IC Reliability 20091023 - isu.edu.tw

1 1IC (IC Package Reliability Testing introduction )Meng-Kae Shih, ASE GroupOctober 23, 2009 Presented bya2 85282 0953083610 3 Contents introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT) Stress Simulations4 Contents introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT)5 introduction 5 1.

2 2. 3. 6 introduction What is stress =( ) =( )FAF: ( =N)A: ( m2 mm2) ( N/m2=Pa) (stress, ) (index) 7 introduction (Stress) (Deformation) (Strength of materials) (Mechanics of deformable bodies)DelaminationsPackageSolderPCBW arpage8 IntroductionNormal stress - F FF Shear stress- 9 introduction Normal strain ( )LLLLLLLL L =H = HHHHHHHH Shear strain ( )

3 101D Tensile Bar Test Dog Bone and Strain-meterDog bone dimensionW x L x H---10 x 60 x3 mm wLHWith strain meter11 Dog-bone Tensile Test Necking (large deformation)Fig.: Animation of tensile bar : Load and extension curve of ?12 introduction Thermal deformation25 0C125 0C-40 0 CExpandingShrinking 1 2 Fig.: Thermal bulking of railways13 introduction Thermal strain tand (Coefficient of thermal expansions) LLT1 0CT2 0C T=T2-T1Lt =TETCt == ..LTelongation** == 14 Thermal expansion mismatchCompound 30 ppm/ CSubstrate 15 ppm/ CHeatingCoolingSubstrateCompoundEa(T), aa(T), naEb(T), ab(T), nb2 Ltt ++=101d)(141222 TTabTbababaTEEEEEEt ConvexConcave Bi-material curvatureWarpage is dependent on components thickness, Young s modulus and CTE Glass transition temperature - TgT tT Tg 1 2Tg16 Contents introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT)

4 17 StressWaferPackagePCBP roductGrinding, saw, die attach, wirebondimpact,Molding, ball mount, test, Reliability test, shipping, SMT, test, shipping, Assembling, stress, Drop, bend, vibration, Stress (thermal stress) LL LL = e*E = - * T*E19 Thermal deformation - warpage (warpage) CTE T > 0 ; 1> 2=L 1 TL 2 T+(convex)=20 Thermal deformation - warpage CompoundDieEpoxySubstrate C=10~20/40~70 ppm/oC D=3 ppm/oC E=40/200 ppm/oC S=16 ppm/oC25oCRoom temperature 25oCRoom temperature 255oCSMT reflow(Before SMT)SMT failedCTE mismatch21 Contents introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT)CompoundDieEpoxySubstrate C=10~20/40~70 (PPM/oC) D=3 (PPM/oC)

5 E=40/200 (PPM/oC) S=16 (PPM/oC)Thermal Stress (CTE mismatch)TemperatureVariationThermal Stress23 LevelT&H Cond.(oC/ %RH)Floor Life Time after Unpack12345685/85, 168 HRS85/60, 168 HRS30/60, 192 HRS30/60, 96 HRS30/60, 72 HRS30/60, 6 HRSU nlimited1 Year168 HRS (1 Week)72 HRS (3 Days)48 HRS (2 Days)6 HRSM oisture Sensitivity LevelsMoisture24 Reflow ProfileProfile condition (for Pb-free) Between 155 ~ 165 C: 60 ~ 90 sec. Above 220 C: 60 ~ 90 sec. Peak temperature : 250 ~ 255 CProfile condition (for Sn-Pb) Between 145 ~ 155 C: 60 ~ 90 sec.

6 Above 183 C: 60 ~ 90 sec. Peak temperature : 210 ~ 220 CCompoundDieEpoxySubstrateDelaminationDe laminationMoisture soak IR reflowCompoundDieEpoxySubstratePopcornPo pcornMoisture soak IR reflowCompoundDieEpoxySubstrateDie CrackDie Crack31 Solder Joint Failuree-Solder ball crack--TCTS older bump crack--TCTS older IMC crack--DropSolder bump crack--EM32 Contents introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT)

7 33 WaferFirst Level Packaging(Chip to IC packaging)Second Level Packaging(Package assembly to circuit card)Third Level Packaging(Circuit card assembly to backplane)Electron Product Component34 SPEC NumberSPEC Title64-31-0000-0137 SOP OF STATIC MTS - PULL TEST - 64-31-0000-0138 SOP OF STATIC MTS - AMD PULL TEST - AMD 64-31-0000-0139 SOP OF SURFACE MOUNT PROCEDURE FOR STRESS Reliability LAB 64-31-0000-0140 SOP OF DYE PENETRATION TEST 64-31-0000-0141 SOP OF ASE FREE DROP TESTASE 64-31-0000-0142 SOP OF KAWASAKI DROP TESTKAWASAKI.

8 64-31-0000-0143 EIAJ 3-POINT CYCLIC BENDING TEST USING IN DYNAMIC MTSEIAJ 3 64-31-0000-0144 EIAJ COMPRESSION TESTEIAJ 64-31-0000-0145 SOP OF STATIC MTS - SHEAR TEST - SPEC List Of Experiment SOP 64-31-0000-0137~64-31-0000-015435 SPEC NumberSPEC Title64-31-0000-0146 SOP OF 3-POINT BEND TEST FOR ATI BOARDATI 3 64-31-0000-0147 SOP OF JEDEC DROP TEST JEDEC 64-31-0000-0148 DIE STRENGTH TEST BY MICRO FORCE TESTERDIE - 64-31-0000-0149 SOP OF STATIC MTS - COMPRESSION TEST - 64-31-0000-0150 SOP OF MONOTONIC 3 AND 4 POINT BEND TEST 64-31-0000-0151 SOP OF COMPRESSION TEST BY MICRO FORCE TESTER 64-31-0000-0653 SOP OF SHADOW MOIRE 64-31-0000-0153 SOP OF LEAD PULL TEST BY MICRO FORCE TESTER 64-31-0000-0154 SOP OF 4-POINT CYCLIC BENDING TEST IN DYNAMIC MTS SPEC List Of Experiment SOP 64-31-0000-0137~64-31-0000-015436 Mechanical ReliabilityStrain Rate Effect02468100102030405060 True tensile stress

9 (MPa)True tensile strain (%)Strain-rate (s-1) 10-4 10-3 10-2 10-1 High strain-rateLow strain-rateStrain-rate (log10, s-1)0-2-4-6642 Thermal stressCyclic bendDrop/shockUniaxial tensile testBall impact testHopkinson Bar testBall shear testEDEST ransition zoneMaterials become apparently stiffer at high strain rate Warpage Measurement Validate Finite Element Modeling Optimize Process & Reflow Profiles Shadow Moir 38 GratingLight SourceCCD CameraMonitorVCRC omputerSampleShadow Moir ComponentsabsourceobserverLWpD tantan+=pww (Out-of plane displacement)p (pitch)

10 (CCD ) Shadow Moir - PrincipleTherMoirecan simulate soldering processes(wave, convective, IR reflow) and quantify out-of-plane displacements at any given temperature(s). Thefringe patterns and 3D surface plots shown are froman 8 X 8 multi-layer printed wiring board going through an IR reflow process. Shadow Moir Shadow Moir Measurement Results26 C150 C150 C225 C26 CShadow Moir Warpage at Different Temperature43 Die strength (Micro-force tester)