCUSTOMER SUBMITTAL INFORMATIONO rganization Name & Supplier/Vendor CodeCustomer Name/DivisionStreet AddressBuyer/Buyer CodeUSACityRegionPostal CodeCountryApplicationMATERIALS REPORTINGHas customer-required Substances of Concern information been reported?

10 Submitted by IMDS or other customer format:Are polymeric parts identified with appropriate ISO marking codes?REASON FOR SUBMISSION (Check at least one)Initial submissionChange to Optional Construction or MaterialEngineering Change(s)Sub-Supplier or Material Source ChangeTooling: Transfer, Replacement, Refurbishment, or additionalChange in Part ProcessingCorrection of DiscrepancyParts produced at Additional LocationTooling Inactive > than 1 yearOther - please specifyREQUESTED SUBMISSION LEVEL (Check one)Level 1 - Warrant only (and for designated appearance items, an Appearance Approval Report)