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A 3D packaging technology for stacking semiconductor chips, on which a through silicone via (TSV) is formulated, has been increasingly investigated for its potential as the next generation high-density packaging technique.
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テクニカルレポート - hitachi-chem.co.jp
www.hitachi-chem.co.jp3 第 45 号 2005年7月 テクニカルレポート 巻頭言 わたしの研究の極意 5 山口由岐夫 論 文 リチウムイオン電池負極用バインダ樹脂 7
1 Abstract - hitachi-chem.co.jp
www.hitachi-chem.co.jpHitachi Chemical Technical Report No.58 18 3. Transmission characteristics of AS-400HS Evaluation results of transmission characteristics (transmission loss) of microstrip line of AS-400HS are shown in Figure 2.
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The balanced, reliable, advanced ... - hitachi …
www.hitachi-chem.co.jpGeneral Characteristics Item Condition Unit UL ANSI Multilayer Materials Multilayer Materials Materials For ICT Infrastructure ＊1) Heating Rate: 10℃/min. ＊2) Measured by Triplate-line Resonator ＊3)Cavity Resomator ＊4) 0.1mm ＊5) 0.2mm …
認定状況について - hitachi-chem.co.jp
www.hitachi-chem.co.jpul規格 bs規格・csa規格 電気用品安全法（cmj登録制度） 認定状況について p96 p98 p99 95
第 37 号 平成13年7月 ... - hitachi-chem.co.jp
www.hitachi-chem.co.jp3 第 37 号 平成13年7月 テクニカルレポート 巻頭言 光の風（高分子光部品の時代へ）─────────────────────────────────────────5
60 2017 - hitachi-chem.co.jp
www.hitachi-chem.co.jp日立化成 テクニカルレポート Hitachi Chemical Technical Report 第60号／2017.12 巻頭言 エネルギー事業のグローバル展開 ─ビジネスパートナーの真のニーズを捉える─ 4
High Elastic Modulus, Low CTE ... - hitachi-chem.co.jp
www.hitachi-chem.co.jpCTE is 20% lower in X,Y directions and 50% lower in Z direction than that of our standard FR-4. Elastic modulus is 30% higher than that of our standard
Anti-Fingerprint UV Curable Hard Coatings - …
www.hitachi-chem.co.jp37 Hitachi Chemical Technical Report No.54 Recently, touch panels have been applied to a wide range of consumer products such as car navigation systems, smart phones and tablet PCs, and the market has been expanding year by year.
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www.hitachi-chem.co.jp2 ファンクリル（fancryl）は、日立化成が開発した機能性アクリレート、メタクリレートの商品名です。 fa- a、fa- mの末尾の「a」はアクリレートを、「m」はメタクリレートを示しています。
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