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MTCH6102 Low-Power Projected Capacitive Touch …

MTCH6102 . MTCH6102 Low-Power Projected Capacitive Touch controller Description: Touch Features: Microchip's MTCH6102 is a turnkey Projected Gesture Detection and Reporting Capacitive Touch controller that simplifies adding Self-Capacitance Signal Acquisition gestures to Touch interface designs with Multiple Built-in Filtering Options industry-leading Low-Power performance. It utilizes up to 15 channels to support taps, swipes, and scrolling on Power Management: XY Touch pads and Touch screens. MTCH6102 allows designers to quickly and easily integrate Projected Configurable Sleep/Idle Frame Rates Capacitive Touch into their cost-sensitive, Low-Power Standby mode <500 nA (typical). application. MTCH6102 provides developers with a Active mode <12 uA possible flexible Touch -sensing solution to optimize common constraints of size, power and cost that are critical to Communication Interface: applications such as wearable devices, remote controls, gaming devices and track pads.

2014 Microchip Technology Inc. DS40001750A-page 1 Description: Microchip’s MTCH6102 is a turnkey projected capacitive touch controller that simplifies adding

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Transcription of MTCH6102 Low-Power Projected Capacitive Touch …

1 MTCH6102 . MTCH6102 Low-Power Projected Capacitive Touch controller Description: Touch Features: Microchip's MTCH6102 is a turnkey Projected Gesture Detection and Reporting Capacitive Touch controller that simplifies adding Self-Capacitance Signal Acquisition gestures to Touch interface designs with Multiple Built-in Filtering Options industry-leading Low-Power performance. It utilizes up to 15 channels to support taps, swipes, and scrolling on Power Management: XY Touch pads and Touch screens. MTCH6102 allows designers to quickly and easily integrate Projected Configurable Sleep/Idle Frame Rates Capacitive Touch into their cost-sensitive, Low-Power Standby mode <500 nA (typical). application. MTCH6102 provides developers with a Active mode <12 uA possible flexible Touch -sensing solution to optimize common constraints of size, power and cost that are critical to Communication Interface: applications such as wearable devices, remote controls, gaming devices and track pads.

2 I2C (up to 400 kbps). Both Polling and Interrupt Schemes Supported Sync Signal Allows for Host Frame Detection Applications: Field Upgradeable over I2C. Wearable Devices such as Headphones, Watches, Fitness Wristbands Operating Conditions: Track Pads and Computer Peripherals Input Devices with Configurable Button, Keypad to , -40 C to +85 C. or Scrolling Functions Any Interface with Single-Finger Gestures to Package Types: Swipe, Scroll, or Doubletap Controls 28-Pin SSOP. Home Automation Control Panels 28-Pin UQFN. Security Control Keypads Automotive Center Stack Controls Gaming Devices Remote Control Touch Pads Touch Sensor Support: Up to 15 Channels Sensor Sizes up to 120 mm ( ). Individual Channel Tuning for Optimal Sensitivity Works with Printed Circuit Board (PCB) Sensors, Film, Glass and Flexible Printed Circuit (FPC). Sensors Cover Layer Support: Plastic: up to 3 mm Glass: up to 5 mm Touch Performance: >200 Reports per Second (configurable).

3 12-Bit Resolution Coordinate Reporting 2014 Microchip Technology Inc. DS40001750A-page 1. MTCH6102 . Table of Contents MTCH6102 Block 3. Pin Diagrams .. 4. MTCH6102 Pinout 5. 6. Communication .. 8. Sensor Design Considerations .. 10. Operating 13. controller Commands .. 15. Touch Frame Control .. 16. Touch Data 17. Acquisition and Touch Parameters .. 18. Compensation RAM .. 20. 21. Gesture Features and Parameters .. 22. Configuring a Non-Default Application .. 26. Manufacturing Testing .. 27. Memory Map .. 28. Electrical Characteristics .. 31. Ordering Information .. 35. Packaging 36. The Microchip Web 43. Customer Change Notification 43. Customer Support .. 43. Worldwide Sales and 45. TO OUR VALUED CUSTOMERS. It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs.

4 Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, ( , DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies.

5 To determine if an errata sheet exists for a particular device, please check with one of the following: Microchip's Worldwide Web site; Your local Microchip sales office (see last page). When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at to receive the most current information on all of our products. DS40001750A-page 2 2014 Microchip Technology Inc. MTCH6102 . MTCH6102 BLOCK DIAGRAM. FIGURE 1-1: MTCH6102 BLOCK DIAGRAM. Host SYNC. controller TIMING ENGINE. Host INT. controller GESTURE. CORE RAM. Host ENGINE. I2 CdD. controller Touch . RAM. Touch . DECODING. CONFIGURATION. RAM. CVD ACQUISITION RX Sensor ENGINE Channels ACQUISITION. RAM. 2014 Microchip Technology Inc. DS40001750A-page 3. MTCH6102 . PIN DIAGRAMS. FIGURE 2-1: 28-PIN UQFN (4X4).

6 RESET. RX10. RX9. RX8. RX7. NC. NC. 28. 27. 26. 25. 24. 23. 22. RX11 1 21 RX6. RX12 2 20 RX5. NC 3 19 RX4. RX13 4 MTCH6102 18 RX3. VSS 5 17 VDD. NC 6 16 VSS. NC 7 15 RX2. 10. 11. 12. 13. 14. 8. 9. SDA. RX0. RX1. SYNC. RX14. INT. SCL. FIGURE 2-2: 28-PIN SSOP. RESET 1 28 NC. RX9 2 27 NC. RX10 3 26 RX8. RX11 4 25 RX7. RX12 5 24 RX6. MTCH6102 . NC 6 23 RX5. RX13 7 22 RX4. VSS 8 21 RX3. NC 9 20 VDD. NC 10 19 VSS. INT 11 18 RX2. SYNC 12 17 RX1. RX14 13 16 RX0. SCL 14 15 SDA. DS40001750A-page 4 2014 Microchip Technology Inc. MTCH6102 . MTCH6102 PINOUT. DESCRIPTION. TABLE 3-1: MTCH6102 PINOUT DESCRIPTION. Pin Name UQFN Pin SSOP Pin Pin Type Description RESET 26 1 I Master Reset with Internal Pull-up SCL 11 14 I/O I2C Clock SDA 12 15 I/O I2C Data Input/Output INT 8 11 O Interrupt Request Output SYNC 9 12 O Synchronous Frame Output RX0 13 16 I/O Touch Sensor Channel Input RX1 14 17 I/O.

7 RX2 15 18 I/O. RX3 18 21 I/O. RX4 19 22 I/O. RX5 20 23 I/O. RX6 21 24 I/O. RX7 22 25 I/O. RX8 23 26 I/O. RX9 27 2 I/O. RX10 28 3 I/O. RX11 1 4 I/O. RX12 2 5 I/O. RX13 4 7 I/O. RX14 10 13 I/O. VDD 17 20 Power Positive Supply VSS 5,16 8,19 Power Ground Reference N/C 3, 6, 7, 24, 25 6, 9, 10, 27, 28 N/C No Connect 2014 Microchip Technology Inc. DS40001750A-page 5. MTCH6102 . LAYOUT. FIGURE 4-1: TYPICAL APPLICATION CIRCUIT. V . V . F 10 F 20k 28. 27. 26. 25. 24. 23. 22. V . RX8. RX7. RESET. NC. NC. RX10. RX9. 1 RX11 RX6 21. 2 RX12 RX5 20. 3 NC RX4 19. 4 RX13 MTCH6102 RX3 18. 5 VSS VDD 17. V 6 NC VSS 16. 7 NC RX2 15. SYNC. RX14. SDA. RX0. RX1. SCL. INT. 10. 11. 12. 13. 14. 8. 9. Host controller DS40001750A-page 6 2014 Microchip Technology Inc. MTCH6102 . Decoupling Capacitors The use of decoupling capacitors on power-supply pins, such as VDD and VSS, is required. Consider the following criteria when using decoupling capacitors: 1.

8 Value and type of capacitor: A value of F (100 nF), 10-20V is recommended. The capacitor should be a low Equivalent Series Resistance (low ESR) capacitor and have resonance frequency in the range of 20 MHz and higher. It is further recommended that ceramic capacitors be used. 2. Placement on the Printed Circuit Board: The decoupling capacitors should be placed as close to the pins as possible. It is recommended that the capacitors be placed on the same side of the board as the device. If space is constricted, the capacitor can be placed on another layer on the PCB using a via;. however, ensure that the trace length from the pin to the capacitor is within one-quarter inch (6 mm) in length. 3. Handling high-frequency noise: If the board is experiencing high-frequency noise, upward of tens of MHz, add a second ceramic-type capacitor in parallel to the above-described decoupling capacitor.

9 The value of the second capacitor can be in the range of F to F. Place this second capacitor next to the primary decoupling capacitor. In high-speed circuit designs, consider implementing a decade pair of capacitances as close to the power and ground pins as possible (for example, F in parallel with F). 4. Maximizing performance: On the board layout from the power supply circuit, run the power and return traces to the decoupling capacitors first, and then to the device pins. This ensures that the decoupling capacitors are first in the power chain. It is equally important to keep the trace length between the capacitor and the power pins to a minimum, thereby reducing PCB track inductance. Bulk Capacitors The use of a bulk capacitor is recommended to improve power-supply stability. Typical values range from F to 47 F. This capacitor should be located as close to the device as possible.

10 2014 Microchip Technology Inc. DS40001750A-page 7. MTCH6102 . COMMUNICATION READING/WRITING REGISTERS. To access memory (both to read or write), the I2C. 2. I C Pin Specification transaction must start by addressing the chip with the Write bit set, then writing out a single byte of data DESCRIPTION representing the memory address to be operated on. The MTCH6102 Low-Power Projected Capacitive Touch After that, the host can choose to do either of the controller uses a standard register-based read/write following (see Figure 5-1): I2C protocol based upon the memory map. This 1. To write memory, continue writing [n] data bytes protocol is similar to many other devices such as (see Figure 5-2). temperature sensors and serial EEPROMs. Although 2. To read memory, restart the I2C transaction (via data can be read at any time (polling), an interrupt pin either a Stop-Start or Restart), then address the (INT) is provided for flexible integration options.


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