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TPS23754EVM-383EVM: Evaluation Module for TPS23754

www.ti.com EVM Assembly Drawings and Layout Guidelines 7.3 EMI Containment • Use compact loops for dv/dt and di/dt circuit paths (power loops and gate drives) • Use minimal, yet thermally adequate, copper areas for heat sinking of components tied to switching

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  Switching, Power, Module, Tps23754evm

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