Transcription of Lead-free Solder Assembly
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Lead-free Solder Assembly
Pollution Prevention Case StudyLead- free Solder AssemblyOverview of findingsAll aspects of electronic Solder Assembly need to be considered dur-ing conversion to a Lead-free process. A comprehensive evaluation process that includes selection of which Solder , flux paste, printed circuit board surface finish, components, equipment ( Assembly and rework), and processes to use as part of an overall plan is essential for non-lead Solder conversion is mature, the evaluation of materials and components is likely to identify trade-offs. The performance of the no-clean andwater-soluble Solder pastes that were tested varied widely.
• Process window for reflow has a much lower tolerance range for lead-free solder assembly. Even though this was a known factor before conversion began, it continues to be a challenge.
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