MC74HC153A - Dual 4-Input Data …

1 Semiconductor Components Industries, LLC, 2013 May, 2013 Rev. 11 Publication Order Number: MC74HC153A /DMC74HC153 ADual 4-Input DataSelector/MultiplexerHigh Performance Silicon Gate CMOSThe MC74HC153 is identical in pinout to the LS153. The deviceinputs are compatible with standard CMOS outputs; with pullupresistors, they are compatible with LSTTL Address Inputs select one of four data Inputs from eachmultiplexer. Each multiplexer has an active low Strobe control and anoninverting HC153 is similar in function to the HC253, which has 3 Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2 to 6 V Low input Current: 1 mA High Noise Immunity Characteristic of CMOS Devices These are Pb Free DevicesFigure 1. Logic Diagram1654314A079 YaYbD0aSTROBE aADDRESSINPUTSDATA-WORD aINPUTSPIN 16 = VCCPIN 8 = GNDA121011121315 STROBE bD1aD2aD3aD0bDATA-WORD bINPUTSD1bD2bD3 16D SUFFIXCASE 751 BTSSOP 16DT SUFFIXCASE 948F116116HC153 AGAWLYWWHC153 AALYWGG116A= Assembly LocationWL, L= Wafer LotYY, Y= YearWW, W= Work WeekG or G= Pb Free PackageSee detailed ordering and shipping information in the packagedimensions section on page 4 of this data INFORMATION(Note.)

2 Microdot may be in either location)PIN ASSIGNMENT116 FUNCTION TABLED0, D1, D2, and D3 = the level of the respectivedata LD313141516910111254321876 STROBE aD3aA1 GNDD3bA0 STROBE bVCCD2aD1aD0aYaD2bD1bD0bYbMC74HC153 RATINGSS ymbolParameterValueUnitVCCDC Supply Voltage (Referenced to GND) to + input Voltage (Referenced to GND) to VCC + Output Voltage (Referenced to GND) to VCC + input Current, per Pin 20mAIoutDC Output Current, per Pin 25mAICCDC Supply Current, VCC and GND Pins 50mAPDP ower Dissipation in Still AirSOIC PackageTSSOP Package500 TBDmWTstgStorage Temperature 65 to +150 CStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stressratings only. Functional operation above the Recommended Operating Conditions is not exposure to stresses above the Recommended Operating Conditions may affect OPERATING CONDITIONSS ymbolParameterMinMaxUnitVCCDC Supply Voltage (Referenced to GND) , VoutDC input Voltage, Output Voltage (Referenced to GND)0 VCCVTAO perating Temperature, All Package Types 55+125 Ctr, tfInput Rise and Fall TimeVCC = V(Figure 2)VCC = VVCC = V0001000500400nsDC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

3 SymbolParameterTest ConditionsVCCVG uaranteed LimitUnit 55 to25 Cv 85 Cv 125 CVIHM inimum High Level InputVoltageVout = V or VCC V|Iout| v 20 Low Level InputVoltageVout = V or VCC V|Iout| v 20 High Level OutputVoltageVin = VIH or VIL|Iout| v 20 = VIH or VIL|Iout| v mA|Iout| v Low Level OutputVoltageVin = VIH or VIL|Iout| v 20 = VIH or VIL|Iout| v mA|Iout| v input Leakage CurrentVin = VCC or Quiescent SupplyCurrent (per Package)Vin = VCC or GNDIout = 0 device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this high impedance cir-cuit. For proper operation, Vin andVout should be constrained to therange GND v (Vin or Vout) v inputs must always betied to an appropriate logic voltagelevel ( , either GND or VCC).

4 Unused outputs must be left ELECTRICAL CHARACTERISTICS (CL = 50 pF, input tr = tf = 6 ns)SymbolParameterVCCVG uaranteed LimitUnit 55 to25 Cv 85 Cv 125 CtPLH,tPHLM aximum Propagation Delay, input D to Output Y(Figures 2 and 5) ,tPHLM aximum Propagation Delay, input A to Output Y(Figures 3 and 5) ,tPHLM aximum Propagation Delay, Strobe to Output Y(Figures 4 and 5) ,tTHLM aximum Output Transition Time, Any Output(Figures 2 and 5) input Capacitance 101010pFCPDP ower Dissipation Capacitance (Per Multiplexer)Typical @ 25 C, VCC = VpF31 SWITCHING WAVEFORMSF igure 2. Figure 3. trtftPHLtPLHtTHLtTLHSTROBE10%50%VCCGND tftrINPUT DOUTPUT Y10%50%90%10%50%90%tTLHtPLHtPHLtTHLVCCGN DVCCGND50% input AtPLHtPHL50%OUTPUT Y10%50%90%90%OUTPUT Y*Includes all probe and jig capacitanceCL*TEST POINTDEVICEUNDERTESTOUTPUTF igure 4. Figure 5. Test CircuitVALIDVALIDMC74HC153 DESCRIPTIONSDATA INPUTSD0a D3a, D0b D3b (Pins 3, 4, 5, 6, 10, 11, 12, 13) data Inputs.

5 With the outputs enabled, the addressed DataInputs appear at the Y INPUTSA0, A1 (Pins 2, 14)Address Inputs. These inputs address the pair of DataInputs which appear at the corresponding (Pins 1, 15)Active low Strobe. A low level applied to these pinsenables the corresponding , Yb (Pins 7, 9)Noninverting data aINPUTSADDRESSINPUTSF igure 6. Expanded Logic DiagramDATAWORD bINPUTSNONINVERTINGDATAOUTPUTS654314A079 YaYbD0aSTROBE aA11011121315 STROBE bD1aD2aD3aD0bD1bD2bD3b2 ORDERING INFORMATIOND evicePackageShipping MC74HC153 ADGSOIC 16(Pb Free)48 Units / RailMC74HC153 ADR2 GSOIC 16(Pb Free)2500 Tape & ReelMC74HC153 ADTR2 GTSSOP 16*2500 Tape & ReelMC74HC153 ADTGTSSOP 16*96 Units / Tube For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.

6 *This package is inherently Pb 16 CASE 751B 05 ISSUE KDATE 29 DEC 2006 SCALE 1:1 NOTES:1. DIMENSIONING AND TOLERANCING PER , CONTROLLING DIMENSION: DIMENSIONS A AND B DO NOT INCLUDE MAXIMUM MOLD PROTRUSION ( ) PER DIMENSION D DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBAR PROTRUSIONSHALL BE ( ) TOTAL IN EXCESS OF THE DDIMENSION AT MAXIMUM MATERIAL 45_G8 PLP B A ( )BS T DKC16 ( ) 7 0 7 : MILLIMETERS1 PITCHSOLDERING FOOTPRINTSTYLE 1:PIN 2:PIN 3:PIN , DYE # , # , # , # , # , # , # , # , # , # , # , # , # , # , # , #4 STYLE 4:PIN , DYE # , # , # , # , # , # , # , # , # , # , # , # , # , # , # , #1 STYLE 5:PIN , DYE # , # , # , # , # , # , # , # , # , # , # , # , # , # , # , #1 STYLE 6:PIN 7:PIN N DRAIN (OUTPUT) DRAIN (OUTPUT) P DRAIN (OUTPUT) DRAIN (OUTPUT) DRAIN (OUTPUT) P P DRAIN (OUTPUT) DRAIN (OUTPUT) DRAIN (OUTPUT) N DRAIN (OUTPUT) DRAIN (OUTPUT) N CH16898 XMECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor reserves the right to make changes without further notice to any products herein.

7 ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of NUMBER:DESCRIPTION:Electronic versions are uncontrolled except when accessed directly from the Document versions are uncontrolled except when stamped CONTROLLED COPY in 1 OF 1 SOIC 16 Semiconductor Components Industries, LLC, 16 CASE 948F 01 ISSUE BDATE 19 OCT 2006 SCALE 2:1 BSCM0 8 0 8 NOTES:1. DIMENSIONING AND TOLERANCING PERANSI , CONTROLLING DIMENSION: DIMENSION A DOES NOT INCLUDE MOLDFLASH.

8 PROTRUSIONS OR GATE FLASH OR GATE BURRS SHALL NOTEXCEED ( ) PER DIMENSION B DOES NOT INCLUDEINTERLEAD FLASH OR FLASH OR PROTRUSION SHALLNOT EXCEED ( ) PER DIMENSION K DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE ( ) TOTALIN EXCESS OF THE K DIMENSION ATMAXIMUM MATERIAL TERMINAL NUMBERS ARE SHOWN FORREFERENCE DIMENSION A AND B ARE TO BEDETERMINED AT DATUM PLANE W .____SECTION N 118169 DETAIL EJJ1 BCDAKK1HG DETAIL EFML2XL/2 U ( ) ( ) ( ) ( ) T V W ( )16X REFKNN116 GENERICMARKING DIAGRAM*XXXXXXXXALYW116*This information is generic. Please refer todevice data sheet for actual part Free indicator, G or microdot G ,may or may not be Specific Device CodeA= Assembly LocationL= Wafer LotY= YearW= Work WeekG or G= Pb Free : MILLIMETERS1 PITCHSOLDERING FOOTPRINTMECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor reserves the right to make changes without further notice to any products herein.

9 ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of NUMBER:DESCRIPTION:Electronic versions are uncontrolled except when accessed directly from the Document versions are uncontrolled except when stamped CONTROLLED COPY in 1 OF 1 TSSOP 16 Semiconductor Components Industries, LLC, Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.

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