Transcription of Through Hole Solder Joint Evaluation - IPC
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Through Hole Solder Joint Evaluation - IPC
Association Connecting Electronics IndustriesTraining & Reference GuideThrough hole Solder Joint EvaluationIPC DRM-PTH-FReferences: IPC-A-610 Rev. F July 2014 IPC 2015 3000 Lakeside Drive, Suite 309-S Bannockburn, IL 60015-1219 +1 (tel.) +1 (fax) email: rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other repro-ductions of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United free images for page 10, Target; page 11, Target; page 19, lower Target; page 25, Acceptable Omni Training, 9513 Business Center Dr., Suite J, Rancho Cucamonga, CA 91730, used by permission. IPC-DRM-PTH Rev. F 2m Rev.
3 Through Hole Solder Joint Evaluation Training and Reference Guide Terminology Terminology Solder Destination Side: The side of a through hole assem-bly containing the most com-
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