NCV7707, NCV7707B Door-Module Driver-IC

1 Semiconductor Components Industries, LLC, 2016 March, 2018 Rev. 41 Publication Order Number: ncv7707 /DNCV7707, ncv7707 BDoor- module Driver-ICThe ncv7707 /B is a powerful Driver IC for automotive bodycontrol systems. The IC is designed to control several loads in the frontdoor of a vehicle. The monolithic IC is able to control mirror functionslike mirror positioning, heating and folding including theelectro chromic mirror feature. Besides two half bridge outputs tocontrol lock and safe lock motors, the device features four high sideoutputs to drive LEDs or incandescent bulbs (up to 10 W). To allowmaximum flexibility, all lighting outputs can be PWM controlled thruPWM inputs (external signal source) or by an internal programmablePWM generator unit.

2 The ncv7707 /B is controlled thru a 24 bit SPIinterface with in frame Operating Range from V to 28 V Six High Side and Six Low Side drivers Connected asHalf Bridges 2x Half bridges Iload = A; RDS(on) = W @ 25 C 2x Half Bridges Iload = 3 A; RDS(on) = 300 mW @ 25 C 2x Half Bridges Iload = 6 A; RDS(on) = 150 mW @ 25 C Four High Side Lamp drivers 2x LED; Iload = A; RDS(on) = W @ 25 C 2x 10 W; configurable as LED Driver; Iload = A;RDS(on) = 300 mW @ 25 C One High Side Driver for Mirror Heating; Iload = 6 A;RDS(on) = 100 mW @ 25 C Electro Chromic Mirror Control 1x 6 Bit Selectable Output Voltage Controller 1x LS for EC Control; Iload = A; RDS(on) = W @ 25 C Independent PWM Functionality for All Outputs Integrated Programmable PWM Generator Unit for All Lamp DriverOutputs Programmable Soft start Function to Drive Loads with HigherInrush Currents as Current Limitation Value Multiplex Current Sense Analog Output for Advanced LoadMonitoring Very Low Current Consumption in Standby Mode Charge Pump Output to Control an External Reverse PolarityProtection MOSFET 24 Bit SPI Interface for Output Control and Diagnostic Protection Against Short circuit, Overvoltage and Overtemperature AEC Q100 Qualified and PPAP Capable SSOP36 EP Power Package This is a Pb Free DeviceTypical Applications De centralized Door Electronic Systems Body Control Units (BCUs)

3 SSOP36 EPCASE 940 ABMARKING blank or BA= Assembly LocationWL= Wafer LotYY= YearWW= Work WeekG= Pb Free PackageDevicePackageShipping ORDERING INFORMATION For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationBrochure, BRD8011 EP(Pb Free)1500 / Tape &ReelNCV7707 DQBR2G SSOP36 EP(Pb Free)1500 / Tape &ReelNCV7707, RegisterVSPower on ResetUndervoltageLockoutOvervoltageLocko utCHPC hargepumpVSVSNCV7707/BVSVSVSVSVSCONTROL_ 1 RegisterCONTROL_2 RegisterPWM_7/8 RegisterSTATUS_0 RegisterECFBECONDACEC ControlGNDVSVSVSVSCONTROL_3 RegisterSTATUS_1 Register6 MUXSTATUS_2 RegisterCONTROL_0 RegisterCONFIG RegisterSpecial Function RegisterDriverInterfaceDiagnosticshort circuitopenloadoverloadovertemperatureov ervoltageundervoltagePWMUnitOUT1 OUT2 OUT5 OUT5 OUT3 OUT7 OUT8 OUT9 OUT11 OUT11 OUT6 OUT10 OUT4 OUT4 PWM1 PWM2 ISOUT/PWM2 PWM1 SCLKSOVCCCSBSIF igure 1.

4 Block DiagramNCV7707, 2. Application DiagramLINCANVbatRs/LED/LEDOUT10 LEDLED10W10 WNCV7707/BOUT6 OUT4 Low SideSwitchOUT5 Low SideSwitchHigh SideSwitchHigh SideSwitchVCCOUT2 OUT3 High SideSwitchLow SideSwitchLow SideSwitchOUT1 Charge PumpVSCHPPWMC urrent SensingmirrordefrosterGNDOUT11mirrorx axissafe lockOUT10 OUT9 OUT8 OUT7 ECONLow SideSwitchPower on ResetHigh SideSwitchHigh SideSwitchmirrorfoldmirrory axisHigh SideSwitchCAN/LIN SBC(NCV7462)mCLIN(NCV7321)SwitchesHigh SideSwitchECFBECM24 bitSerialDataInterfacePWM1 CSBSCLKSOSIISOUT/PWM2lockDACEC ControlblinkerfootsteplightsafetylightLo gic INLogic ControlPWM Generator UnitHigh SideSwitchsafetylightHigh SideSwitchLow SideSwitchLow SideSwitchHigh SideSwitchHigh SideSwitchProtection:short circuitopen loadover temperatureVS undervoltageVS overvoltage( W)( W)( W)( W)( W)( W)( W)( W)( W)( W)( W)( W)( W)( W)( W)( W)( W) ( W)GND1361819 GNDF igure 3.

5 Pin Connections (Top View)OUT11 OUT1 OUT2 OUT3 VSVSSIISOUT/PWM2 CSBSOVCCSCLKVSVSOUT4 OUT4 GNDOUT11 OUT10 OUT9 ECFBOUT8 OUT7 VSVSPWM1 CHPECONVSVSOUT6 OUT5 OUT5 GNDNCV7707, FUNCTION DESCRIPTIONPin NamePin TypeDescription1 GNDG roundGround Supply (all GND pins have to be connected externally)2 OUT11HS driver OutputHeater Output (has to be connected externally to pin 35)3 OUT1 Half bridge driverOutputMirror common Output4 OUT2 Half bridge driverOutputMirror x/y control Output5 OUT3 Half bridge driverOutputMirror x/y control Output6 VSSupplyBattery Supply Input (all VS pins have to be connected externally)7 VSSupplyBattery Supply Input (all VS pins have to be connected externally)8 SIDigital InputSPI interface Serial Data Input9 ISOUT /PWM2 Digital Input / Analog OutputPWM control Input / Current Sense Output.

6 This pin is a bidirectional pin. Depend-ing on the selected multiplexer bits, an image of the instant current of the corres-ponding HS stage can be read out. This pin can also be used as PWM control input pin for OUT5, OUT8 and InputSPI interface Chip Select11 SODigital OutputSPI interface Serial Data Output12 VCCS upplyLogic Supply Input13 SCLKD igital InputSPI interface Shift Clock14 VSSupplyBattery Supply Input (all VS pins have to be connected externally)15 VSSupplyBattery Supply Input (all VS pins have to be connected externally)16 OUT4 Half bridge driverOutputDoor Lock Output (has to be connected externally to pin 17)17 OUT4 Half bridge driverOutputDoor Lock Output (has to be connected externally to pin 16)18 GNDG roundGround Supply (all GND pins have to be connected externally)19 GNDG roundGround Supply (all GND pins have to be connected externally)

7 20 OUT5 Half bridge driverOutputDoor Lock Output (has to be connected externally to pin 21)21 OUT5 Half bridge driverOutputDoor Lock Output (has to be connected externally to pin 20)22 OUT6 Half bridge driverOutputSafe Lock / Mirror Fold Output23 VSSupplyBattery Supply Input (all VS pins have to be connected externally)24 VSSupplyBattery Supply Input (all VS pins have to be connected externally)25 ECONECM driver OutputElectrochromic mirror control DAC output. If the Electrochrome feature is selec-ted, this output controls an external Mosfet, otherwise it remains in high imped-ance state. If the electrochrome feature is not used in the application and not selected via SPIthe pin can be connected to OutputReverse Polarity FET Control Output27 PWM1 Digital InputPWM control Input for OUT1 4, OUT6/7, OUT9, OUT1128 VSSupplyBattery Supply Input (all VS pins have to be connected externally)29 VSSupplyBattery Supply Input (all VS pins have to be connected externally)30 OUT7HS driver OutputLED / Bulb Output31 OUT8HS driver OutputLED / Bulb Output32 ECFBECM Input / OutputElectrochromic Mirror Feedback Input, Fast discharge transistor Output33 OUT9HS driver OutputLED Output34 OUT10HS driver OutputLED Output35 OUT11HS driver OutputHeater Output (has to be connected externally to pin 2)

8 36 GNDG roundGround Supply (all GND pins have to be connected externally) Heat slugGroundSubstrate; Heat slug has to be connected to all GND pinsNCV7707, MAXIMUM RATINGSS ymbolRatingMinMaxUnitVsPower supply voltage Continuous supply voltage Transient supply voltage (t < 500 ms, clamped load dump ) supply voltage at all logic pins (SO, SI, SCLK, CSB, PWM1) + monitor output / PWM2 logic input + pump output (the most stringent value is applied) 25Vs 2540Vs + 15 VVoutx,Vecon, VecfbStatic output voltage (OUT1 11, ECON, ECFB) + Output current 55 AIout2/3 OUT2/3 Output current Output current 1010 AIout7/8 OUT7/8 Output current 55 AIout9/10 OUT9/10 Output current Output current 1010 AIout_ecfbECFB Output Voltage, Human Body Model (HBM).

9 (100 pF, 1500 W) (Note 1) All pins Output pins OUT1 6 and ECFB to GND (all unzapped pins grounded) 2 424kVESD_CDMESD according to CDM (Charge Device Model) (Note 1) All pins Corner pins 500 750500750 VTJO perating junction temperature range 40150 CTstgStorage temperature range 55150 CMSLM oisture sensitivity level (Note 2)MSL3 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be This device series incorporates ESD protection and is tested by the following methods:ESD Human Body Model tested per AEC Q100 002 (EIA/JESD22 A114)ESD Charge Device Model tested per EIA/JES D22/C101, Field Induced Charge Model2.

10 For soldering information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/DTHERMAL CHARACTERISTICSS ymbolRatingValueUnitR JCThermal Characteristics, SSOP36 EPThermal Resistance, Junction to C/WR JAThermal Characteristics, SSOP36 EP, 1 layer PCBT hermal Resistance, Junction to Air (Note 3)42 C/WR JAThermal Characteristics, SSOP36 EP, 4 layer PCBT hermal Resistance, Junction to Air (Note 4) C/W3. Values based on PCB of x mm, 72 m copper thickness, 20 % copper area coverage and FR4 PCB Values based on PCB of x mm, 72 / 36 m copper thickness (signal layers / internal planes), 20 / 90 % copper area coverage(signal layers / internal planes) and FR4 PCB , CHARACTERISTICS V < VCC < V, 8 V < Vs < 18 V, 40 C < TJ < 150 C.