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FDG6342L Integrated Load Switch - ON Semiconductor

2008 Semiconductor Components Industries, , Order Number: FDG6342L /D1 FDG6342L Integrated load SwitchFDG6342 LIntegrated load Switch Features Max rDS(on) = 150m at VGS = , ID = Max rDS(on) = 195m at VGS = , ID = Max rDS(on) = 280m at VGS = , ID = Max rDS(on) = 480m at VGS = , ID = Control MOSFET (Q1) includes Zener protection for ESDruggedness ( >4KV Human body model) High performance trench technology for extremely low rDS(on) Compact industry standard SC70-6 surface mount package RoHS CompliantGeneral DescriptionThis device is particularly suited for compact power management in portable electronic equipment where to 8V input and output current capability are needed. This load Switch integrates a small N-Channel power MOSFET (Q1) that drives a large P-Channel power MOSFET (Q2) in one tiny SC70-6 Power management load switchMOSFET Maximum Ratings TA = 25 C unless otherwise noted Thermal CharacteristicsPackage Marking and Ordering InformationSymbolParameterRatingsUnitsVI NGate to Source Voltage (Q2) 8 VVON/OFFGate to Source Voltage (Q1) to 8 VILoadLoad Current -Continuous (Note 2) -Pulsed (Note 2)6 PDPower Dissipation for Single Operation (Note 1a) (Note 1b) , TSTGO perating and Storage Junction Temperature Range 55 to +150 CR JAThermal Resistance, Junction to Ambient Single operation (Note 1a)350 C/WR JAThermal Resistance, Junction to Ambient Single operation (N)

FDG6342L Integrated Load Switch www.onsemi.com 2 Electrical Characteristics TJ = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics

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Transcription of FDG6342L Integrated Load Switch - ON Semiconductor

1 2008 Semiconductor Components Industries, , Order Number: FDG6342L /D1 FDG6342L Integrated load SwitchFDG6342 LIntegrated load Switch Features Max rDS(on) = 150m at VGS = , ID = Max rDS(on) = 195m at VGS = , ID = Max rDS(on) = 280m at VGS = , ID = Max rDS(on) = 480m at VGS = , ID = Control MOSFET (Q1) includes Zener protection for ESDruggedness ( >4KV Human body model) High performance trench technology for extremely low rDS(on) Compact industry standard SC70-6 surface mount package RoHS CompliantGeneral DescriptionThis device is particularly suited for compact power management in portable electronic equipment where to 8V input and output current capability are needed. This load Switch integrates a small N-Channel power MOSFET (Q1) that drives a large P-Channel power MOSFET (Q2) in one tiny SC70-6 Power management load switchMOSFET Maximum Ratings TA = 25 C unless otherwise noted Thermal CharacteristicsPackage Marking and Ordering InformationSymbolParameterRatingsUnitsVI NGate to Source Voltage (Q2) 8 VVON/OFFGate to Source Voltage (Q1) to 8 VILoadLoad Current -Continuous (Note 2) -Pulsed (Note 2)6 PDPower Dissipation for Single Operation (Note 1a) (Note 1b) , TSTGO perating and Storage Junction Temperature Range 55 to +150 CR JAThermal Resistance, Junction to Ambient Single operation (Note 1a)350 C/WR JAThermal Resistance, Junction to Ambient Single operation (Note 1b)

2 415 Device MarkingDevicePackageReel SizeTape 8mm3000units123 Vin,R1ON/OFFR1,C1 Vout,C1456 Vout,C1R2Q2Q1 VDROPE quivalent CircuitOUTINON/OFFPin 1SC70-6 See Application CircuitFDG6342L Integrated load Characteristics TJ = 25 C unless otherwise notedSymbolParameterTest ConditionsMinTypMaxUnitsOff CharacteristicsBVINVIN Breakdown VoltageID = -250 A, VON/OFF = 0V8 VILoadZero Gate Voltage Drain CurrentVIN = , VON/OFF = 0V 1 AIFLL eakage Current, ForwardVIN = 8V, VON/OFF = 0V10 AIRLL eakage Current, ReverseVIN = 8V, VON/OFF = 0V 10 AOn CharacteristicsVON/OFF(th)Gate Threshold VoltageVIN = VON/OFF, ID = -250 (on)Static Drain to Source On Resistance (Q2)VIN = , ID = 125150m VIN = , ID = 150195 VIN = , ID = = , ID = Drain to Source On Resistance (Q1)VIN = , ID = VIN = , ID = (note 2)Drain-Source Diode CharacteristicsISMaximum Continuous Drain to Source Diode Forward Current to Drain Diode Forward VoltageVON/OFF = 0V, IS = (Note 2) :1. R JA is determined with the device mounted on a 1in2 pad 2 oz copper pad on a x in.

3 Board of FR-4 material. R JC is guaranteed by design while R JA is determined by the user's board design. 2. Pulse Test: Pulse Width < 300 s, Duty cycle < Switch Application circuit External Component Recommendation: For additional in-rush current control, R2 and C1 can be added. For more information, see application note AN1030 INC1Q1 OUTQ2R1R2ON/OFFLOADa. 350 C/W when mounted on a 1 in2 pad of 2 oz copper .b. 415 C/W when mounted ona minimum pad of 2 oz Characteristics TJ = 25 C unless otherwise notedFigure 1. TJ = 125oCTJ = 25oCVIN = = = 300 s, D < 2%-VDROP, (V)-IL, (A)Conduction Voltage Drop Variation with load 2. TJ = 125oCTJ = 25oCVIN = = = 300 s, D < 2%-VDROP, (V)-IL, (A)Conduction Voltage Drop Variation with load 3. Conduction Voltage Drop Variation with load TJ = 125oCTJ = 25oCVIN = = = 300 s, D < 2%-VDROP, (V)-IL, (A)Figure 4. TJ = 125oCTJ = 25oCVIN = = = 300 s, D < 2%-VDROP, (V)-IL, (A) Conduction Voltage Drop Variation with load i g u r e 5.

4 O n - R e s i s t a n c e V a r i a t i o n With Input = = = 300 s, D < 2% TJ = 125oCTJ = 25oCrDS(on), ON-RESISTANGE ( )-VIN, INPUT VOLTAGE (V)Figure 6. = = = 300 s, D < 2% TJ = 125oCTJ = 25oCrDS(on), ON-RESISTANGE ( )-VIN, INPUT VOLTAGE (V)On - R e s i s t a n c e V a r i a t i o n With Input VoltageFDG6342L Integrated load Outline and Pad LayoutPackage drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor s worldwide terms and conditions, specifically the warranty therein, which covers ON Semiconductor products. Integrated load SwitchON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.

5 A listing of ON Semiconductor s product/patentcoverage may be accessed at ON Semiconductor reserves the right to make changes without further notice to any products Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,regardless of any support or applications information provided by ON Semiconductor . Typical parameters which may be provided in ON Semiconductor data sheets and/orspecifications can and do vary in different applications and actual performance may vary over time.

6 All operating parameters, including Typicals must be validated for each customerapplication by customer s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are notdesigned, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classificationin a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorizedapplication, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, andexpenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if suchclaim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part.

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