CMOS Manufacturing Process
(a) Silicon base material (b) After oxidation and deposition of negative photoresist (c) Stepper exposure Photoresist SiO 2 UV-light Patterned optical mask Exposed resist SiO 2 Si-substrate Si-substrate Si-substrate SiO 2 SiO 2 (d) After development and etching of resist, chemical or plasma etch of SiO 2 (e) After etching (f) Final result after ...
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