© Copyright 2013 2016 Xilinx

Zynq-7000 All Programmable SoC Software …

Zynq-7000 All Programmable SoC Software Developers Guide UG821 (v12.0) September 30, 2015

  Developer, Guide, Software, Programmable, Software developers guide

Zynq-7000 SoC Data Sheet: Overview (DS190) - All …

Zynq-7000 SoC Data Sheet: Overview DS190 (v1.11.1) July 2, 2018 www.xilinx.com Product Specification 3 Programmable Logic Xilinx 7 Series Programmable Logic

  Overview, Programmable, Programmable logic, Logic, Xilinx, Programmable logic xilinx

7 Series FPGAs Data Sheet: Overview (DS180)

7 Series FPGAs Data Sheet: Overview DS180 (v2.6) February 27, 2018 www.xilinx.com Product Specification 2 Spartan-7 FPGA Feature Summary Table 2: Spartan-7 FPGA Feature Summary by Device

  Series, Fpgas, Xilinx, Series fpgas

Accelerating OpenCV Applications with Zynq-7000 …

Reference Design XAPP1167 (v3.0) June 24, 2015 www.xilinx.com 2 The design flow for this application note generally follows the steps below: 1. Develop and execute an OpenCV application on Desktop.

  Applications, With, Accelerating, Xilinx, Accelerating opencv applications with zynq, Opencv, Zynq

Product Obsolete/Under Obsolescence …

Efficient Shift Registers, LFSR Counters, and Long Pseudo-Random Sequence Generators 2 XAPP 052 July 7,1996 (Version 1.1) Divide-By 5 to 16 Counter in Two CLBs

XILINX ARTIX-7 FPGAS: A NEW PERFORMANCE …

Key Capability Overview . Smallest Package • Low-cost, wire-bond, chip-scale BGA packaging • Available in a 10x10mm package for maximum system integration

  Performance, Fpgas, Xilinx, A new performance

Platform Flash In-System Programmable …

Platform Flash In-System Programmable Configuration PROMs DS123 (v2.19) June 6, 2016 www.xilinx.com Product Specification 2 R When the FPGA is in Master Serial mode, it generates a

  Xilinx, Flash

Spartan-3AN FPGA Family Data Sheet (DS557) - Xilinx

Spartan-3AN FPGA Family: Introduction and Ordering Information DS557 (v4.2) June 12, 2014 www.xilinx.com Product Specification 3 Architectural Overview

  Specification, Xilinx

Xilinx XAPP1113 Designing Efficient Digital Up and …

Introduction XAPP1113 (v1.0) November 21, 2008 www.xilinx.com 2 R • DDC design files for multi-channel MRI, targeting both Virtex-5 and Spartan®-DSP

  Efficient, Designing, Digital, Xilinx, Xilinx xapp1113 designing efficient digital up and, Xapp1113

Xilinx DS060 Spartan and Spartan-XL FPGA …

Spartan and Spartan-XL FPGA Families Data Sheet 2 www.xilinx.com DS060 (v2.0) March 1, 2013 Product Specification R Product Obsolete/Under Obsolescence General Overview Spartan series FPGAs are implemented with a regular, flex-

  Spartan, Xilinx, Families, Spartan and spartan xl

7 Series FPGAs Data Sheet: Overview (DS180) - Xilinx

packaging for smallest PCB footprint. † Artix®-7 Family: Optimized for low power applications requiring serial transceivers and high DSP and logic throughput. Provides the lowest total bill of materials cost for high-throughput, cost-sensitive applications. † Kintex®-7 Family: Optimized for best price-performance with a 2X

  Footprint, Xilinx, Pcb footprint

The Chip Scale Package (CSP) - Intel

increase the number of interconnects while saving PCB routing space. Other manufacturing ... Another advantage of the Easy BGA package is its constant package size/footprint in respect to memory density upgrades and die shrinks. A key element of embedded applications is the need for long product life cycles (5-7 years) that require the same ...

  Intel, Footprint

G6K(U)-2F(P)-RF(-S, -T) - Omron

P: PCB terminals 4. Special Function RF: High-frequency compatible 5. Terminal Shape None: Standard S: Small footprint T: Compatible with 3 GHz Relay Function Enclosure rating Contact form Model Rated coil voltage Minimum packing unit Single-side stable Fully sealed DPDT (2c) G6K-2F-RF 3, 4.5, 5, 12, 24 VDC 300 pcs/tray

  Footprint

BCP56; BCX56; BC56PA - Nexperia

[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm 2 . In accordance with the Absolute Maximum Rating System (IEC 60134).

  Footprint

BAS16 series High-speed switching diodes - Nexperia

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB with 60 m copper strip line. [3] Single diode loaded. [4] Soldering point of cathode tab. [5] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

  Printed, Board, Circuit, Footprint, Printed circuit board

3-Axis Digital Compass IC HMC5883L - Adafruit Industries

PCB Pad Definition and Traces The HMC5883L is a fine pitch LCC package. Refer to previous figure for recommended PCB footprint for proper package centering. Size the traces between the HMC5883L and the external capacitors (C1 and C2) to handle the 1 ampere peak current pulses with low voltage drop on the traces. Stencil Design and Solder Paste

  Footprint, Pcb footprint

LT8645S/LT8646S (Rev. B) - Analog Devices

with QFN Footprint) 3 –40°C to 125°C LT8645SIV#WPBF LT8646SEV#WPBF 8646SV LT8646SIV#WPBF • Contact the factory for parts specified with wider operating temperature ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures • LGA and BGA Package and Tray Drawings

  Devices, Analog devices, Analog, Footprint