2.5 V/3.0 V High Precision Reference Data Sheet AD780

1 V. High Precision Reference data Sheet AD780 . FEATURES FUNCTIONAL BLOCK DIAGRAM. +VIN DNC. Pin programmable V or V output 2 7. Ultralow drift: 3 ppm/ C max AD780 . High accuracy: V or V 1 mV max Low noise: 100 nV/ Hz R10 R11. Noise reduction capability DNC 1. 6 VOUT. Low quiescent current: 1 mA max R13. Output trim capability Q6. Plug-in upgrade for present references Q7 R16. R5 5 TRIM. Temperature output pin R14. TEMP 3. Series or shunt mode operation ( V, V) R15. R4. 4 8. GND O/P SELECT. 00841-001. DNC. DNC = DO NOT CONNECT TO THIS PIN GND. Figure 1. GENERAL DESCRIPTION. The AD780 is an ultrahigh Precision band gap Reference voltage The AD780 is a pin compatible performance upgrade for the that provides a V or V output from inputs between V LT1019(A) and the AD680. The latter is targeted toward and 36 V. Low initial error and temperature drift combined with low power applications. low output noise and the ability to drive any value of capacitance The AD780 is available in three grades in PDIP and SOIC.

2 Make the AD780 the ideal choice for enhancing the performance packages. The AD780AN, AD780AR, AD780BN, AD780BR, of high resolution analog-to-digital converters (ADCs) and and AD780CR are specified for operation from 40 C to +85 C. digital-to-analog converters (DACs), and for any general-purpose Precision Reference application. A unique low headroom design PRODUCT HIGHLIGHTS. facilitates a V output from a V 10% input, providing a 1. The AD780 provides a pin programmable V or V. 20% boost to the dynamic range of an ADC over performance output from a 4 V to 36 V input. with existing V references. 2. Laser trimming of both initial accuracy and temperature The AD780 can be used to source or sink up to 10 mA, and can coefficients results in low errors over temperature without be used in series or shunt mode, thus allowing positive or negative the use of external components. The AD780BN has a output voltages without external components.

3 This makes it maximum variation of mV from 40 C to +85 C. suitable for virtually any high performance Reference application. 3. For applications that require even higher accuracy, an Unlike some competing references, the AD780 has no region of optional fine-trim connection is provided. possible instability. The part is stable under all load conditions 4. The AD780 noise is extremely low, typically 4 mV p-p when a 1 F bypass capacitor is used on the supply. from Hz to 10 Hz and a wideband spectral noise density of typically 100 nV/ Hz. This can be further A temperature output pin on the AD780 provides an output reduced, if desired, by using two external capacitors. voltage that varies linearly with temperature, allowing the part 5. The temperature output pin enables the AD780 to be to be configured as a temperature transducer while providing a configured as a temperature transducer while providing a stable V or V output. stable output Reference .

4 Rev. I Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No One Technology Way, Box 9106, Norwood, MA 02062-9106, license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Tel: 2002 2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. Technical Support AD780 data Sheet TABLE OF CONTENTS. Features .. 1 Temperature Functional Block Diagram .. 1 Temperature Output Pin ..7. General Description .. 1 Temperature Transducer Circuit ..8. Product Highlights .. 1 Supply Current Over Temperature ..8. Revision History .. 2 Turn-On Time ..8. 3 Dynamic Performance.

5 9. Absolute Maximum Ratings .. 4 Line Thermal Resistance .. 4 Precision Reference for High Resolution 5 V data 4 Converters .. 10. ESD Caution .. 4 V Reference from 5 V Supply .. 10. Theory of Operation .. 5 Negative ( V) Reference .. 10. Applying the 6 Outline Dimensions .. 11. Noise Performance .. 6 Ordering Guide .. 12. Noise Comparison .. 7. REVISION HISTORY. 8/2017 Rev. H to Rev. I 12/2012 Rev. E to Rev. F. Added Thermal Resistance Section and Table 3; Renumbered Updated Outline Dimensions .. 11. Sequentially .. 4 Changes to Ordering Guide .. 12. 10/2015 Rev. G to Rev. H 5/2004 Rev. D to Rev. E. Changes to Table 3 .. 4 Updated Format .. Universal Changes to Notes Section .. 4 Changes to Temperature Transducer Circuit Section ..8. Changes to Ordering Guide .. 12. 8/2015 Rev. F to Rev. G. Changed NC to DNC .. Throughout 1/2004 Rev. C to Rev. D. Added Solder Heat Shift Parameter, Table 1 .. 3 Changes to Specifications ..2.

6 Added Table 3; Renumbered Sequentially .. 4 Updated Ordering Guide ..3. Changes to Figure 3 .. 4 Updated Outline Dimensions .. 10. Change to Notes Section .. 4. Changes to Ordering Guide .. 12 5/2002 Rev. B to Rev. C. Updates to Packages .. 10. Rev. I | Page 2 of 12. data Sheet AD780 . SPECIFICATIONS. TA = 25 C, VIN = 5 V, unless otherwise noted. Table 1. AD780AN/AD780AR AD780CR AD780BN/AD780BR. Parameter Min Typ Max Min Typ Max Min Typ Max Unit OUTPUT VOLTAGE. V Out V. V Out V. SOLDER HEAT SHIFT. Mean mV. Sigma mV. OUTPUT VOLTAGE DRIFT1. 40 C to +85 C 7 7 3 ppm/ C. 55 C to +125 C 20 20 ppm/ C. LINE REGULATION. V Output, 4 V +VIN 36 V, TMIN to TMAX 10 10 10 V/V. V Output, V +VIN 36 V, TMIN to TMAX 10 10 10 V/V. LOAD REGULATION, SERIES MODE. Sourcing 0 mA < IOUT< 10 mA 50 50 50 V/mA. TMIN to TMAX 75 75 75 V/mA. Sinking 10 mA < IOUT< 0 mA 75 75 75 V/mA. 40 C to +85 C 75 75 75 V/mA. 55 C to +125 C 150 150 150 V/mA. LOAD REGULATION, SHUNT MODE.

7 I < ISHUNT< 10 mA 75 75 75 V/mA. QUIESCENT CURRENT, V SERIES MODE2. 40 C to +85 C mA. 55 C to +125 C mA. MINIMUM SHUNT CURRENT mA. OUTPUT NOISE. Hz to 10 Hz 4 4 4 V p-p Spectral Density, 100 Hz 100 100 100 nV/ Hz LONG-TERM STABILITY3 20 20 20 ppm/1000 Hr TRIM RANGE %. TEMPERATURE PIN. Voltage Output @ 25 C 500 560 620 500 560 620 500 560 620 mV. Temperature Sensitivity mV/ C. Output Resistance 3 3 3 k . SHORT-CIRCUIT CURRENT TO GROUND 30 30 30 mA. TEMPERATURE RANGE. Specified Performance (A, B, C) 40 +85 40 +85 40 +85 C. Operating Performance (A, B, C)4 55 +125 55 +125 55 +125 C. 1. Maximum output voltage drift is guaranteed for all packages. 2. V mode typically adds 100 A to the quiescent current. Also, Iq increases by 2 A/V above an input voltage of 5 V. 3. The long-term stability specification is noncumulative. The drift in subsequent 1,000 hour periods is significantly lower than in the first 1,000 hour period. 4. The operating temperature range is defined as the temperature extremes at which the device will still function.

8 Parts may deviate from their specified performance outside their specified temperature range. Rev. I | Page 3 of 12. AD780 data Sheet ABSOLUTE MAXIMUM RATINGS. 96 mils Table 2. GND TEMP +VIN. Parameter Values +VIN to Ground 36 V. TRIM Pin to Ground 36 V. TEMP Pin to Ground 36 V. Power Dissipation (25 C) 500 mW. Storage Temperature 65 C to +150 C 67 mils Lead Temperature 300 C. (Soldering 10 sec). GND. Output Protection Output safe for indefinite short to ground and momentary short to VIN. ESD Classification Class 1 (1000 V). Stresses at or above those listed under Absolute Maximum 00841-003. TRIM VOUT Ratings may cause permanent damage to the product. This is a O/P SELECT. stress rating only; functional operation of the product at these Figure 3. Die Layout or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond NOTES. the maximum operating conditions for extended periods may Both VOUT pads must be connected to the output.

9 Affect product reliability. Die Thickness: The standard thickness of Analog Devices, Inc. DNC 1. O/PSELECT. 8 (DNC OR GND). bipolar dice is 10 mil 1 mil. +VIN 2 AD780 7 DNC Die Dimensions: The dimensions given are the maximum possible TEMP 3 TOP VIEW 6 VOUT. die size. GND 4 (Not to Scale) 5 TRIM. Backing: The standard backside surface is silicon (not plated). 00841-002. NOTES Analog Devices does not recommend gold-backed dice for most 1. DNC = DO NOT CONNECT TO THIS PIN. applications. Figure 2. Pin Configuration, 8-Lead PDIP and SOIC Packages Edges: A diamond saw is used to separate wafers into dice, thus THERMAL RESISTANCE providing perpendicular edges halfway through the die. In Thermal performance is directly linked to PCB design and contrast to scribed dice, this technique provides a more uniform operating environment. Careful attention to PCB thermal die shape and size. The perpendicular edges facilitate handling design is required.

10 (such as tweezer pickup), while the uniform shape and size simplify substrate design and die attach. Table 3. Thermal Resistance1. Package Type JA JC2 Unit Top Surface: The standard top surface of the die is covered by a layer of passivation. All areas are covered except bonding pads N-8 C/W. and scribe lines. R-8 160 C/W. Surface Metallization: The metallization to Analog Devices 1. Values in Table 3 are calculated based on standard JEDEC test conditions unless otherwise specified. bipolar dice is aluminum/copper. The minimum thickness is 2. 100um TIM is used for the JC test. TIM is assumed to have W/mK. 10,000 . Table 4. Die Physical Characteristics Bonding Pads: All bonding pads have a minimum size of Parameter Value Units mil by mil. The passivation windows have a minimum Die Size 67 96 mil size of mil by mil. Back Grind Thickness 10 mil ESD CAUTION. Bond Pad Opening Size 89 136 m Top Metal Composition AlCu ( ) %. Passivation Oxynitride Polyimide None m Die Marker 780.