DEK Semiconductor Packaging Technologies

1 ProFlow developed froma concept by Know the +1 847 368 1155 ASIAC hina: +86 755 2759 9188 Singapore: +65 6484 7010 Distributor InformationEUROPEUK: +44 1305 760760 Germany: +49 6101 5227-0 Hungary: +36 96 512 Know the DifferenceDEK Semiconductor Packaging Technologies0302 Lowering the Cost of Advanced Packaging Achieving the most direct connection to silicon miniaturising package dimensions and maximising ICperformance defines the leading edge of chip-scale package design. Assembling chip-scale packages demands accurate and precise back-endprocesses for depositing materials such as solder paste, solder spheres, flux,and adhesives. Precision printing is known to deliver the high levels of control,repeatability and productivity necessary to build today s most advancedpackages and to solve the next challenges now visible on the , as package outlines and interconnect dimensions continue to shrink,the boundaries between back-end package processes and board-level assemblyusing the most advanced surface-mount packages are progressively blurring.

2 Tosecure the most advanced capability and highest productivity, leading tountouchable productivity and the lowest cost per unit when assemblingpackages at wafer and substrate level, it makes sense to choose the technology & process partner with the leading position in precision printing in both thepackaging and assembly markets. DEK SemiconductorPackaging Technologies High accuracy deposition of materials to supportadvanced Semiconductor Packaging processes 200 m balls on 300 m pitchBall Placement ProcessLead Frame04 Move forward with usAt DEK, we have built our reputation as the leading global supplier of pre-placement equipment and solutions for high-speed, high-efficiencyelectronic assembly , supporting theworld s foremost manufacturers for over 40 installed base totals over 14,000 automated in-lineprinters; located across four continents and spanning thesurface-mount technology spectrum from high-volume ultracost-sensitive assembly to precision placement of the latestchip-scale on this capability, our Semiconductor packagingtechnologies are used by leading chipmakers and advancedpackaging specialists to perform processes such as solderball attachment.

3 Achieving six-sigma process capability at thesmallest ball diameter and pitch dimensions in mainstreamuse. In the meantime, our labs are working towards futuregenerations of Packaging requirements; we have alreadydemonstrated solder ball placement at 70 m diameter and150 m solutions for key back-end processes maximise theprinter s value as a true multi-purpose platform, supportingrapid reconfiguration for high-accuracy processes at waferand substrate levels, using a wide range of electronicmaterials. Find out more about DEK s Semiconductor processtechnologies for wafer-level and substrate-level processes onthe following A Wafer Transport Solutionwith enhanced capabilitiesfor thinned wafers. Diameters100mm- 300mm, thickness of 75 mand above Printing Glass Frit For Wafer Level MEMS AssemblyTypical process specifications:150mm and 200mm wafersMaterial deposit height approx 15 mMaterial deposit width approx 150 m 060706 Printing Adhesives, and More, at Wafer LevelThe stable foundation of a world-classscreen printer proves an extremelycost-effective platform for wafer-levelprocesses at the heart of new andemerging Packaging Technologies .

4 Precision Wafer BumpingGrowing use of flip-chip and chip-scale packages in next-generation end products is driving demand for accurate andefficient wafer bumping solutions. DEK is working with leadingpackaging specialists and chipmakers worldwide, delivering andsupporting successful processes based on:DirEKt Ball PlacementSolder paste print and reflowIn-situ mask processes such as Flip Chip International processDirEKt Ball Placement, a breakthrough technology introduced in2000, now has a substantial installed base and is routinely usedin high-volume production to place solder balls from to diameter. And we continue to move forward,developing new processes. Our research and development teamsare demonstrating promising yields when placing 70 m balls on150 m Wafer-Level CoatingsPrinting electronic materials such as adhesives directly onto wafers, beforesingulation, is critical to important emerging packages and device Technologies ,including wafer-level chip-scale packages, MEMS devices, RFID tags and high-power wafer-level applications solve packageassembly challenges across a wide rangeof component Technologies :WLCSP: B-stage epoxy, passivation,e wafer-level underfillsMEMS - Glass frit and adhesivesLow-cost RFID - Printed siliconAdvanced LEDs - PhosphorsWafer-level camera lensesAdvanced Technologies and ProcessesPrecision screen for flux printing200 m ball 300 m pitchBumped wafer via print and reflow processCoate d wafersWafer coating process using Roll Bar SqueegeeCap WaferDevice WaferGlass Frit depositMEMS device-,-,+*),('&%$(-&**,#""!)

5 +,$'$*($$$ DesignerMC ModelAsm Name#( (, RemarkDraft by$)( Date #&'&*$*,,#############! #&'&*$$%$ +# # # # #&*+($, CHIEWRUNTM410L-1000-1(S)LINKING CONVEYOR (3D)02-02-2010chiewru- Job No2007-0545A # # ! " # # #" " # # # 0908 Several advanced options provide the key tosuccessful precision printing at wafer level:Wafer HandlingFully automatic wafer handling, developed in conjunction withCHAD Industries and individually optimised for eachapplication, boosts efficiency in high-volume production. Allwafer sizes and thicknesses are supported. DEK and CHAD combined can offer specific expertise related to handlingthinned wafers for all wafer-level Packaging wafer handling, developed in conjunction withNutek to meet wide-ranging production and budgetrequirements, aids secure and accurate manual loading ofeach Wafer PalletsDEK is a leader in toolinginnovations for precision-machinedvacuum pallets for wafersfrom 100mm to 300mmdiameter, and to thickness, promoteoptimal flatness and parallelism for high yield, highthroughput and minimum can also supply custom pallets for TAIKO DISCO wafers,and your own specific requirements on automated wafer Packaging process featuring CHAD and DEK work cellsNutek conveyer suited for semi-automated wafer handling applicationsPrecision Wafer PalletDedicated Wafer TransportSolutionA specialised transport solution optimised for the specificpurpose of handling all wafers.))))

6 This solution benefits from theresponsive motion control and non-contact stopping systembuilt into our machines for accurate and gentle handling ofyour high-value wafers. A recent process study has showndirect benefits to process capability via the use of this WaferTransport Solution and Precision Wafer Transport SolutionAlignmentDEK s innovative wafer alignmentsolution enables fast, accurate andrepeatable alignment even for wafershaving complex patterns and offeringno truly unique features or fiducialmarkings. Proven alignment capabilityof 2 Cpk @ m with the Galaxyprint platform is ideally suited for allwafer-level bumping Ball PlacementOur unique placement head is the key to successful wafer-level ball placement using solder spheres at the smallest sizes inproduction. The innovative head design ensures safe and secure placement of solder balls, achieving high throughput and highball-yield Bar SqueegeeDEK s Roll Bar Squeegee, customdesigned for wafer-level application ofdie-attach adhesive, is ultra rigid tooutperform conventional squeegeeblades when used with large stencilapertures and wafers up to 300mmdiameter.

7 Shown to deliver processcapability of up to 2 Cpk @ m forwafer-level Bar Sq ueegee10 Final Package AssemblyPrecision print techniques can increaseyour total throughput and reduce costsfor final package assembly , whendepositing materials at the substratelevel for flip-chip and chip-scalepackages, BGAs, and System in Package(SIP) HandlingKey processes can be performed cost-effectively using DEK shigh-accuracy print platforms, where precision deposition isrequired for materials such as solder paste, solder balls, flux,die-attach adhesive, conductive ink, thermal interface material,and sealants for lidded supported by DEK print solutions:Substrate bumping and solder ball placementPassive attach3D printing with solder pasteFluxing for Controlled Collapse Chip Connection (C4)Die-attach adhesive for Window BGA (DRAM) and CSPLid sealThermal Interface Material depositionAward-Winning Virtual Panel ToolingVirtual Panel Tooling unique to DEK interfaces directly with industry-standardcarriers, and is capable of aligning multiple singulated substrates is completed within the cycle time of the standard print process,achieving high throughput in terms of Units Per Hour (UPH).

8 DEK s innovations in handling and tooling, print head designand process-optimised stencil design maximise accuracyand repeatability when processing singulated substrates,strips, or Tooling, taking advantage of theplatform s vision-alignment capabilities, enables automatedsequential processing of singulated parts where ultimateaccuracy is Award-Winning ProFlow The leading enclosed print head technology enables a widevariety of electronic materials to be deposited accurately andpreserved with minimal degradation and wastage over anextended Panel Tooling system11 Building-in DEK Technologies andsolutions to your back-end packagingprocesses connects you to DEK sworld-class support proven in the fast-moving,global surface-mount assemblybusiness, our support model puts theresources you need within easy andimmediate engineers working at our specialised centres of excellence with locations in the Americas, Europe and Asia provide the expertise inprocess, materials and equipment you need to operate at the leading edgeof technology and productivity.

9 Our application support teams offer:Help to optimise your processes or equipmentResources to carry out trials and benchmarking exerciseStreamlining the introduction of a new process, quickly, to yourxxx factory floor At the same time, our development teams are constantly researchingpackage Technologies , to advance our knowledge at the leading edge anddiscover new and better construction techniques and within the industry as Semiconductor Packaging experts, ourengineers regularly present papers at conferences and events, andcontribute comprehensively to define the current state-of-the-art andfuture possibilities. Connect with our extensive support network by discussing with your nearestrepresentative how you can adopt DEK s advanced processes and technologieswithin your back-end assembly to Solutions and Support Local process expertise available direct to our customers1514 Build an Enduring LeadPartner with DEK, the leading developer of precision,automated screen printing for advanced, back-endpackaging processes, at both wafer and final flexibility and configurability of our proven, world-class printing platforms provides the cost-effectivefoundation you need to establish a winning presence inyour addition, our comprehensive range of modular solutions, supporting a broadportfolio of processes for advanced Packaging .

10 Delivers the flexible and future-proofcapabilities you need to continuously adapt and improve your capabilities to meetyour customers requirements going with our stable equipment platforms and precision handling options, ourproven processes give you the assurance that you can meet your immediate andmedium-term the longer term, you can trust our commitment to R&D to deliver the newtechnologies and process knowledge you will need to adopt emerging packagetechnologies quickly and successfully. As package Technologies continue to advance,progressively delivering performance increases as well as eliminating issues relatedto package overheads and shrinking dimensions, DEK can help you achieve best-in-class processes that deliver best-in-class performance with continuous cost down;keeping you at the forefront of your markets and firmly ahead of your discover how DEK Technologies and capabilities can help you boost productivity,contact your nearest DEK representative directly or go to Out More DEK is committed toproviding low costSemiconductor PackagingSolutions for this rapidlyevolving industry