Transcription of AN 353: SMT Board Assembly Process Recommendations
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AN 353: SMT Board Assembly Process Recommendations
October 2011 Altera Note 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos are trademarks of Altera Corporation and registered in the Patent and Trademark Office and in other countries. All other words and logos identified as trademarks or service marks are the property of their respective holders as described at Altera warrants performance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or Innovation DriveSan Jose, CA 9001:2008 RegisteredSMT Board Assembly ProcessRecommendationsThis application note describes the Board Assembly Process used in surface-mount technology (SMT) and focuses on the SMT component-to- Board reflow soldering Process and rework soldering if you are removing or replacing individual components on already-assembled information in this application note is for your reference Tin-Lead and RoHS-Compliant Lead- free ComponentsAltera
The lead-free alloy used for BGA solder balls has a melting point of 217°C. This alloy requires a minimum reflow temperature of 235°C to ensure good wetting.
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