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MBR2045CT - Switch-mode Power Rectifier

Semiconductor Components Industries, LLC, 2016 July, 2020 Rev. 131 Publication Order Number: MBR2045CT /DSwitch-modePower RectifierMBR2045 CTG,MBRF2045 CTGF eatures and Benefits Low Forward Voltage Low Power Loss / High Efficiency High Surge Capacity 175 C Operating Junction Temperature 20 A Total (10 A Per Diode Leg) These Devices are Pb Free and are RoHS CompliantApplications Power Supply Output Rectification Power Management InstrumentationMechanical Characteristics Case: Epoxy, Molded Epoxy Meets UL 94, V 0 @ in Weight: Grams (Approximately) Finish: All External Surfaces Corrosion Resistant and TerminalLeads are Readily Solderable Lead Temperature for Soldering Purposes:260 C Max. for 10 Seconds ESD Rating:Human Body Model = 3 BMachine Model = BARRIERRECTIFIER20 AMPERES, 45 VOLTS132, 4TO 220 ABCASE 221 ASTYLE 63412 See detailed ordering and shipping information on page 3 ofthis data INFORMATIONTO 220 FULLPAK]CASE 221 DSee general marking information in the device markingsection on page 2 of this data MARKING INFORMATION312 MBR2045 CTG, 220 ABFigure 1.

CASE 221A STYLE 6 3 4 1 2 See detailed ordering and shipping information on page 3 of this data sheet. ORDERING INFORMATION TO−220 FULLPAK CASE 221D See general marking information in the device marking section on page 2 of this data sheet. DEVICE MARKING INFORMATION 3 1 2

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Transcription of MBR2045CT - Switch-mode Power Rectifier

1 Semiconductor Components Industries, LLC, 2016 July, 2020 Rev. 131 Publication Order Number: MBR2045CT /DSwitch-modePower RectifierMBR2045 CTG,MBRF2045 CTGF eatures and Benefits Low Forward Voltage Low Power Loss / High Efficiency High Surge Capacity 175 C Operating Junction Temperature 20 A Total (10 A Per Diode Leg) These Devices are Pb Free and are RoHS CompliantApplications Power Supply Output Rectification Power Management InstrumentationMechanical Characteristics Case: Epoxy, Molded Epoxy Meets UL 94, V 0 @ in Weight: Grams (Approximately) Finish: All External Surfaces Corrosion Resistant and TerminalLeads are Readily Solderable Lead Temperature for Soldering Purposes:260 C Max. for 10 Seconds ESD Rating:Human Body Model = 3 BMachine Model = BARRIERRECTIFIER20 AMPERES, 45 VOLTS132, 4TO 220 ABCASE 221 ASTYLE 63412 See detailed ordering and shipping information on page 3 ofthis data INFORMATIONTO 220 FULLPAK]CASE 221 DSee general marking information in the device markingsection on page 2 of this data MARKING INFORMATION312 MBR2045 CTG, 220 ABFigure 1.

2 Marking DiagramsAYWWMBR2045 CTGAKATO 220 FULLPAKtAYWWB2045 GAKAA= Assembly LocationY= YearWW= Work WeekG= Pb Free PackageAKA= Diode PolarityMAXIMUM RATINGSR atingSymbolValueUnitPeak Repetitive Reverse VoltageWorking Peak Reverse VoltageDC Blocking VoltageVRRMVRWMVR45 VAverage Rectified Forward CurrentPer DevicePer Diode (TC = 165 C)IF(AV)2010 APeak Repetitive Forward Currentper Diode Leg (Square Wave, 20 kHz, TC = 163 C)IFRM20 ANon Repetitive Peak Surge Current(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)IFSM150 APeak Repetitive Reverse Surge Current ( ms, kHz)See Figure Temperature RangeTstg 65 to +175 COperating Junction Temperature (Note 1)TJ 65 to +175 CVoltage Rate of Change (Rated VR)dv/dt10,000V/msStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be The heat generated must be less than the thermal conductivity from Junction to Ambient: dPD/dTJ < 1 CHARACTERISTICSC haracteristicSymbolValueUnitMaximum Thermal Resistance(MBR2045 CTG) Junction to Case Junction to Ambient(MBRF2045 CTG) Junction to Case Junction to C/WMBR2045 CTG, CHARACTERISTICSC haracteristicSymbolMinTypMaxUnitInstanta neous Forward Voltage (Note 2)(iF = 10 A, TJ = 125 C)(iF = 20 A, TJ = 125 C)(iF = 20 A, TJ = 25 C)vF Reverse Current (Note 2)(Rated dc Voltage, TJ = 125 C)(Rated dc Voltage, TJ = 25 C)iR parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted.

3 Productperformance may not be indicated by the Electrical Characteristics if operated under different Pulse Test: Pulse Width = 300 ms, Duty Cycle INFORMATIOND evice Order NumberPackage TypeShipping MBR2045 CTGTO 220(Pb Free)50 Units / RailMBRF2045 CTGTO 220FP(Pb Free)50 Units / RailFigure 1. Typical Forward , INSTANTANEOUS VOLTAGE (VOLTS) , INSTANTANEOUS FORWARD CURRENT (AMPS) = 150 CFigure 2. Maximum Forward , INSTANTANEOUS VOLTAGE (VOLTS) , INSTANTANEOUS FORWARD CURRENT (AMPS) = 150 C25 C125 C25 , , REVERSE VOLTAGE (VOLTS) , REVERSE CURRENT (mA)IR20302510035405045 Figure 3. Typical Reverse CurrentFigure 4. Maximum Reverse CurrentTJ = 150 C125 C100 C75 C25 , REVERSE VOLTAGE (VOLTS) , REVERSE CURRENT (mA)IR20302510035405045TJ = 150 C125 C100 C25 C140TC, CASE TEMPERATURE ( C) , AVERAGE FORWARD CURRENT (AMPS)IF(AV)15015518160165 Figure 5. Maximum Surge CapabilityFigure 6.

4 Current Derating, Case, Per Leg40IF(AV), AVERAGE FORWARD CURRENT (AMPS)16108408, AVERAGE FORWARD Power DISSIPATION (WATTS)PF(AV)12201628243028 Figure 7. Current Derating, Ambient, Per LegFigure 8. Forward Power Dissipation16141262181412dcTJ = 175 CSQUAREWAVEdcSQUAREWAVENUMBER OF CYCLES AT 60 , PEAK HALF-WAVE CURRENT (AMPS) , AMBIENT TEMPERATURE ( C) (AV), AVERAGE FORWARD CURRENT (AMPS) WAVEdcRqJA = 16 C/W(With TO-220 Heat Sink)RqJA = 60 C/W(No Heat Sink)15016182017017518020222426261018142 226 MBR2045 CTG, (t), TRANSIENT THERMAL RESISTANCE(NORMALIZED) , TIME (ms) CYCLE, D = tp/t1 PEAK Power , Ppk, is peak of anequivalent square Power = Ppk RqJL [D + (1 - D) r(t1 + tp) + r(tp) - r(t1)] where:DTJL = the increase in junction temperature above the lead (t) = normalized value of transient thermal resistance at time, t, :r(t1 + tp) = normalized value of transient thermal resistance at time,t1 + tp, 9.

5 Thermal Response for 10. Thermal Response Junction to Ambient for = (t), TRANSIENT THERMAL RESISTANCEt1, TIME (sec)P(pk)t1t2 DUTY CYCLE, D = t1/t2R(t), TRANSIENT THERMAL RESISTANCEF igure 11. Thermal Response Junction to Case for MBRF2045 CTt1, TIME (sec) = (pk)t1t2 DUTY CYCLE, D = t1/t2 MBR2045 CTG, FREQUENCY OPERATIONS ince current flow in a Schottky Rectifier is the result ofmajority carrier conduction, it is not subject to junction di-ode forward and reverse recovery transients due to minoritycarrier injection and stored charge. Satisfactory circuit ana-lysis work may be performed by using a model consistingof an ideal diode in parallel with a variable capacitance.(See Figure 12.)Rectification efficiency measurements show that opera-tion will be satisfactory up to several megahertz. For ex-ample, relative waveform rectification efficiency is ap-proximately 70 percent at MHz, , the ratio of dcpower to RMS Power in the load is at this frequency,whereas perfect rectification would yield for sinewave inputs.

6 However, in contrast to ordinary junction di-odes, the loss in waveform efficiency is not indicative ofpower loss; it is simply a result of reverse current flowthrough the diode capacitance, which lowers the dc kHz12 V100 VCC12 Vdc2N2222 CURRENTAMPLITUDEADJUST0-10 kW+150 V, 10 mF+VR, REVERSE VOLTAGE (VOLTS)10005003000050700C, CAPACITANCE (pF)Figure 12. Typical Capacitance10203020040 Figure 13. Test Circuit for dv/dt and Reverse Surge CurrentTJ = 25 Cf = 1 MHz100600400800900 FULLPAK is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other 220 FULLPAKCASE 221D 03 ISSUE KDATE 27 FEB 2009 STYLE 4:PIN 1. CATHODE2. ANODE3. CATHODESTYLE 1:PIN 1. GATE2. DRAIN3. SOURCESTYLE 2:PIN 1. BASE2. COLLECTOR3. EMITTERSTYLE 3:PIN 1. ANODE2. CATHODE3. 5:PIN 1.

7 CATHODE 2. ANODE 3. GATESTYLE 6:PIN 1. MT 1 2. MT 2 3. GATESEATINGPLANE T UCSJRSCALE 1:1 NOTES:1. DIMENSIONING AND TOLERANCING PER , CONTROLLING DIMENSION: INCH3. 221D-01 THRU 221D-02 OBSOLETE, NEWSTANDARD = Specific Device CodeG= Pb Free PackageA= Assembly LocationY= YearWW= Work WeekxxxxxxGAYWWA= Assembly LocationY= YearWW= Work Weekxxxxxx= Device CodeG= Pb Free PackageAKA= Polarity DesignatorAYWW xxxxxxGAKAB ipolarRectifier B Y GNDLKHAFQ3 ( )YMECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages.

8 ON Semiconductor does not convey any license under its patent rights nor therights of NUMBER:DESCRIPTION:Electronic versions are uncontrolled except when accessed directly from the Document versions are uncontrolled except when stamped CONTROLLED COPY in 1 OF 1TO 220 FULLPAK Semiconductor Components Industries, LLC, , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliatesand/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual listing of onsemi s product/patent coverage may be accessed at onsemi reserves the right to make changes at any time to anyproducts or information herein, without notice. The information herein is provided as is and onsemi makes no warranty, representation or guarantee regarding the accuracy of theinformation, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or useof any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

9 Buyer is responsible for its productsand applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications informationprovided by onsemi. Typical parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance mayvary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. onsemi does not convey any licenseunder any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systemsor any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body.

10 ShouldBuyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any ORDERING INFORMATIONTECHNICAL SUPPORTN orth American Technical Support:Voice Mail: 1 800 282 9855 Toll Free USA/CanadaPhone: 011 421 33 790 2910 LITERATURE FULFILLMENT:Email Requests to: Website: , Middle East and Africa Technical Support:Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative


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