Data sheet acquired from Harris Semiconductor

1 data sheet acquired from Harris SemiconductorSCHS072B Revised July 2003 Lamp Test (LT), Blanking (BL), and LatchEnable or Strobe inputs are provided to testthe display, shut off or intensity-modulate it,and store or strobe a BCD code, different signals may be multiplexedand displayed when external multiplexingcircuitry is CD4511B types are supplied in 16-leadhermetic dual-in-line ceramic packages(F3A suffix), 16-lead dual-in-line plasticpackages (E suffix), 16-lead small-outlinepackages (NSR suffix), and 16-lead thinshrink small-outline packages (PW and PWRsuffixes).

2 These devices are similar to the 2003, Texas Instruments IncorporatedPACKAGE OPTION 1 PACKAGING INFORMATIONO rderable DeviceStatus(1)Package TypePackageDrawingPinsPackageQtyEco Plan(2)Lead/Ball Finish(6)MSL Peak Temp(3)Op Temp ( C)Device Marking(4/5)SamplesCD4511 BEACTIVEPDIPN1625Pb-Free(RoHS)CU NIPDAUN / A for Pkg Type-55 to 125CD4511 BECD4511 BEE4 ACTIVEPDIPN1625Pb-Free(RoHS)CU NIPDAUN / A for Pkg Type-55 to 125CD4511 BECD4511 BFACTIVECDIPJ161 TBDA42N / A for Pkg Type-55 to 125CD4511 BFCD4511BF3 AACTIVECDIPJ161 TBDA42N / A for Pkg Type-55 to 125CD4511BF3 ACD4511 BNSRACTIVESONS162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CD4511 BCD4511 BNSRG4 ACTIVESONS162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CD4511 BCD4511 BPWACTIVETSSOPPW1690 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM511 BCD4511 BPWG4 ACTIVETSSOPPW1690 Green (RoHS& no Sb/Br)

3 CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM511 BCD4511 BPWRACTIVETSSOPPW162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM511B (1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new : TI has announced that the device will be discontinued, and a lifetime-buy period is in : Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new : Device has been announced but is not in production. Samples may or may not be : TI has discontinued the production of the device.

4 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check for the latest availabilityinformation and additional product content : The Pb-Free/Green conversion plan has not been (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean Semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe.

5 The component is otherwise considered Pb-Free (RoHS compatible) as defined (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed by weightin homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder OPTION 2 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses.

6 Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.

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8 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackageTypePackageDrawingPi nsSPQReelDiameter(mm)ReelWidthW1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm) MATERIALS Materials-Page 1*All dimensions are nominalDevicePackage TypePackage DrawingPinsSPQL ength (mm)Width (mm)Height (mm) MATERIALS Materials-Page 2 IMPORTANTNOTICET exasInstrumentsIncorporated(TI) reservesthe rightto makecorrections,enhancements,improvement sand otherchangesto itssemiconductorproductsand servicesper JESD46,latestissue,and to discontinueany productor serviceper JESD48, latestrelevantinformationbeforeplacingor dersand shouldverifythat suchinformationis currentand s publishedtermsof sale for semiconductorproducts( )

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