Transil™ - st.com

1 July 2010 Doc ID 5544 Rev 121/1010 SMAJT ransil Features Peak pulse power: 400 W (10/1000 s) kW (8/20 s) Stand off voltage range: from 5 V to 188 V Unidirectional and bidirectional types Low leakage current: A at 25 C 1 A at 85 C Operating Tj max: 150 C High power capability at Tj max: 270 W (10/1000 s) JEDEC registered package outlineComplies with the following standards IEC 61000-4-2 level 4 15 kV (air discharge) 8 kV (contact discharge) IEC 61000-4-5 (see Table 3 for surge level) MIL STD 883G, method 3015-7 Class 3B 25 kV HBM (human body model) Resin meets UL 94, V0 MIL-STD-750, method 2026 solderability EIA STD RS-481 and IEC 60286-3 packing IPC 7531 footprintDescriptionThe SMAJ Transil series has been designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2, and MIL STD 883, method 3015, and electrical over stress according to IEC 61000-4-4 and 5.

2 These devices are generally used against surges below 400 W (10/1000 s).Planar technology makes these devices suitable for high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over are packaged in SMA (SMA footprint in accordance with IPC 7531 standard).TM: Transil is a trademark of STMicroelectronicsKAUnidirectionalBidire ctionalSMA(JEDEC DO-214AC) ID 5544 Rev 121 Characteristics Figure characteristics - definitionsFigure definition for electrical characteristicsTable maximum ratings (Tamb = 25 C) SymbolParameterValueUnitPPPPeak pulse power dissipation (1)Tj initial = Tamb400 WTstgStorage temperature range -65 to +150 C TjOperating junction temperature range-55 to +150 CTLM aximum lead temperature for soldering during 10 C1.

3 For a surge greater than the maximum values, the diode will fail in resistancesSymbolParameterValueUnitRth(j -l)Junction to leads30 C/WRth(j-a)Junction to ambient on printed circuit on recommended pad layout120 C/WVCLVBRVRMIRMIRIPPVIIRMIRIPPVRMVBRVCLV CLVBRVRMIRMIRIPPVIIRMIRIPPVRMVBRVCLVCLVB RVRMIRMIRIPPVIIFVFVCLVBRVRMIRMIRIPPVIIFV FU nidirectionalBidirectionalSymbol ParameterVStand-off voltageVBreakdown voltageVClamping voltageILeakage current @ VIPeak pulse currentTVoltage temperature coefficientVForward voltage dropRDynamic resistanceRMBRCLRMRMPPFD Repetitive pulse currenttr= rise time ( s)tp= pulse duration time ( s)trtpSMAJC haracteristicsDoc ID 5544 Rev 123/10 Table characteristics - parameter values (Tamb = 25 C)Order codeIRM max@VRMVBR @IR (1)VCL @IPP 10/1000 sRD (2)10/1000 sVCL @IPP 8/20 sRD (2)8/20 s T (3)25 C 85 Cmintypmaxmaxmax AVVmAVA(4) VA(4) 10-4/ Pulse test : tp < 50 ms2.

4 To calculate maximum clamping voltage at other surge level,use the following formula: VCLmax = VCL - RD x (IPP - IPPappli) where IPPappli is the surge current in the application3. To calculate VBR or VCL versus junction temperature, use the following formulas: VBR @ TJ = VBR @ 25 C x (1 + T x (TJ 25)), VCL @ TJ = VCL @ 25 C x (1 + T x (TJ 25))4. Surge capability given for both directions for unidirectional and bidirectional ID 5544 Rev 12 Figure voltage versus peak pulse current (exponential waveform, maximum values)Figure pulse power dissipation versus initial junction temperature Figure pulse power versus exponential pulse duration(Tj initial = 25 C)01002003004005000255075100125150175 Ppp(W)Tj( C) + +01 PPP(kW)Tjinitial = 25 CtP(ms) sTjinitial=25 C8/20 s10 (A)VCL(V)SMAJC haracteristicsDoc ID 5544 Rev 125/10 Figure capacitance versus reverse applied voltage for unidirectional types (typical values)Figure capacitance versus reverse applied voltage for bidirectional types (typical values)101001000100001101001000C(pF)F=1 MHzVOSC=30 mVRMSTj=25 (V)101001000100001101001000C(pF)

5 F=1 MHzVOSC=30 mVRMSTj=25 (V)Figure forward voltage drop versus peak forward current(typical values)Figure variation of thermal impedance, junction to ambient, versus pulse durationFigure 10. Thermal resistance, junction to ambient, versus copper surface under each leadFigure 11. Leakage current versus junction temperature (typical values)IFM(A) + + + CTj=125 CVFM(V) + + + +03 Zth(j-a)/Rth(j-a)Recommended pad layoutPCB FR4, copper thickness = 35 mtP(s)R( C/W)th(j-a) (cm )PCB FR4, copper thickness = 35 mIR(nA) + + + +03255075100125150VR=VRMVRM 10 VVR=VRMVRM<10 VTj( C)Ordering information schemeSMAJ6/10 Doc ID 5544 Rev 122 Ordering information scheme Figure 12. Ordering information schemeSM A J 85 CA - TRSurface mountPeak pulse powerA = 400 W Transil in SMAS tand off voltage85 = 85 VTypeA = UnidirectinalCA = BidirectionalDelivery modeTR = Tape and reelSMAJP ackage informationDoc ID 5544 Rev 127/103 Package information Case: JEDEC DO-214AC molded plastic over planar junction Terminals: solder plated, solderable per MIL-STD-750, Method 2026 Polarity: for unidirectional types the band indicates cathode.

6 Flammability: epoxy is rated UL94V-0 RoHS packageIn order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. Table 13. Footprint dimensions in mm (inches) Figure 14. Marking layout(1)1. Marking layout can vary according to assembly ( ) ( ) ( ) ( )( )ywwezxxxe: ECOPACK complianceXXX: MarkingZ: Manufacturing locationY: YearWW: weekCathode bar ( unidirectional devices only )Package informationSMAJ8/10 Doc ID 5544 Rev 12 Table codeMarkingOrder informationDoc ID 5544 Rev 129/104 Ordering information 5 Revision history Table informationOrder codeMarkingPackageWeightBase qtyDelivery modeSMAJxxxA/CA-TR(1)1.

7 Where xxx is nominal value of VBR and A or CA indicates unidirectional or bidirectional version. See Table 3 for list of available devices and their order codesSee Table 5 on page g5000 Tape and reelTable revision historyDateRevisionChangesSeptember-1998 5 BPrevious package dimensions update. Reference A1 max. changed from ( ) to ( ).10-Dec-20047 Template layout update. No content unidirectional marking on cover page and Figure 14. Changed Figure 13. Foot ECOPACK statement. Reformatted to current updated for low leakage typographical error in Package timescale in Figure ID 5544 Rev 12 Please Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve theright to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at anytime, without ST products are sold pursuant to ST s terms and conditions of are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes noliability whatsoever relating to the choice, selection or use of the ST products and services described license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document.

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