i.MX 6Dual/6Quad Applications Processor Data Sheet for ...

1 NXP Semiconductors Document Number: IMX6 DQIEC. Rev. 6, 11/2018. Data Sheet : Technical Data MCIMX6 QxCxxxxC. MCIMX6 QxCxxxxD. MCIMX6 QxCxxxxE. MCIMX6 DxCxxxxC. MCIMX6 DxCxxxxD. MCIMX6 DxCxxxxE. 6 Dual/6 Quad Applications Processors for Industrial Products Package Information FCPBGA Package 21 x 21 mm, mm pitch Ordering Information See Table 1. 1 Introduction 1 Introduction .. 1. Ordering Information .. 2. Features .. 4. The 6 Dual/6 Quad processors represent the latest Signal Naming Convention .. 7. achievement in integrated multimedia Applications 2 Architectural Overview .. 8. Block Diagram .. 8. processors. These processors are part of a growing 3 Modules List .. 9. family of multimedia-focused products that offer high Special Signal Considerations.

2 17. Recommended Connections for Unused Analog performance processing and are optimized for lowest Interfaces.. 17. power consumption. 4 Electrical Characteristics.. 18. Chip-Level Conditions .. 18. The 6 Dual/6 Quad processors feature advanced Power Supplies Requirements and Restrictions .. 31. implementation of the quad Arm Cortex -A9 core, Integrated LDO Voltage Regulator Parameters .. 32. PLL Electrical Characteristics .. 34. which operates at speeds up to 800 MHz. They include On-Chip Oscillators .. 35. 2D and 3D graphics processors, 1080p video processing, I/O DC Parameters .. 36. I/O AC Parameters .. 41. and integrated power management. Each Processor Output Buffer Impedance Parameters.. 45. provides a 64-bit DDR3/DDR3L/LPDDR2-800 memory System Modules Timing.

3 48. Multi-Mode DDR Controller (MMDC).. 60. interface and a number of other interfaces for connecting General-Purpose Media Interface (GPMI) Timing. 60. peripherals, such as WLAN, Bluetooth , GPS, hard External Peripheral Interface Parameters .. 69. drive, displays, and camera sensors. 5 Boot Mode Configuration .. 130. Boot Mode Configuration Pins.. 130. Boot Devices Interfaces Allocation .. 131. 6 Package Information and Contact Assignments .. 133. Signal Naming Convention .. 133. 21 x 21 mm Package Information .. 133. 7 Revision History .. 156. NXP Reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. Introduction The 6 Dual/6 Quad processors are specifically useful for Applications such as the following: The 6 Dual/6 Quad processors offers numerous advanced features, such as: Multilevel memory system The multilevel memory system of each Processor is based on the L1.

4 Instruction and data caches, L2 cache, and internal and external memory. The processors support many types of external memory devices, including DDR3, DDR3L, LPDDR2, NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND , and managed NAND, including eMMC up to rev Smart speed technology The processors have power management throughout the device that enables the rich suite of multimedia features and peripherals to consume minimum power in both active and various low power modes. Smart speed technology enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectations. Dynamic voltage and frequency scaling The processors improve the power efficiency of devices by scaling the voltage and frequency to optimize performance.

5 Multimedia powerhouse The multimedia performance of each Processor is enhanced by a multilevel cache system, Neon MPE (Media Processor Engine) co- Processor , a multi-standard hardware video codec, 2 autonomous and independent image processing units (IPU), and a programmable smart DMA (SDMA) controller. Powerful graphics acceleration Each Processor provides three independent, integrated graphics processing units: an OpenGL ES 3D graphics accelerator with four shaders (up to 200 MTri/s and OpenCL support), 2D graphics accelerator, and dedicated OpenVG accelerator. Interface flexibility Each Processor supports connections to a variety of interfaces: LCD. controller for up to four displays (including parallel display, , MIPI display, and LVDS. display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host and other), 10/100/1000 Mbps Gigabit Ethernet controller, and a variety of other popular interfaces (such as UART, I2C, and I2S serial audio, SATA-II, and PCIe-II).

6 Advanced security The processors deliver hardware-enabled security features that enable secure e-commerce, digital rights management (DRM), information encryption, secure boot, and secure software downloads. The security features are discussed in detail in the 6 Dual/6 Quad security reference manual (IMX6DQ6 SDLSRM). Integrated power management The processors integrate linear regulators and internally generate voltage levels for different domains. This significantly simplifies system power management structure. Ordering Information Table 1 shows examples of orderable part numbers covered by this data Sheet . This table does not include all possible orderable part numbers. The latest part numbers are available on If your desired part number is not listed in the table, or you have questions about available parts, see or contact your NXP representative.

7 6 Dual/6 Quad Applications Processors for Industrial Products, Rev. 6, 11/2018. 2 NXP Semiconductors Introduction Table 1. Example Orderable Part Numbers Speed1 Temperature Part Number Quad/Dual CPU Options Package Grade Grade MCIMX6Q7 CVT08AC 6 Quad Includes VPU, GPU 800 MHz Industrial 21 mm x 21 mm, mm pitch, FCPBGA (lidded). MCIMX6Q7 CVT08AD 6 Quad Includes VPU, GPU 800 MHz Industrial 21 mm x 21 mm, mm pitch, FCPBGA (lidded). MCIMX6Q7 CVT08AE 6 Quad Includes VPU, GPU 800 MHz Industrial 21 mm x 21 mm, mm pitch, FCPBGA (lidded). MCIMX6D7 CVT08AC 6 Dual Includes VPU, GPU 800 MHz Industrial 21 mm x 21 mm, mm pitch, FCPBGA (lidded). MCIMX6D7 CVT08AD 6 Dual Includes VPU, GPU 800 MHz Industrial 21 mm x 21 mm, mm pitch, FCPBGA (lidded). MCIMX6D7 CVT08AE 6 Dual Includes VPU, GPU 800 MHz Industrial 21 mm x 21 mm, mm pitch, FCPBGA (lidded).

8 1 If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 792 MHz. Figure 1 describes the part number nomenclature to identify the characteristics of the specific part number you have (for example, cores, frequency, temperature grade, fuse options, silicon revision). Figure 1. applies to the 6 Dual/6 Quad. The two characteristics that identify which data Sheet a specific part applies to are the part number series field and the temperature grade (junction) field: The 6 Dual/6 Quad Automotive and Infotainment Applications Processors data Sheet (IMX6 DQAEC) covers parts listed with A (Automotive temp) . The 6 Dual/6 Quad Applications Processors for Consumer Products data Sheet (IMX6 DQCEC). covers parts listed with D (Commercial temp) or E (Extended Commercial temp).

9 The 6 Dual/6 Quad Applications Processors for Industrial Products data Sheet (IMX6 DQIEC). covers parts listed with C (Industrial temp) . The Ensure that you have the right data Sheet for your specific part by checking the temperature grade (junction) field and matching it to the right data Sheet . If you have questions, see or contact your NXP representative. 6 Dual/6 Quad Applications Processors for Industrial Products, Rev. 6, 11/2018. NXP Semiconductors 3. Introduction MC IMX6 X @ + VV $$ % A. Qualification level MC Silicon revision1 A. Prototype Samples PC Rev C. Mass Production MC Rev D. Special SC Rev E. Part # series X Fusing %. 6 Quad Q Default setting A. 6 Dual D HDCP enabled C. Part differentiator @ Frequency $$. Industrial with VPU, GPU, no MLB 7 800 MHz (Industrial grade).

10 2 08. Automotive with VPU, GPU 6 852 MHz (Automotive grade) 08. Consumer with VPU, GPU 5 1 GHz 3 10. Automotive with GPU, no VPU 4 GHz 12. Temperature Tj + Package type RoHS. Extended commercial: -20 to +105 C E FCPBGA 21x21 (lidded) VT. Industrial: -40 to +105 C C. FCPBGA 21x21 (non lidded) YM. Automotive: -40 to +125 C A. 1. See the \imx6series Web page for latest information on the available silicon revision. 2. If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 792 MHz. 3. If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 996 MHz. Figure 1. Part Number Nomenclature 6 Quad and 6 Dual Features The 6 Dual/6 Quad processors are based on Arm Cortex-A9 MPCore platform, which has the following features: Arm Cortex-A9 MPCore 4xCPU Processor (with TrustZone ).