EEPROM Serial 512-Kb I2C - ON Semiconductor

1 Semiconductor Components Industries, LLC, 2015 May, 2018 Rev. 81 Publication Order Number:CAT24C512/DCAT24C512 EEPROM Serial 512-Kb I2 CDescriptionThe CAT24C512 is a EERPOM Serial 512 kb i2c internallyorganized as 65,536 words of 8 bits features a 128 byte page write buffer and supports the Standard(100 kHz), Fast (400 kHz) and Fast Plus (1 MHz) I2C operations can be inhibited by taking the WP pin High (thisprotects the entire memory).External address pins make it possible to address up to eightCAT24C512 devices on the same Chip ECC (Error Correction Code) makes the device suitablefor high reliability Supports Standard, Fast and Fast Plus I2C Protocol V to V Supply Voltage Range 128 Byte Page Write Buffer Hardware Write Protection for Entire Memory Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs(SCL and SDA)

2 Low Power CMOS Technology 1,000,000 Program/Erase Cycles 100 Year Data Retention Industrial and Extended Temperature Range 8 pin, SOIC, TSSOP, 8 pad UDFN and 8 ball WLCSP Packages These Devices are Pb Free, Halogen Free/BFR Free and are RoHSCompliantFigure 1. Functional SymbolSDASCLWPCAT24C512 VCCVSSA2, A1, detailed ordering and shipping information in the packagedimensions section on page 10 of this data INFORMATIONSOIC 8W SUFFIXCASE 751 BDSOIC 8X SUFFIXCASE 751 BETSSOP 8Y SUFFIXCASE 948 ALDevice AddressA0, A1, A2 Serial DataSDAS erial ClockSCLW rite ProtectWPPower SupplyVCCG roundVSSF unctionPin NamePIN FUNCTIONUDFN 8HU5 SUFFIXCASE 517 BUWLCSP 8C8A SUFFIXCASE 567 JLPIN CONFIGURATIONSSDAWPVCCVSSA2A1A01 SCLSOIC (W, X), TSSOP (Y),UDFN (HU5) (Top View)

3 For the location ofPin 1, please consultthe correspondingpackage A1 WLCSP (C8A)(Top View)A2A1A0 SOIC 8 WIDEX SUFFIXCASE 8 (W, X)TSSOP 8 (Y)UDFN 8 (HU5)MARKING DIAGRAMS24512A = Specific Device CodeA= Assembly Location CodeY= Production Year (Last Digit)M= Production Month (1 9, O, N, D)XXX= Last Three Digits of Assembly Lot NumberG= Pb Free Microdot24512 AAYMXXXC9 LALLYMC12 AAYMXXXC12A= Specific Device CodeA= Assembly Location CodeY= Production Year (Last Digit)M= Production Month (1 9, O, N, D)XXX= Last Three Digits of Assembly Lot NumberG= Pb Free MicrodotC9L= Specific Device CodeA= Assembly Location CodeLL= Last Two Digits of Assembly Lot NumberY= Production Year (Last Digit)M= Production Month (1 9, O, N, D)G= Pb Free MicrodotGGGC9A = Specific Device CodeA= Assembly LocationY= Production YearW= Production WeekC9 AAYWWLCSP (C8A) 1.

4 ABSOLUTE MAXIMUM RATINGSP arametersRatingsUnitsStorage Temperature 65 to +150 CVoltage on any Pin with Respect to Ground (Note 1) to + exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be The DC input voltage on any pin should not be lower than V or higher than VCC + V. During transitions, the voltage on any pin mayundershoot to no less than V or overshoot to no more than VCC + V, for periods of less than 20 2.

5 RELIABILITY CHARACTERISTICS (Note 2)SymbolParameterMinUnitsNEND (Notes 3, 4)Endurance1,000,000 Program/Erase CyclesTDRData Retention100 Years2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC Q100and JEDEC test Page Mode, VCC = 5 V, 25 The device uses ECC (Error Correction Code) logic with 6 ECC bits to correct one bit error in 4 data bytes. Therefore, when a single bytehas to be written, 4 bytes (including the ECC bits) are re-programmed. It is recommended to write by multiple of 4 bytes in order to benefitfrom the maximum number of write 3.

6 OPERATING CHARACTERISTICSVCC = V to V, TA = 40 C to +85 C and VCC = V to V, TA = 40 C to +125 C, unless otherwise ConditionsMinMaxUnitsICCRRead CurrentRead, fSCL = 400 kHz/1 MHz1mAICCWW rite CurrentVCC = = CurrentAll I/O Pins at GND or VCCTA = 40 C to +85 C2mATA = 40 C to +125 C5 ILI/O Pin LeakagePin at GND or VCCTA = 40 C to +85 C1mATA = 40 C to +125 C2 VIL1 Input Low V VCC V VCCVVIL2 Input Low V VCC < V VCCVVIH1 Input High V VCC VCCVCC + High V VCC < VCCVCC + Low VoltageVCC V, IOL = Low VoltageVCC < V, IOL = parametric performance is indicated in the Electrical Characteristics for the listed test conditions.

7 Unless otherwise noted. Productperformance may not be indicated by the Electrical Characteristics if operated under different 4. PIN IMPEDANCE CHARACTERISTICS VCC = V to V, TA = 40 C to +85 C and VCC = V to V, TA = 40 C to +125 C, unless otherwise (Note 5)SDA I/O Pin CapacitanceVIN = 0 V8pFCIN (Note 5)Input Capacitance (other pins)VIN = 0 V6pFIWP, IA (Note 6)WP Input Current, Address InputCurrent (A0, A1, A2)VIN < VIH, VCC = V75mAVIN < VIH, VCC = V50 VIN < VIH, VCC = V25 VIN > VIH25. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC Q100and JEDEC test When not driven, the WP, A0, A1, A2 pins are pulled down to GND internally.

8 For improved noise immunity, the internal pull down is relativelystrong; therefore the external driver must be able to supply the pull down current when attempting to drive the input HIGH. To conserve power,as the input level exceeds the trip point of the CMOS input buffer (~ x VCC), the strong pull down reverts to a weak current 5. CHARACTERISTICS (Note 7)VCC = V to V, TA = 40 C to +85 C and VCC = V to V, TA = 40 C to +125 C, unless otherwise = V VFastVCC = V VFast PlusVCC = V VTA = 405C to +855 CUnitsMinMaxMinMaxMinMaxFSCLC lock Frequency1004001,000kHztHD:STASTART Condition Hold Period of SCL Period of SCL :STASTART Condition Setup :DATData In Hold Time000mstSU:DATData In Setup Time25010050nstR (Note 8)SDA and SCL Rise Time1,000300100nstF (Note 8)SDA and SCL Fall Time300300100nstSU.

9 STOSTOP Condition Setup Free Time BetweenSTOP and Low to Data Out Out Hold Time505050nsTi (Note 8)Noise Pulse Filtered at SCLand SDA Inputs505050nstSU:WPWP Setup Time000mstHD:WPWP Hold Cycle Time555mstPU (Notes 8, 9)Power-up to Ready Test conditions according to Test Conditions Tested initially and after a design or process change that affects this tPU is the delay between the time VCC is stable and the device is ready to accept 6. TEST CONDITIONSI nput x VCC to x VCCI nput Rise and Fall Times 50 nsInput Reference x VCC, x VCCO utput Reference x VCCO utput LoadCurrent Source: IL = 3 mA (VCC V); IL = 1 mA (VCC < V).

10 CL = 100 Reset (POR)The CAT24C512 incorporates Power On Reset (POR)circuitry which protects the internal logic against poweringup in the wrong device will power up into Standby mode after VCCexceeds the POR trigger level and will power down intoReset mode when VCC drops below the POR trigger bi directional POR behavior protects the deviceagainst brown out failure, following a temporary loss DescriptionSCL: The Serial Clock input pin accepts the Serial Clocksignal generated by the : The Serial Data I/O pin receives input data andtransmits data stored in EEPROM .