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MBRS140T3 - Surface Mount Schottky Power Rectifier

Semiconductor Components Industries, LLC, 2014 March, 2020 Rev. 131 Publication Order Number: MBRS140T3 /DSurface MountSchottky Power RectifierMBRS140T3G, SBRS8140N,SBRS8140T3 GSchottky Power Rectifiers employ the use of the Schottky Barrierprinciple in a large area metal to silicon Power of the art geometry features epitaxial construction with oxidepassivation and metal overlay contact. Ideally suited for low voltage,high frequency rectification, or as free wheeling and polarityprotection diodes in Surface Mount applications where compact sizeand weight are critical to the Small Compact Surface Mountable Package with J Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction Very Low Forward Voltage Drop( V Max @ A, TJ = 25 C) Excellent Ability to Withstand Reverse Avalanche Energy Transients Guardring for Stress Protection ESD Ratings: Human Body Model = 3B (> 8000 V) Machine Model = C (> 400 V) SBRS8 Prefix for Automotive and Other Applications RequiringUnique Site and Control Change Requirements.

• Case: Epoxy, Molded • Weight: 95 mg (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Cathode Polarity Band Device Package Shipping† ORDERING INFORMATION SMB CASE 403A SCHOTTKY ...

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Transcription of MBRS140T3 - Surface Mount Schottky Power Rectifier

1 Semiconductor Components Industries, LLC, 2014 March, 2020 Rev. 131 Publication Order Number: MBRS140T3 /DSurface MountSchottky Power RectifierMBRS140T3G, SBRS8140N,SBRS8140T3 GSchottky Power Rectifiers employ the use of the Schottky Barrierprinciple in a large area metal to silicon Power of the art geometry features epitaxial construction with oxidepassivation and metal overlay contact. Ideally suited for low voltage,high frequency rectification, or as free wheeling and polarityprotection diodes in Surface Mount applications where compact sizeand weight are critical to the Small Compact Surface Mountable Package with J Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction Very Low Forward Voltage Drop( V Max @ A, TJ = 25 C) Excellent Ability to Withstand Reverse Avalanche Energy Transients Guardring for Stress Protection ESD Ratings: Human Body Model = 3B (> 8000 V) Machine Model = C (> 400 V) SBRS8 Prefix for Automotive and Other Applications RequiringUnique Site and Control Change Requirements.

2 AEC Q101 Qualified and PPAP Capable* These are Pb Free DevicesMechanical Characteristics Case: epoxy , Molded Weight: 95 mg (approximately) Finish: All External Surfaces Corrosion resistant and TerminalLeads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes:260 C Max. for 10 Seconds Cathode Polarity BandDevicePackageShipping ORDERING INFORMATIONSMBCASE 403 ASCHOTTKY AMPERE, 40 VOLTSMARKING DIAGRAMMBRS140T3 GSMB(Pb Free)2,500 / Tape & Reel For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationsBrochure, BRD8011 (Note: Microdot may be in either location)AYWWB14 GGSBRS8140T3G*SMB(Pb Free)2,500 / Tape & Reel**The Assembly Location code (A) is front sideoptional. In cases where the Assembly Location isstamped in the package, the front side assemblycode may be Specific Device CodeA= Assembly Location**Y= YearWW= Work WeekG= Pb Free PacSBRS8140NT3G*SMB(Pb Free)2,500 / Tape & ReelMBRS140T3G, SBRS8140N, RATINGSR atingSymbolValueUnitPeak Repetitive Reverse VoltageWorking Peak Reverse VoltageDC Blocking VoltageVRRMVRWMVR40 VAverage Rectified Forward CurrentTL = 115 CIF(AV) Repetitive Peak Surge Current(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)IFSM40 AOperating Junction TemperatureTJ 65 to +125 CStresses exceeding those listed in the Maximum Ratings table may damage the device.

3 If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be CHARACTERISTICSC haracteristicSymbolValueUnitThermal Resistance Junction to Lead(TL = 25 C)RqJL12 C/WELECTRICAL CHARACTERISTICSC haracteristicSymbolValueUnitMaximum Instantaneous Forward Voltage (Note 1)(iF = A, TJ = 25 C) Instantaneous Reverse Current (Note 1)(Rated dc Voltage, TJ = 25 C)(Rated dc Voltage, TJ = 100 C) parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Productperformance may not be indicated by the Electrical Characteristics if operated under different Pulse Test: Pulse Width = 300 ms, Duty Cycle , INSTANTANEOUS FORWARD CURRENT (AMPS) , INSTANTANEOUS FORWARD VOLTAGE (VOLTS)Figure 1. Typical Forward , INSTANTANEOUS FORWARD CURRENT (AMPS) , MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)Figure 2.

4 Maximum Forward = 125 CTC = 100 CTC = 25 CTC = -40 CTC = -55 CTC = 125 CTC = 100 CTC = 25 CTC = -40 CTC = -55 CMBRS140T3G, SBRS8140N, , REVERSE CURRENT (mA) 4 8 121620 242832 3640VR, REVERSE VOLTAGE (VOLTS)Figure 3. Typical Reverse CurrentTJ = 125 C25 C75 CIF(AV), AVERAGE FORWARD CURRENT (AMPS)8765432105060708090100110120130TC, CASE TEMPERATURE ( C)SQUARE WAVEDCTJ = 125 CPF(AV), AVERAGE Power DISSIPATION (WATTS)5432100123 4 5IF(AV), AVERAGE FORWARD CURRENT (AMPS)20105 DCIPKIAV=SQUAREWAVERATED VOLTAGE APPLIEDRqJC = 12 C/WTJ = 125 CC, CAPACITANCE (pF)16014012010080604020004 8121620242832VR, REVERSE VOLTAGE (VOLTS)36401802004030910 CAPACITANCELOADNOTE: TYPICAL CAPACITANCEAT 0 V = 160 pFFigure 4. Typical CapacitanceFigure 5. Current Derating (Case)Figure 6. Power DissipationSMBCASE 403A 03 ISSUE JDATE 19 JUL 2012 SCALE 1:1 EbDcL1 LAA1 NOTES:1.

5 DIMENSIONING AND TOLERANCING PER ANSI , CONTROLLING DIMENSION: DIMENSION b SHALL BE MEASURED WITHIN DIMENSION = Specific Device CodeA= Assembly LocationY= YearWW= Work WeekG= Pb Free Package(Note: Microdot may be in either location)*This information is generic. Please refer todevice data sheet for actual part Free indicator, G or microdot G ,may or may not be DIAGRAM* mminches SCALE 8:1*For additional information on our Pb Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, FOOTPRINT* REFDL1 HESCALE 1:1 AYWWXXXXXGGPOLARITY INDICATOROPTIONAL AS NEEDEDP olarity BandNon Polarity BandPolarity BandNon Polarity BandMECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor reserves the right to make changes without further notice to any products herein.

6 ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of NUMBER:DESCRIPTION:Electronic versions are uncontrolled except when accessed directly from the Document versions are uncontrolled except when stamped CONTROLLED COPY in 1 OF 1 SMB Semiconductor Components Industries, LLC, , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliatesand/or subsidiaries in the United States and/or other countries.

7 Onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual listing of onsemi s product/patent coverage may be accessed at onsemi reserves the right to make changes at any time to anyproducts or information herein, without notice. The information herein is provided as is and onsemi makes no warranty, representation or guarantee regarding the accuracy of theinformation, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or useof any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its productsand applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications informationprovided by onsemi.

8 Typical parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance mayvary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. onsemi does not convey any licenseunder any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systemsor any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. ShouldBuyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part.

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