Transcription of NanoStar & NanoFree 300 m Solder Bump Wafer Chip-Scale ...
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NanoStar & NanoFree 300 m Solder Bump Wafer Chip-Scale ...
Application ReportSBVA017 - February 20041 NanoStart & NanoFreet 300mm Solder Bump WaferChip-Scale Package ApplicationJim RossonHigh Performance Analog MAKE PackagingABSTRACTThe NanoStartWafer Chip-Scale Package (WCSP) is a family of bare die packagesdeveloped for applications that require the smallest possible package. WCSP provideselectrical interconnection via Solder spheres attached to the die and is aligned with JEDEC package standard MO 211[1]. NanoStar , with advanced materials engineering technology,has demonstrated excellent board level reliability that allows it to be used without the need forunderfill adhesives, unlike conventional Solder -bumped Flip Chip devices.
SBVA017 NanoStar & NanoFree 300 m Solder Bump Wafer Chip-Scale Package Application 5 2 Physical Description 2.1 Package Characteristics The NanoStar package family is a Die Size BGA as identified by the JEDEC standards organiza-
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