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Chapter 6 VLSI Testing

Chapter 6 VLSI Testing

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time factory testing, burn in, since the system is capable ... wafer surface, or in the processing chemicals Oxide breakdown Primarily caused by insufficient oxygen at the interface of silicon (Si) and silicon dioxide (SiO ... level as at the chip level Similarly, if …

  Testing, Chapter, Levels, Burn, Wafer, Vlsi, Chapter 6 vlsi testing

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