BM70/71 Bluetooth® Low Energy (BLE) Module …

1 2015-2017 Microchip Technology 1BM70/71 Features Qualified for Bluetooth SIG specifications Certified for FCC, IC, MIC, KCC, NCC, and SRRC radio regulations Certified by European R&TTE Directive Assessed Radio Module Compliant to RoHS Supports UART interface Supports transparent UART data service of BLE BM70 Module supports 3-channel pulse-width modulation (PWM) and BM71 Module supports 1-channel PWM Supports Precision Temperature Sensor (PTS) for ambient temperature detection Supports 12-bit ADC (ENOB=10 or 8 bits) for battery and voltage detection 8-channel ADC for BM70 Module and 5-channel ADC for BM71 Module are provided Featured with 18 general purpose I/O (GPIO) pins for the BM70 Module and 9 GPIO pins for the BM71 Module Featured with integrated 32 MHZ crystal Small and compact surface mount Module Castellated surface mount pads for easy and reli-able host PCB mountingRF Features ISM band GHz to GHz operation Channels: 0 to 39 Receive Sensitivity: typical -90 dBm (LE) Transmit Power: 0 dBm (typical) Received Signal Strength Indication (RSSI) monitor with 1 dB resolutionMAC/Baseband/Higher Layer Features Secure AES128 encryption Bluetooth.

2 GAP, GATT, SMP, L2 CAP and inte-grated public profile Create custom GATT services, refer to the BM70/71 Bluetooth Low Energy Module User s Guide (DS50002542) for details on creating GATT ser-vices I/O capability for Bluetooth authentication Configurable role as peripheral/central, client/serverFIGURE 1:BM70 MODULEFIGURE 2:BM71 MODULEA ntenna Integrated chip antenna (BM7xBLES1FC2)- Refer to Section Antenna , Ta b l e 4 - 1, and Ta b l e 4 - 2 for antenna performance specifications External antenna connection through RF pad (BM7xBLE01FC2)Power Management Two low-power modes supported, wake-up through GPIO or internal timer Average current: Tx= mA and Rx= mA with buck at VBAT input and ms connection interval, when transmitting full data packets to achieve a data rate of approximately kbpsBluetooth Low Energy (BLE) ModuleBM70/71DS60001372F-Page 2 2015-2017 Microchip Technology Conditions Operating voltage range: to Operating temperature: -40 C to +85 CApplications Internet of Things (IoT) Secure payment Wearable devices Home and security Health and fitness Beacons Industrial and data loggerGeneral DescriptionThe BM70/71 Module offers BLE solution for embed-ded applications.

3 It conforms to the Bluetooth to enhance the throughput and securityfor the IoT applications. It also supports Beacon tech-nology to enhance user experience for the IoT applica-tions and enables users to control the cloud andreceive data without opening the application through BM70/71 Module has Bluetooth stack integratedand is available in different form factors to optimize thespace, cost, and RF performance. The power-optimized design minimizes the current consumptionand extends battery life for portable and wearableapplications. 2015-2017 Microchip Technology 3BM70/71 Table of Device Overview .. Application Information .. Module Configuration .. Electrical Physical Dimensions .. Soldering Recommendations .. Ordering Guide .. 53 Appendix A: Certification 55 Appendix B: Revision 61TO OUR VALUED CUSTOMERSIt is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchipproducts.

4 To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined andenhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department viaE-mail at or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. Wewelcome your Current Data SheetTo obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any last character of the literature number is the version number, ( , DS30000000A is version A of document DS30000000).ErrataAn errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for currentdevices.

5 As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revisionof silicon and revision of document to which it determine if an errata sheet exists for a particular device, please check with one of the following: Microchip s Worldwide Web site; Your local Microchip sales office (see last page)When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you Notification SystemRegister on our web site at to receive the most current information on all of our 4 2015-2017 Microchip Technology : 2015-2017 Microchip Technology 5BM70 OVERVIEWThe BM70/71 Module is built around MicrochipTechnology IS1870/71 BLE Integrated Circuit (IC). TheIS1870/71 IC includes an on-board Bluetooth stack, apower management subsystem, a GHz transceiver,and a RF power amplifier.

6 The user can embedBluetooth functionality into any product using theBM70/71 BM70/71 Module enables the following features: Simple integration and programming Reduced development time Superior wireless Module with low-cost system Interoperability with Apple iOS and Android OS Wide range of applicationsThe BM70/71 Module can independently maintain alow-power wireless connection. Low-power and flexiblepower management features maximize the lifetime of theBM70/71 Module in battery operated devices. A wideoperating temperature range enable its applications inindoor and outdoor BM70/71 Module is a small, compact, and sur-face-mounted Module with castellated pads for easy andreliable host PCB mounting. The relatively small formfactor of the Module is targeted for applications, such aswearable sports, fitness devices and so DescriptionFigure 1-1 and Figure 1-2 illustrate an example of theBM70/71 Module -based system.

7 FIGURE 1-1:BM70 Module BLOCK DIAGRAM Note 1:SPI and I2C peripherals of the IS1870/71 IC can be enabled on the BM70/71 Module by changing thedefault firmware. For more details, contact local Microchip 6 2015-2017 Microchip Technology 1-2:BM71 Module BLOCK DIAGRAM Note 1:SPI and I2C peripherals of the IS1870/71 IC can be enabled on the BM70/71 Module by changing thedefault firmware. For more details, contact local Microchip representatives. 2015-2017 Microchip Technology 7BM70/71 Figure 1-3 through Figure 1-6 illustrate the pin diagramsof the BM70/71 1-3:BM70 BLE01FC2 PIN DIAGRAM FIGURE 1-4:BM70 BLES1FC2 PIN DIAGRAM BM70/71DS60001372F-Page 8 2015-2017 Microchip Technology 1-5:BM71 BLE01FC2 PIN DIAGRAM FIGURE 1-6:BM71 BLES1FC2 PIN DIAGRAM 2015-2017 Microchip Technology 9BM70/71Ta b l e 1 - 1 provides pin descriptions of the BM70/71m o d ul e.

8 TABLE 1-1: BM70/71 PIN DESCRIPTIONBM70 BLE01FC2BM70 BLES1FC2BM71 BLE01FC2BM71 BLES1FC2 Pin NameTypeDescription 1 GNDP owerGround reference 2 GNDP owerGround reference131213 GNDP owerGround reference241114 VBATP owerBattery input. Voltage range: to 10 BK_INPowerBuck input. Voltage range: to P2_2 DIOGPIO, default pull-high input PWM146 VDD_IOPowerI/O positive supply. Do not connect. Ensure VDD_IO and MCU I/O voltage are compatible57 VDD_IOPowerI/O positive supply. Do not connect. Ensure VDD_IO and MCU I/O voltage are compatible68 programmable ULPC LDO output for AON-logic and retention memory sup-ply. Internal use only, do not connect to other devices79 P2_3 DIGPIO, default pull-high input PWM2810 buck output.

9 Internal use only, do not connect to other devices 136P1_6 DIOP1_6 145P1_7 DIOP1_79111515P2_7/TX_INDDIOAIDOGPIO: P2_7 ADC Input: AD14TX_IND1012 P1_1 DIOAIGPIO: P1_1 ADC Input: AD9111323P1_2 DIOAIGPIO, default pull-high inputAD10121434P1_3 DIOAIGPIO, default pull-high inputAD111315811P0_0 DIOAIDIGPIO, default pull-high inputAD0 UART flow-control CTS1416 P1_0 DIOAIGPIO, default pull-high inputAD8151769P3_6 DIODODOGPIO, default pull-high inputPWM0 UART flow-control RTS16181616P2_0 DISystem configuration, default pull-high inputH: Application modeL: Test mode1719 P2_4 DIOGPIO, default pull-high input1820 NC No connectionLegend:A = AnalogD = DigitalI = Input O = OutputBM70/71DS60001372F-Page 10 2015-2017 Microchip Technology Inc.

10 1921710 RST_NDIM odule Reset (active-low) (internal pull up)202257 HCI_RXDDIHCI UART data input212348 HCI_TXDDOHCI UART data output2224 P3_1 DIOGPIO: P3_12325 P3_2 DIOGPIO: P3_22426 P3_3 DIOGPIO: P3_32527 P3_4 DIO GPIO: P3_42628 P3_5 DIODOGPIO, default pull-high inputLED12729 P0_7 DIOAIGPIO, default pull-high inputAD72830912P0_2/LEDDIOAIP02AD2293117 2 GNDP owerGround reference 32 GNDP owerGround reference30 1 BT_RFAIE xternal antenna connection (50 Ohm) Only for BM70 BLE01FC2 and BM71 BLE01FC2No connection for BM71 BLES1FC2 33 GNDP owerGround referenceLegend:A = AnalogD = DigitalI = Input O = OutputTABLE 1-1: BM70/71 PIN DESCRIPTION (CONTINUED)BM70 BLE01FC2 (Continued)BM70 BLES1FC2BM71 BLE01FC2BM71 BLES1FC2 Pin NameTypeDescription 2015-2017 Microchip Technology 11BM70/71 Table 1-2 provides the hardware features of theBM70/71 1:The GPIO, ADC and PWM numbers used are based on disabling the LED indication and UART Hardware flow-control (RTS/CTS) functionality, see Ta b l e 1 - :For a detailed explanation on GPIO, refer to the BM70/71 Bluetooth Low Energy Module User s Guide (DS50002542).